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YOUR PROCESS
PROPERTIES YOU NEED
FOR
PCB LABELS:
PROPERTIES
HIGH TEMPERATURE
RESISTANCE
• Needed for pre-process labeling
RESISTANCE
300˚C (572˚F)
• Needed for pre-process labeling
• Labels need to survive temperatures as high as
ELECTROSTATIC DISCHARGE
A high performance ESD label should INCLUDE:
• ANSI Grade A topcoat
designed to dissipate
a static charge.
• Adhesive with a short
static decay time.
Labels can create a static discharge that
can ruin PCB components.
PROCESSES
INLINE AND BATCH
WASH SYSTEMS
AUTO-APPLY COMPATIBLE
The label topcoat and adhesive
MUST PROTECT AGAINST:
ABRASION CHEMICALS PRESSURE HEAT
Wash processes attack a label in
many different ways.
AUTO-APPLY COMPATIBLE
BARCODING
TRACEABILITY
BENEFITS:
• Data rich • Error correction
• Consistency • Small
• Omnidirectional • Good contrast
Label rigidity designed to lay at
to maximize performance in automation
equipment or applications.
ABRASION CHEMICALS PRESSURE HEAT
flat
TRACEABILITY
• Omnidirectional • Good contrast
BENEFITS:
• Reduce labor
• Reduce material waste
• Improve asset utilization
• Improve reliability
• Reduce rework
• Reduce product recall
• Reduce cost of warranty
• Improve root cause analysis
LABELING VS.
DIRECT PRODUCT MARKING
Labels are the most flexible way to
maintain traceability in manufacturing.
BROUGHT TO YOU BY:
BRADY
Sources:
http://en.wikipedia.org/wiki/Thermal_transfer_printingz
http://encyclopedia2.thefreedictionary.com/Electrostatic+Discharge
http://www.europe.fasson.com/FRE/planets/deposit.nsf/vObjectStore/FINAL%2028582-1_Avery%20Brochure_EN.pdf/$file/FINAL%2028582-1_Avery%20Brochure_EN.pdf
https://www.google.com/search?q=reflow+definition&oq=reflow+definition&aqs=chrome..69i57j0l5.3870j0j4&sourceid=chrome&es_sm=91&ie=UTF-8
LABELING VS