Вебинар 29.01.2015

1. Серверы DEPO Storm 3400 на базе
новейших процессоров Intel® Xeon®
E5-2600v3 в современных решениях
для ИТ-инфраструктуры

2. Регламент вебинара
Основные докладчики:
Сергей Сенько, руководитель направления по серверной продукции компании DEPO Computers
Михаил Опарин, инженер по техническому маркетингу компании Intel
Ответы на вопросы в текстовом режиме (Окно «Q&A»):
Владимир Князькин, инженер по техническому маркетингу компании Intel
Евгений Зенин, менеджер по серверной продукции компании DEPO Computers
Андрей Тюнин, руководитель группы продаж корпоративным заказчикам DEPO Computers
Во время вебинара мы попросим вас ответить на несколько вопросов
В конце вебинара у вас будет возможность скачать в электронном виде материалы по
решениям DEPO Computers и слайды основной презентации
2

3. 3
План и программа вебинара
Вступление
Опрос №1
Детальное ознакомление с новыми возможностями Intel Xeon E5-2600v3 и связанными с ним
технологиями – DDR4, SAS 12Gbit, NVM-E и их преимуществами
Опрос №2
Представление модельного ряда DEPO Storm 3400 в котором полностью реализованы данные
технологии
Обсуждение примеров построения серверной инфраструктуры на новых технологиях для компаний
различного размера (от Cluster-In-A-Box на 100 пользователей, до частного облака на тысячи и 10
тысяч пользователей)
Анонс промо-программ и возможностей по детальному ознакомлению с обсуждаемыми решениями
Опрос №3
Секция вопросов и ответов
Опрос №4

4. Визитная карточка
DEPO Computers
DEPO Computers –
единственная российская вертикально
интегрированная инжиниринговая
компания, совмещающая наличие:
• целостной платформы облачных
сервисов;
• компетенций системного
интегратора;
• научно-исследовательского центра;
• масштабного производства
компьютерной техники;
• сервисной сети во всех регионах РФ
4

5. 5серверы и системы
хранения данных
Собственное производство
промышленные
планшеты
серверные шкафы и мини-
ЦОДы
рабочие станции,
ПК и терминалы
моноблоки
Продукция DEPO Computers
ТОП-5 основных поставщиков серверов РФ
в CY2013, Gartner, % шт
Рейтинг производителей серверов WW
CY2012, шт.

6. Опрос №1
Просим Вас ответить на
несколько вопросов
6

7. www.depo.ru
Михаил Опарин
инженер по техническому маркетингу компании Intel
Детальное ознакомление с новыми
возможностями Intel Xeon E5-2600v3 и
связанными с ним технологиями – DDR4,
SAS 12Gbit, NVM-E и их преимуществами

8. © 2015 Intel Corporation. All rights reserved. Other brands and names are the property of their respective owners.
Intel® Xeon® Processor E5-2600 v3
Product Family update.

9. Agenda
• Intel® Xeon® Processor E5-2600 v3 Product Family
• DDR4 and NVDIMM technologies support
• Intel® NVMe SSDs
• Intel® 12Gb/s RAID Controllers
9

10. Key Differences Between E5-2600 v2 &
E5-2600 v3
Xeon E5-2600 v2
“Ivy Bridge-EP”
Xeon E5-2600 v3
“Haswell-EP”
Core Count Up to 12 Cores Up to 18 Cores
Frequency TDP & Turbo Frequencies
TDP & Turbo Freq
AVX & AVX Turbo Freq
AVX Support
Intel® AVX
8 DP Flops/Clock
Intel® AVX 2
16 DP Flops/Clock
Memory Type
4xDDR3 channels
RDIMM, UDIMM, LRDIMM
4xDDR4 channels
RDIMM, LRDIMM
Memory Frequency
(MHz)
1866 (1DPC), 1600, 1333, 1033
RDIMM: 2133 (1DPC), 1866 (2DPC), 1600
LRDIMM: 2133 (1&2DPC), 1600
QPI Speed Up to 8.0 GT/s Up to 9.6 GT/s
TDP
Up to 130W Server, 150W Workstation
Up to 145W Server, 160W Workstation
Increase due to Integrated Voltage Regulator
Power
Management
Same P-states for all cores
Same core & uncore frequency
Per-core P-states
Independent uncore frequency scaling
Energy Efficient Turbo
10
10

11. Feature Comparison across Intel®
Xeon® Generations
11
Intel® Xeon® Processor X5600
Series (Westmere-EP)
Intel® Xeon® Processor E5-2600
Product Family (Sandy Bridge-EP)
Intel® Xeon® Processor E5-2600 v2
Product Family (Ivy Bridge-EP )
Intel® Xeon® Processor E5-2600 v3
Product Family (Haswell-EP)
Essentials
Launch Date Q1'11 Q1'12 Q3'13 Q3'14
Maximum # of Cores 6 8 12 18
Maximum # of Threads 12 16 24 36
Last Level Cache (LLC) Up to 12 MB Up to 20 MB Up to 30 MB Up to 45 MB
Maximum QPI Bus Speed 6.4 GT/s 8 GT/s 8 GT/s 9.6 GT/s
Instruction Set Extensions SSE4.2 Intel® AVX Intel® AVX Intel® AVX 2
Intel Process Technology 32 nm 32 nm 22 nm 22 nm
Intel® Turbo Boost Technology 1.0 2.0 2.0 2.0
Power Management
Same P-States for All Cores
Fixed Uncore Frequency
Same P-States for All Cores
Same Core and Uncore Frequency
Same P-States for All Cores
Same Core and Uncore Frequency
Per Core P-States
Independent Uncore Frequency Scaling
Memory Specifications
Max Memory Size per Socket 288 GB 384 GB 768 GB 768 GB
Memory Types
DDR3
800/1066/1333
RDIMM/UDIMM
DDR3
800/1066/1333/1600
RDIMM/UDIMMs
Quad Rank LRDIMM
DDR3
800/1066/1333/1600/1866
RDIMM/UDIMM
Quad Rank LRDIMM
DDR4
1600/1866/2133
RDIMM
Quad Rank LRDIMM
# of Memory Channels 3 4 4 4
Max # of DIMMs/Channel 3 3 3 3
Max # of DIMMs/Socket 9 12 12 12
Theoretical Max Memory Bandwidth
per Socket
32 GB/s 51.2 GB/s 59.7 GB/s 68.2 GB/s
Expansion Options
PCI Express Revision 2.0 (in Chipset) 3.0 3.0 3.0
Max # of PCI Express Lanes N/A 40 40 40
PCI Express Configurations N/A x4, x8, x16
x4, x8, x16
x16 Non-Transparent Bridge
x4, x8, x16
x16 Non-Transparent Bridge
All comparisons based on a single socket.

12. Feature Comparison across Intel®
Xeon® Generations
Intel® Xeon® Processor X5600
Series (Westmere-EP)
Intel® Xeon® Processor E5-2600
Product Family (Sandy Bridge-EP)
Intel® Xeon® Processor E5-2600 v2
Product Family (Ivy Bridge-EP )
Intel® Xeon® Processor E5-2600 v3
Product Family (Haswell-EP)
Advanced Technologies
Thermal Monitoring Technologies N/A √ √ √
Intel® Integrated I/O N/A √ √ √
Intel® Data Direct I/O N/A √ √ √
Integrated Voltage Regulator (IVR) N/A N/A N/A √
Intel® Virtualization Technology
Intel® Virtualization Technology (VT-x) √ √ APIC Virtualization
Cache QoS Monitoring
EPT A/D Bits
Intel® Data Protection Technology
Intel® Advanced Encryption Standard
New Instructions (AES-NI)
√ √ √ AVX2 enhancements to AES-NI
Secure Key N/A N/A √ √
Intel® Platform Protection Technology
Intel® Trusted Execution Technology (TXT) √
Greater hypervisor and OS support
Launch control policy enhancements
Greater hypervisor and OS support
Launch control policy enhancements
SMM External Call Trap (SECT)
OS Guard N/A N/A √ √
12

13. Advanced
 25-30 MB LLC cache -
2.5MB/core
 9.6 GT/s QPI
 DDR4-2133
 Intel® Hyper-Threading
 Intel® Turbo boost
Standard
Basic
Segmented Optimized
Frequency Optimized
 ≥2.5MB/core LLC cache – See SKU
 9.6 GT/s QPI
 DDR4-2133
 Intel® Hyper-Threading
 Intel® Turbo boost
 2U cooling
Low Power
 2.5 MB/Core LLC Cache
 E5-2650L v3: 9.6 GT/s QPI
 E5-2630L v3: 8.0 GT/s QPI
 E5-2650L v3: DDR4-2133
 E5-2630L v3: DDR4-1866
 Intel® Hyper-Threading
 Intel® Turbo boost
12C 120W
2.3 GHz
10C 105W
2.3 GHz
12C 120W
2.5 GHz
8C 85W
2.4 GHz
12C 65W
1.8 GHz
8C 55W
1.8 GHz
6C 85W
1.6 GHz
Intel® Xeon® Processor E5-2600 v3
Product Family
SKU Stack
Workstation Only
12C 135W
2.6 GHz
10C 105W
2.6 GHz
10C 2S 160W
3.1 GHz
 35-45 MB LLC cache - 2.5MB/core
 9.6 GT/s QPI
 DDR4-2133
 Intel® Hyper-Threading
 Intel® Turbo boost
14C (1U) 120W
2.3 GHz
14C (2U) 145W
2.6 GHz
14C (1U) 120W
2.0 GHz
E5-2603 v3
E5-2670 v3
E5-2690 v3
E5-2680 v3
E5-2650 v3
E5-2660 v3
8C 90W
2.6 GHz
6C 85W
2.4 GHz
8C (20MB) 135W
3.2 GHz (2U)
6C (20MB) 135W
3.4 GHz (2U)
4C (15MB) 135W
3.5GHz (2U)
6C 85W
1.9 GHz E5-2609 v3
E5-2620 v3
E5-2640 v3
E5-2630 v3
E5-2697 v3
E5-2695 v3
E5-2683 v3
E5-2637 v3
E5-2667 v3
E5-2687W v3
E5-2643 v3
E5-2630Lv3
E5-2650L v3
Legend
Medium Core
Count (MCC)
High Core
Count (HCC)4C (10MB) 105W
3.0GHz (1U) E5-2623 v3
Low Core
Count (LCC)
 10MB LLC cache
 8.0GT/s QPI
 DDR4-1866
 Intel® Hyper-Threading
 Intel® Turbo boost
 1U cooling
 25MB LLC cache
 9.6 GT/s QPI
 DDR4-2133
 Intel® Hyper-Threading
 Intel® Turbo boost
18C (2U) 145W
2.3 GHz
16C (1U) 135W
2.3 GHz
E5-2699 v3
E5-2698 v3
 15 MB LLC cache - 2.5MB/core
 6.4 GT/s QPI
 DDR4-1600
 15-20 MB LLC cache - 2.5MB/core
 8.0 GT/s QPI
 DDR4-1866
 Intel® Hyper-Threading
 Intel® Turbo boost
13

14. E5-2600 v3 (HSW)E5-2600 v2 (IVB)
Up to 44%, 33%
Up to 30%, 26%
Up to 26%, 22%
Up to 20%,18%
Up to 41%, 33%
Up to 24%, 17%
Up to 21%, 20%
Processor Transition Guidance – v2 to v3
Source: Published results on www.spec.org as of Oct. 13, 2014. Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance
tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to
vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other
products. Intel does not control or audit the design or implementation of third party benchmark data or Web sites referenced in this document. Intel encourages all of its customers to visit the referenced Web
sites or others where similar performance benchmark data are reported and confirm whether the referenced benchmark data are accurate and reflect performance of systems available for purchase. For more
information go to http://www.intel.com/performance *Other names and brands may be claimed as the property of others.
942
890
617
415
546
446
682
659
522
387
462
400
775
556
1360
1230
1190
1070
1070
911
860
838
791
774
619
471
12C 130W
2.7GHz E5-2697 v2
12C 115W
2.4GHz E5-2695 v2
14C 120W
2.3 GHz
14C 145W
2.6 GHz
14C 120W
2.0 GHz
E5-2697 v3
E5-2695 v3
E5-2683 v3
18C 145W
2.3 GHz
16C 135W
2.3 GHz
E5-2699 v3
E5-2698 v3
6C 135W
3.4 GHz
4C 135W
3.5GHz E5-2637 v3
E5-2643 v3
4C 105W
3.0GHz E5-2623 v3
8C 135W
3.2 GHz E5-2667 v3
4C 130W
3.5GHz E5-2637 v2
8C 130W
3.3GHz E5-2667 v2
6C 130W
3.5GHz E5-2643 v2
6C 60W
2.4GHz E5-2630L v2
10C 70W
1.7GHz E5-2650L v2
12C 65W
1.8 GHz
8C 55W
1.8 GHz E5-2630L v3
E5-2650L v3
602
IVB-to-HSW %gains on
SIR, SFR
SPECint*_rate
_base2006
score
on IC 14
SPECfp*_rate
_base2006
score
on IC14
780 Up to 4%, 8% 815 653
Up to 8%, 9% 669 571
Up to 10%, 9% 457 422
Up to 1%, 1% 412 378
SIR score
on IC 14
SFR score
on IC 14
SIR score
on IC14
SFR score
on IC14
14

15. Up to 23%, 23%
Up to 24%, 21%
Up to 22%, 24%
Up to 24%, 23%
Up to 34%, 28%
Up to 36%, 31%
Up to 22%, 22%
Up to 22%, 19%
15
871
830
791
722
663
524
489
417
244
181
4C 80W
2.5GHz E5-2609 v2
4C 80W
1.8GHz E5-2603 v2
10C 115W
2.5GHz E5-2670 v2
10C 130W
3.0GHz E5-2690 v2
10C 115W
2.8GHz E5-2680 v2
8C 95W
2.6GHz E5-2650 v2
10C 95W
2.2GHz E5-2660 v2
6C 80W
2.1GHz E5-2620 v2
8C 95W
2.0GHz E5-2640 v2
6C 80W
2.6GHz E5-2630 v2
643
626
607
575
547
451
427
381
258
201
12C 120W
2.3 GHz
10C 105W
2.3 GHz
12C 120W
2.5 GHz
8C 85W
2.4 GHz
6C
85W 1.6 GHz
12C 135W
2.6 GHz
10C 105W
2.6 GHz
E5-2603 v3
E5-2670 v3
E5-2690 v3
E5-2680 v3
E5-2650 v3
E5-2660 v3
8C 90W
2.6 GHz
6C
85W
2.4 GHz
6C 85W
1.9 GHz E5-2609 v3
E5-2620 v3
E5-2640 v3
E5-2630 v3
1080
1030
970
884
824
703
666
509
792
763
754
689
675
578
561
466
Up to 25%, 24% 306 321
Up to 46%, 39% 266 280
IVB-to-HSW %gains
on SIR, SFR
SIR score
on IC14
SFR score
on IC14
SIR score
on IC14
SFR score
on IC14
SPECfp*_rate
_base2006
score
on IC14
SPECint*_rate
_base2006
score
on IC 14
Source: Published results on www.spec.org as of Oct. 13, 2014. Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance
tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to
vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other
products. Intel does not control or audit the design or implementation of third party benchmark data or Web sites referenced in this document. Intel encourages all of its customers to visit the referenced Web
sites or others where similar performance benchmark data are reported and confirm whether the referenced benchmark data are accurate and reflect performance of systems available for purchase. For more
information go to http://www.intel.com/performance *Other names and brands may be claimed as the property of others.
E5-2600 v3 (HSW)E5-2600 v2 (IVB)
Processor Transition Guidance – v2 to v3
15

16. 1.20 1.24 1.28 1.27 1.38 1.42 1.44
1.60 1.60 1.67 1.70
1.91 1.97
2.45
3.02
0
0.5
1
1.5
2
2.5
3
3.5
E5-2697v2
Baseline
SPECmpiM*_
base2007
SPECpower*_
ssj2008+
TPC*-H
SPECfp*_rate_
base2006
SPECint*_rate
_
base2006
SPECompG*_
base2012++
STREAM
(Triad)
VMmark*2.5
SAPSD*
2-Tier
mweb
SPECvirt*_
sc2013
Linpack
memcached*
SPECjbb2013*
MultiJVM
critical-jOPs
SPECjbb2013*
MultiJVM
max-jOPs
RelativePerformance
Intel® Xeon® Processor E5-2699 v3 (18C, 2.3GHz, 145W) vs. Intel® Xeon® Processor E5-2697 v2 (12C, 2.7GHz, 130W)
Intel® Xeon® Processor E5-2600 v3
Product Family
Generational Performance Summary
+Baseline is E5-2660 v2 (10C, 2.2GHz, 95W) ++New configuration is E5-2690 v3 (12C, 2.6GHz, 135W)
Source as of Sept 8 2014, see next slide. Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as
SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You
should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other
products. For more information go to http://www.intel.com/performance Intel does not control or audit the design or implementation of third party benchmark data or Web sites referenced in
this document. Intel encourages all of its customers to visit the referenced Web sites or others where similar performance benchmark data are reported and confirm whether the referenced
benchmark data are accurate and reflect performance of systems available for purchase. *Other names and brands may be claimed as the property of others
16
Intel® Xeon® Processor E5-2699 v3
16

17. Intel® AVX and AVX 2.0 comparison
Simple example of existing vectorized code optimization using AVX 2.0
https://software.intel.com/en-us/articles/how-intel-avx2-improves-performance-on-server-applications
https://software.intel.com/en-us/blogs/2011/06/13/haswell-new-instruction-descriptions-now-available
17

18. TDP and AVX frequencies. Which
workloads will run at what frequency?
2.8
2.7
2.6
2.5
2.4
2.3
2.2
2.1
2.0
1.9 AVX Base Frequency
AVX Max All Core Turbo Frequency
Expected
frequencies for
most AVX
workloadsExpected
frequencies for
workloads with
heavy AVX usage
Frequency range of E5-2699 v3
Expected frequencies for
non-AVX workloads
Base Frequency (Non-AVX)
Max All Core Turbo Frequency (Non-AVX)
Workloads not using Intel AVX 2.0 instructions will continue to operate at or
above the TDP frequency
18

19. Intel® Xeon® Processor E5-2600 v3
Product Family
Snoop Modes
Each mode is configurable through
BIOS settings
 Early Snoop Mode
 Intel’s BIOS default for HSW-EP
 Same mode available on SNB-EP
 Home Snoop Mode
 Same mode available on IVB-EP*
 Cluster on Die Mode
 New mode introduced on HSW-EP
 Memory bandwidth & latency
tradeoffs will vary across the
3 die configurations for each
snoop mode
 Intel recommends exposing
all snoop modes as BIOS
options to the user
*Home Snoop mode is available on IVB-EP but is not the default setting
19

20. Intel® Xeon® Processor E5-2600 v3
Product Family
Snoop Modes Supported in 2S
Configurations
Early Snoop
(Default for HSW-EP)
Home Snoop Cluster on Die
Previously available on E5-2600 (SNB) E5-2600 v2 (IVB)*
New for
E5-2600 v3
Snoop sent by Caching Agent Home Agent
Check Directory Cache,
then Home Agent
Best used for
Latency sensitive
workloads
NUMA workloads that
need max local & remote
bandwidth
Highly NUMA optimized
workloads
Benchmarks
TPC*-E,
TPC*-C
SPECCPU*2006 (speed)
SPECCPU*_rate2006,
SPECjEnterprise*2010,
SPECpower*_ssj2008,
SAP* SD
*Home Snoop mode is available on E5-2600 v2 but is not the default setting
20

21. Cluster on Die (COD) Mode
Cluster0
Cbo
LLC
Cbo
LLC
Sbo
Sbo
Cbo
LLC
Cbo
LLC
Cbo
LLC
Cbo
LLC
Cbo
LLC
Cbo
LLC
Cbo
LLC
Cbo
LLC
Cbo
LLC
Cbo
LLC
Cbo
LLC
Cbo
LLC
HA0
QPI
0/1 IIO
HA1
Cor
e
Cor
e
Cor
e
Cor
e
Cor
e
Cor
e
Cor
e
Cor
e
Cor
e
Cor
e
Cor
e
Cor
e
Cor
e
Cor
e
Cluster1
Cbo
LLC
Cbo
LLC
Cbo
LLC
Cor
e
Cor
e
Cor
e
Cor
e
Cbo
LLC
COD Mode for 18C HSW-EP Supported on 2S HSW-EP SKUs
with 2 Home Agents (10+ cores)
 Targeted at NUMA workloads where
latency is more important than
sharing data across Caching Agents
(Cbo)
 Reduces average LLC hit and local
memory latencies
 HA mostly sees requests from
reduced set of threads which can lead
to higher memory bandwidth
 OS/VMM own NUMA and process
affinity decisions
21

22. Cluster on Die (COD) Mode
Cbo
LLC
Cbo
LLC
Sbo
Sbo
Cbo
LLC
Cbo
LLC
Cbo
LLC
Cbo
LLC
Cbo
LLC
Cbo
LLC
Cbo
LLC
Cbo
LLC
Cbo
LLC
Cbo
LLC
Cbo
LLC
Cbo
LLC
HA0
QPI
0/1
IIO
HA1
Cor
e
Cor
e
Cor
e
Cor
e
Cor
e
Cor
e
Cor
e
Cor
e
Cor
e
Cor
e
Cor
e
Cor
e
Cor
e
Cor
e
COD Mode for 14C HSW-EP
Cluster0
Cluster1
COD Mode for 12C HSW-EP
Cbo
LLC
Cbo
LLC
Sbo
Sbo
Cbo
LLC
Cbo
LLC
Cbo
LLC
Cbo
LLC
Cbo
LLC
Cbo
LLC
Cbo
LLC
Cbo
LLC
Cbo
LLC
HA0
QPI
0/1
IIO
HA1
Core
CoreCore
Core
CoreCore
Core
Core
Core
Core
Core
Cbo
LLC
Core
22

23. New BIOS Features
 Energy Efficient Turbo – Enable/Disable. CPU cores enters Turbo Mode (P0-state) only
when high utilization was detected by PCU.
 Uncore Frequency Scaling – Enable/Disable. Allow the voltage and frequency of Uncore to
programmed intependenly.
 Intel Configurable TDP: Nominal, TDP Level 1, TDP Level 2. Available only on certain SKUs
of Haswell server processors. indicates the number of configurable TDP levels.
 Perfomance P-Limit: Enable/Disable. Allows the Uncore frequency coordination of two
processors to avoid increasing of latency.
 Cluster-on-Die (COD): Enable/Disable. Divides single processor (Cores/Caches/Home
Agents) in two NUMA domains (clusters). OS support required through ACPI SLIT/SRAT tables.
Not supported on SKUs with 4-8 cores.
23

24. © 2015 Intel Corporation. All rights reserved. Other brands and names are the property of their respective owners.
Intel® Xeon® Processor E5-2600 v3.
New memory technologies support.

25. NVDIMM support
NVDIMM is a DDR3/DDR4 based memory module which is designed to preserve
data in the event of the power failure and across power cycles and platform resets.
Main features:
 Can be DDR3 or DDR4 based
 Operated at DDR3/DDR4 speeds
 Persistent to power failures
 Requires processor, chipset and BIOS MRC support
 DDR3 NVDIMM commonly use BBU (but not always)
 DDR4 NVDIMM commonly use Super Capacitor (which can be internal or
external)
 Hybrid module – NVDIMM which has DRAM and NAND flash onboard
25

26. DDR4 support
Main features:
 Low power consumption (work voltage = 1.05-1.2V, different electrical design).
DDR3L operates on 1.35V as minimum.
 Larger memory capacity per DIMM = up to 512 GB (theoretical) / 128 (practical).
DDR3 has 128GB theoretical limit per DIMM.
 Higher throughput (16 internal banks + 284 contacts) (34.1 GB/s for 2133 MHz)
 Lower latency
 Improved RAS (Reliability, availability, serviceability)
26

27. Frequencies & Advantages of DDR4
DIMM frequency shown for RDIMM configurations. Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as
SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should
consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more
information go to http://www.intel.com/performance *Other names and brands may be claimed as the property of others.
1333
1066
800
1866
1600
1066
2133
1866
1600
0
500
1000
1500
2000
2500
1 DIMM/Channel 2 DIMM/Channel 3 DIMM/Channel
DIMMFrequency(MHz)
X5600 Series
DDR3
3 memory channels/socket
E5-2600 v2
DDR3
4 memory channels/socket
E5-2600 v3
DDR4
4 memory channels/socket
DDR4 enables faster memory speeds
at larger memory capacities for Intel® E5 v3
27

28. Intel® Xeon® Processor E5-2600 v3
Product Family
Memory Bandwidth – STREAM (triad)
118.7 118.7 118.3
113.6
90.4 89.6
58
0
20
40
60
80
100
120
140
E5-2699 v3
(18C, 2.3GHz, 145W)
E5-2697 v3
(14C, 2.6GHz, 145W)
E5-2690 v3
(12C, 2.6GHz, 135W)
E5-2660 v3
(10C, 2.6GHz, 105W)
E5-2667 v3
(8C, 3.2GHz, 135W)
E5-2640 v3
(8C, 2.6GHz, 90W)
E5-2609 v3
(6C, 1.9GHz, 85W)
GB/sec
DDR4
2133
2 MC
HS mode
DDR4
2133
1 MC
HS mode
DDR4
1866
1 MC
HS mode DDR4
1600
1 MC
HS mode
Source as of August 2014: Intel internal measurements using Intel® Server System R2208WTTYS with 8x16GB DR-RDIMMs on stream_omp v5.4 with Intel compiler 14.0.3.174 from TR# 3044 for 12-18C,
TR#3028 for E5-266x v3, TR#3029 for 6-8C. Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. You should consult other information
and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more information go to
http://www.intel.com/performance *Other names and brands may be claimed as the property of others.
DDR4-2133
2 memory controllers (MC)
COD mode
28

29. Type
Ranks Per DIMM
and Data Width
DIMM Capacity (GB)
Speed (MT/s); Voltage (V);
Slot Per Channel (SPC) and DIMM Per Channel (DPC)
1 Slot Per Channel 2 Slots Per Channel 3 Slots Per Channel
1DPC 1DPC 2DPC 1DPC 2DPC 3DPC
4Gb 8Gb 1.2V 1.2V 1.2V 1.2V 1.2V 1.2V
RDIMM SRx4 8GB 16GB 2133 2133 1866 2133 1866 1600
RDIMM SRx8 4GB 8GB 2133 2133 1866 2133 1866 1600
RDIMM DRx8 8GB 16GB 2133 2133 1866 2133 1866 1600
RDIMM DRx4 16GB 32GB 2133 2133 1866 2133 1866 1600
LRDIMM QRx4 32GB 64GB 2133 2133 2133 2133 2133 1600
Intel® Xeon® Processor E5-2600 v3 Product
Family. Memory POR
Memory validation results are publicly available
29

30. © 2015 Intel Corporation. All rights reserved. Other brands and names are the property of their respective owners.
Intel® NVMe SSDs.

31. Data Center Storage Trends.
Today’s Data Storage Needs are
Evolving
IT CHALLENGES OPPORTUNITY
Limited IT Budgets
High IOPS per $ and IOPS per
watt vs. Hard Disk Drives
(HDDs) and SATA SSDs
SAN latency from HBAs,
Switches, Networks, and
Controllers restrict storage
performance while CPU
demands increase
Native NVMe*/PCIe* server-
based storage reduces latency,
removing bandwidth restrictions
Transactional data and
virtualization randomizes
workloads
High, consistent IOPS combined
with low latency accelerates
applications
Intel® Solid-State Drive Data Center P3700, P3600, and P3500 Series
Breakthrough Performance, Low Latency, Cost Effective
31

32. Intel® Solid-State Drive (SSD) Data
Center Family for PCIe*
Delivers breakthrough performance optimized
for real-world applications
 Consistently Amazing performance scalability
 Mixed workload optimized
Modernizes data center storage efficiently
utilizing Intel® Xeon® processor systems
 Substantial storage bandwidth increase feeds Xeon®
systems for higher throughput
 Direct connection to Intel® Xeon processors reduces
storage delay
 Reduces BOM cost through elimination of HBA cards
and SAS/SATA* controllers
Comprehensive product family ready for
broad data center deployment
 Intel enabled NVMe* ecosystem based on industry
standards
 Extensive multi-vendor platform validation, compatibility,
and system availability * Other names and brands are property of their respective owners
32

33. Product Feature Comparison.
Intel® Solid-State Drive Data Center
Family for PCIe*
1 Intel® SSD DC P3700 data sheet specification, subject to change 33

34. Intel® Solid-State Drive Data Center
P3700 Series. Consistently Amazing
Consistent, Native PCIe*
Performance
Up to 6X throughput, up to 2X latency reduction vs. SATA1
• 2800/1900 MB/s (Read/Write)
• 460/180K 4K Random Read IOPS
• 250K 4K 70/30 Read/Write Mixed Workload IOPS
• 20/20µs sequential latency (Read/Write)
Stress-Free Protection
Data storage with multiple checkpoints helps protect data
• End-to-end data path protection
• Power loss protection with built in self-test
• 2.5” hot-plug capability
• Uncorrectable Bit Error Rate (UBER): 1 sector per 1017 bits read
• Mean Time Between Failures (MTBF): 2,000,000 hours, 230 yrs
High Endurance
Leading technology provides optimal price performance
• Intel® 20nm MLC NAND with High Endurance Technology
• 10 full capacity drive writes per day over 5 years*
High Capacity
Broad range of capacities in a single volume
• 400/800 GB 1.6/2.0 TB
• 2.5” x 15mm, SFF-8639
• Add-In-Card (AIC) half-height, half-length card
Modernize Your Data Center Storage with Breakthrough Performance
* Other names and brands are property of their respective owners
34

35. Why NVM Express?*
Standardized interface for non-volatile
memory
SAS*
SATA*
Motherboard
SoftwareDriver
• High Performance
 Low latency (no HBA or protocol overhead)
 Full duplex, multiple outstanding requests
• Low System Cost
 Direct attach to CPU eliminates HBA cost
• Power Efficient
 Direct attach to CPU eliminates HBA power
 Link level power management
0
200000
400000
600000
100% Read 70% Read 0% Read
IOPS
4K Random Workloads
PCIe/NVMe SAS 12Gb/s SATA 6Gb/s
NVMe* Provides Six Times the Throughput of 6Gb/s SATA
Results have been simulated and are provided for informational purposes only. Results were derived using simulations run on an architecture simulator or model. Any
difference in system hardware or software design or configuration may affect actual performance.
35

36. Intel® Solid-State Drive Data Center for
NVMe* Enables Cloud Performance and
TCO
Up to 1314 HDDs, 55 chassis
2.6 HDD Racks
= 1 Intel® SSD DC P3700 Series with NVMe
HDD* Intel SSD DC P3700
Series (2TB)
Drives / Units 1314 1
Random IOPS Up to 460k Up to 460k
Power Total 16,000W Total 11W
Cost $634,000 $6,000
Up to 100X in Cost Savings and up to 1400X in Power Savings
Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and
MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results
to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that
product when combined with other products.
36

37. Data Center Endurance Uses.
Intel® Solid-State Drive Data Center
Family for PCIe*
Servers, Storage, and Workstations
• Replacement for IO intensive 15K RPM HDDs
• Direct Server Attach Storage removes HDD/SAN delay
• Storage Tiering – DRAM, SSDs and HDDs
Uses DwPD
HPC
Scientific / Financial
• > Refresh rate of > 1TB per day per drive
High
Embedded
Factory Control systems
• < 100 4k random write text IOs per second1 Low
Medical HD Imaging and Video
• 10.4TB written per day2 High
OLTP Database
B2B (Online Business to Business sales)
• < 1 million 4K IOs per hr3 Low
B2C (Online retail sales)  > 1million 4K IOs per hr Mid
OLAP Database (Big Data Analytics)
Departmental DB
• < 200GB DB with 10GB refresh rate per day per drive
Low
Distributed DB / Warehouse
• < 2TB DB with 200GB refresh rate per day per drive
Mid
Big data / Hadoop
• 1TB or more refresh rate per day per drive
High
Uses DwPD
Virtualization
Virtual desktops (VDI)
• Up to 50 task workers per server with up to 100 average IOPS per desktop user
Low
Virtual Servers
• 15,000 8K Random IOPS per drive per day5
Mid
Large scale virtualization
• 100,000 8k random IOPS per drive per day5
High
Boot / OS
Boot Only  Standard OS 90/10 Read/Write usage Low
Secure OS with volume logging
• 50/50 Read/Write usage
Mid
Unique Workloads
Email
• Users generate less than 1 IOPS per mailbox6
Low
Machine Generated Data  > 2 million 4K IOs per hr Mid
Content Delivery / Web Servers / Web Services
Static web content  1,000,000 hits per day7
Low
On-Demand Streaming media  50/50 Read/Write8 High
• Judged for workloads based on 100% utilization; 0.3 DWpD = 90 – 100% Reads (Read intensive), 3 DWpD = 60 -90% Reads (Mixed Workload), 10DWpD = 0 – 60% Reads (Write intensive)
• Intel is providing estimates of workload sizes only. Subject to change and verification of actual volume of data written. Refer to data sheet endurance specification for maximum level of data writes.
1 calculation for DW/d 1000 txn per second * 4,000 bytes * 86400 seconds per day = 345GB written per day assumes 400GB drive
2 Space specifications for HD imaging and video http://documentation.apple.com/en/finalcutpro/usermanual/index.html#chapter=13%26section=3%26tasks=true
3 calculation for DW/d 1,000,000 txn per hour * 4,000 bytes * 24hours = 96GB written per day assumes 400GB drive
4 Typical desktop client environment averages (full day) 10 to 25 IOPS, power users 25 IOPS and higher http://www.vmware.com/files/pdf/view_storage_considerations.pdf
5 Intel estimated IOPS numbers. Typical implementation would be SSD as a caching tier such as with VMWare VSAN http://www.vmware.com/products/virtual-san/
6 Mail systems require low IOPS and low latencies. SSDs help mail systems because of low latency. Typical installations are capacity and management constrained, up to 10,000 mailboxes, per server.
7 Intel estimates – 90/10 Read/Write workload, a web page hit = a web page element (graphics, style text, or HTML text) at an average size of 10K. 1,000,000 web page hits * 10,000 bytes = 10GB per day
8 media files (i. e. HD Movies) are very large file sizes (20-30GB). On demand streaming systems are very implementation and refresh specific and based on demand needs could be write intensive.
37

38. High-Performance Computing (HPC).
Improve System Utilization
HPC systems: Use parallel processing to run
applications exceptionally fast and reliably
Examples: CAE/CAD, oil and gas exploration, bio-simulation,
weather forecasting, climate research
Server
Node
High Bandwidth Network
Parallel Compute Visualization
Server
Node
Server
Node
Storage Node
Use Intel® Solid-State Drive Data Center
Family for PCIe* in compute nodes to
increase system utilization
• Direct-attach low latencies, full-duplex,
and tight IOPS distribution keep CPUs
busy
• Storage transfers to memory and I/O
devices speed up
Disk Drives
System utilization is bound by storage I/O
when solving exascale problems
Issue
Solution
Intel® Solid-State Drive
Family for PCIe*
38

39. Cloud Computing.
Reduce Impact of Demand Spikes in
Virtual Machines
Cloud computing: Delivery of applications and content
from off-site, hosted, and virtual servers
Examples: Software as a service, platform/infrastructure
as a service, and virtualization of apps
Use Intel® SSD Data Center Family for PCIe* as
primary performance storage
• Direct-attach low latencies, full-duplex, and
tight IOPS distribution means I/O performance
supports VMs
• High throughput keeps pace w today’s high-
performance CPUs and large memories
Intel® SSD DC P3700 Series10 DWPD1 means
endurance is not hindered
Virtualization randomizes guest sequential
workloads. Disk-drive storage doesn’t keep up with
virtual application storage needs.
Space and energy needs limit scalability.
Issue
Solution
VM
VM
VMVM
Intel® SSD DC
P3700, P3600, and
P3500 Series
Proximity Storage
Intel® SSD DC P3700,
P3600, and P3500 Series
Cache SAN
1 Abbreviations: DWPD – Drive Writes Per Day
39

40. Intel® SSD Data Center Family for PCIe*.
Broad Industry Support
Enabling the industry with NVMe* drivers and driver development
Validating with operation systems for compatibility:
*Windows baseline developed in collaboration by Intel, LSI*, IDT*
*VMware initial driver developed by Intel in collaboration with VMware*
*Linux reference driver accepted into the mainline kernel on kernel.org
Haswell CPU platform support
Windows* Windows Server 2012 R2, 2008 R2 x64 Server, Hyper-V, EFI
Vmware* VMware ESXi 5.5
Linux* Red Hat* EL 6.5
BIOS UEFI 2.3.1
Platform Family Market Segment CPU Family
Brickland Expandable E7
Grantley 4S/2S Efficient Performance E5
Denlow Workstation E3
Code names are internal project names used solely as identifiers and are not intended to be used as trademarks or publicly disseminated.’
40

41. 41
Intel® SSD Data Center Family for PCIe*
https://www-ssl.intel.com/content/www/us/en/solid-state-
drives/intel-ssd-dc-family-for-pcie.html

42. © 2015 Intel Corporation. All rights reserved. Other brands and names are the property of their respective owners.
Intel® 12Gb/s RAID Controllers

43. Intel® 12Gb/s RAID Controllers RS3 Product Family
• Significant performance improvement in IOPs for transaction intensive applications
• Significant throughput performance improvement for streaming applications
• SSD optimizations such as FastPath I/O included with Mainstream (ROC-based) products
• Backwards compatible with 3Gb/s and 6Gb/s devices
• Increased IO performance in existing 6Gb infrastructure
• Allows to increase the amount of enclosures in daisy-chain configurations with no
performance loss
• Support of SAS SSDs
More information you can find at http://www.intelraid.com/
Architectural Benefits of Intel12Gb/s SAS Capable RAID based on LSI* SAS3108
• 1.2 GHz dual core 12Gb/s ROC
• 1GB of Low latency DDR3-1866 RAID cache
• 8-lane PCI Express® (PCIe®) 3.0 bus interface
• Up to 8 individual SAS ports operating at 12Gb/s
43

44. Intel® 12Gb/s RAID Controllers RS3 Product Family
**Performance tests and ratings are measured using specific computer systems and/or components and reflect the approximate performance of Intel products as
measured by those tests. Any difference in system hardware or software design or configuration may affect actual performance. Buyers should consult other sources of
information to evaluate the performance of systems or components they are considering purchasing. For more information on performance tests and on the performance
of Intel products, visit http://www.intel.com/performance/resources/limits.htm or call (U.S.) 1-800-628-8686 or 1-916-356-3104
44

45. Intel® RMS3CC080. 40xSAS 2.0 HDDs and 8xSAS 3.0 SSDs
Sequential Read/Write Comparison.
http://www.intelraid.com/files/Performance-12Gbs-SAS-RAID-Controllers-WhitePaper.pdf 45

46. Intel® RMS3CC080. 1xSAS 2.0 15k RPM HDD Common
Enterprise Workloads Testing.
http://www.intelraid.com/files/Performance-12Gbs-SAS-RAID-Controllers-WhitePaper.pdf 46

47. Intel® RMS3CC080. 1xSAS 3.0 SSD Common Enterprise
Workloads Testing.
http://www.intelraid.com/files/Performance-12Gbs-SAS-RAID-Controllers-WhitePaper.pdf 47

48. 48
http://www.intelraid.com/12gb/
Intel® 12Gb/s RAID Controllers RS3 Product Family
http://www.intelraid.com/files/RAID_Q414.pdf

49. Опрос №2
Просим Вас ответить на
несколько вопросов
49

50. www.depo.ru
Сергей Сенько
Руководитель направления по серверной
продукции компании DEPO Computers
Модельный ряд серверов
DEPO Storm 3400 на процессорах
Intel Xeon E5-2600 v3

51. 51
DEPO Storm 3400S1 сервер для
консолидации и виртуализации
Устанавливается 1 или 2 процессора Intel Xeon E5-2600 v3
Материнская плата имеет 2 порта SATA 3.0 (оба c подведённым
питанием для DOM-модулей) с поддержкой RAID 0, 1 и 2 порта
HDmSAS (поддержка SATA) для подключения к бэкплейну
сервера (RAID 0, 1, 5, 10)
Имеется 24 слота под оперативную память DDR4
Максимальный поддерживаемый объём памяти – 3Tb
(24х128Gb LRDIMM; при этом суммарный объём памяти,
поддерживаемый двумя процессорами, составляет 1536Gb)
2 слота PCI-E 3.0 x16 (необходимо использовать 2 процессора)
Видео реализовано на интегрированном ядре (16Mb DDR3,
1600x1200 при 16bbp, 1280x1024 при 32bbp)
Опционально устанавливается привод DVD-RW
Поддержка операционной системы Windows Server 2012 R2
(сравнение версий)
Гарантия на сервер от 1 до 5 лет с возможностью обслуживания
на месте эксплуатации

52. Модельный ряд
Двухпроцессорные серверы для рабочих групп
Серия DEPO Storm 3400 на процессорах
Intel Xeon E5-2600 v3
Процессоры Один или два процессора Intel Xeon E5-2600 v3
Оперативная память От 512 до 768 GB DDR4-2133 ECC REG/16-24 слотов в зависимости от модификации
Форм-фактор Стоечный/1U Стоечный/2U Стоечный/4U Настольный или стоечный/4U
Системная логика
Поддержка SAS3 12Gbs Есть
Слоты расширения 2x PCI-E 3.0 x16
Дисковые отсеки с
горячей заменой
4HDD 3.5" 8HDD 3.5" 24HDD 3.5"
2HDD 2.5”
8HDD 3.5"
8HDD 2.5”
Количество и номинал
блоков питания
2x 700W;1x 600W 2x 740W;1x 740W 2x 920W 2x 920W; 1x 740W
Интегрированный LAN 2 или 4 порта 1GbE в зависимости от модификации
Аналоги DL360pG9 DL380pG9 ML350G9 ML350G9
Функциональные
преимущества
простота модернизации
встроенный модуль управления IPMI и KVMoLan
Большой объем дисковой
подсистемы
Гибкие возможности по
расширению дисками 2.5 и 3.5”
52
DEPO Storm 3400P1 DEPO Storm 3400V2 DEPO Storm 3400G4 DEPO Storm 3400K4

53. Модельный ряд
Двухпроцессорные серверы для рабочих групп
Серия DEPO Storm 3400 на процессорах
Intel Xeon E5-2600 v3
Процессоры Один или два процессора Intel Xeon E5-2600 v3
Оперативная память От 512 до 768 GB DDR4-2133 ECC REG/16-24 слотов в зависимости от модификации
Форм-фактор Стоечный/1U Стоечный/2U Стоечный/3U Стоечный/2U
Системная логика С602
Поддержка SAS3 Есть
Слоты расширения
2x PCI-E 3.0 x16 4x PCI-E 3.0 x8
Дисковые отсеки с
горячей заменой
8HDD 2.5" 16HDD 2.5“ 16HDD 3.5"
2HDD 2.5”
12HDD 3.5“
Количество и
номинал блоков
питания
2x 400W;1x 520W 2x 740W;1x 740W 2x 920W 2x 920; 1x 740W
Интегрированный
LAN
2 или 4 порта 1GbE в зависимости от модификации
Аналоги DL360pG9 DL380pG9 нет аналога DL380pG9
Функциональные
преимущества
простота модернизации
встроенный модуль управления IPMI и KVMoLan
Большой объем дисковой
подсистемы
встроенный модуль
управления IPMI и KVMoLan
DEPO Storm 3400D1 DEPO Storm 3400F2 DEPO Storm 3400C3 DEPO Storm 3400G2
53

54. Модельный ряд серверов
Блейд-серверы
DEPO Storm 5310Q7 для построения больших ферм
виртуализации
Форм фактор шасси Стоечный 7U
Серверы-лезвия
до 10 лезвий DS3400QS (2x Intel® 64-bit Xeon® E5-2600 v3 (до 130W на процессор)
До 512GB DDR4-2133 ECC REG RAM, 6 HDD SAS/SSD 2.5”
Слот расширения PCI-E 3.0, 2 порта 10GbE, 2 порта 1GbE )
Коммутаторы Ethernet
До двух высокоскоростных коммутаторов с поддержкой горячей замены:
 GEM-001 - Layer-2 switch, 10 внешних портов 1Gbit
 GEM-X2S+ -Layer-2 / 3 switch, 2 внешних 1Gb RG45 ports, 3 x 10GB uplink port SFP+
 XEM-X10SM – 10-Gigabit Ethernet L2/L3 коммутатор (14 внешних 10GB SFP+ , 10 внутренних 10Gb
downlink ports)
Система охлаждения 8 охлаждающих корпусных вентиляторов
Блоки питания до 4 блоков питания 3000Вт с поддержкой функций резервирования и "горячей" замены
Особенности KVMoLAN, удаленная инсталляция, единый интерфейс управления
Функциональные преимущества
DEPO
Простота конструкции и удобство обслуживания
54

55. Блейд-сервер DEPO Storm 5310B7
Высокопроизводительный кластер на СPU и GPU
Форм-фактор 7U, до 10 серверов лезвий
Резервирование 10GbE и
IB FDR/QDR коммутаторов и БП
DEPO Storm 4370BQ
4х процессорный сервер
(Intel Xeon E5-4600 v2)
DEPO Storm 3400BP
Cервер 2xIntel Xeon E5-2600 v3
и 2 GPU/Intel Xeon Phi
55
DEPO Storm 3400BQ
2 сервера в одном лезвии
(Intel Xeon E5-2600 v3)

56. Как заказать?
56
Пример: www.depo.ru > Продукция > Продукция DEPO > Серверы > Storm 3000 > DEPO Storm 3400S1

57. Примеры построения серверной
инфраструктуры на новых
технологиях для компаний
различного размера (от Cluster-
In-A-Box на 100 пользователей,
до частного облака на тысячи и
10 тысяч пользователей)

58. Пример решения DEPO «кластер в коробке»
для организаций с размером IT инфраструктуры до 100 пользователей
под управлением Microsoft Windows Server 2012R2
Серверы – 2 сервера DEPO Storm 3350S1 (c cередины февраля DEPO Storm 3400S1)
JBOD – на платформе Интел (c середины февраля DEPO Storage JBOD 63).
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59. Пример решения с применением cерверов
DEPO Storm 3400S1
для построения облака на платформе Microsoft Azure для
инфраструктур от тысячи до 100000 пользователей
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60. 60
Современные варианты серверных и
инфраструктурных решений для ЦОД
различного масштаба
Количество
серверов
1 10010 1000
Изолированный
коридор
Решения OpenRackШкаф с
инфраструктурой
Компактный шкаф
или стойка
Основной тренд: консолидация и виртуализация ресурсов при модернизации ЦОД
Проблема: при консолидации плотность тепловыделения повышается
Задача: обеспечить наиболее эффективный набор серверного и инфраструктурного оборудования
Решение: зависит от размера консолидированной инфраструктуры
Дополнительно, энергоэффективность решения возможно повысить
при применении ПО управления электропитанием.

61. 61
Проектирование, выбор оборудования и ПО
осуществляется после аудита инфраструктуры
и тестирования критических участков
Вся инфраструктура может быть
виртуализирована и предоставляться как
услуга
Управление ЦОД полностью
автоматизировано на программном уровне
Модульный, поэтапный проектный подход
DEPO для создания единого пула ресурсов
всего ЦОД с централизованным управлением

62. Перспективные разработки
DEPO Computers и приглашение
к сотрудничеству
62
DEPO Rack 600 DCI – система изолированный холодный коридор, 3
секции по два шкафа с общей крышей и раздвижной входной дверью в
отсек.
Возможно передавать на тест в реальный ЦОД. Установка –
бесплатно
Четырехпроцессорный сервер масштаба предприятия DEPO Storm
4370E4 – на процессорах Intel Xeon E7-4800 v2 с оперативной памятью
768GB
Предоставляется на удаленное тестирование. Возможна установка
до 6ТБ оперативной памяти
Новая разработка – двухпроцессорный сервер DEPO Storm 3400S1
Virtualization c памятью DDR4 и накопителями NVMe – доступен для
удаленного тестирования
Кластер в коробке из двух DEPO Storm 3350S1 и JBOD Intel – доступен
для удаленного тестирования, так же возможна передача на
тестирование в инфраструктуру заказчика
Просим обращаться к персональным менеджерам для заказа
Количество ограничено

63. Широкий ассортимент продукции
Короткие сроки производства под заказ
Разветвленная транспортная сеть
Доставка по всей территории РФ
Включая труднодоступные регионы
Расширенное сервисное обслуживание
до 24 x 7 на месте эксплуатации
по единым стандартам на всей территории РФ
Разработка оборудования под требования
Проектирование комплексных решений
Выполнение монтажных и пусконаладочных работ
На всей территории РФ
63
Сервис DEPO Computers

64. Специальные предложения
Распродажа модульных серверов и СХД DEPO Storage 4600 – цены снижены до конца
марта, при покупке СХД или модульного сервера диск 2ТБ в подарок.
Акция «Поставка 80% серверных конфигураций за 3 рабочих дня» – до конца февраля.
Акция для участников семинара – при покупке от 100 лицензий Intel Datacenter Manager
- сервер управления в подарок.
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65. Опрос №3
Просим Вас ответить на
несколько вопросов
65

66. Секция вопросов и ответов
Вы можете задать свои
вопросы в чате вебинара
66

67. Опрос №4
Просим Вас ответить на
несколько вопросов
67

68. Спасибо за внимание!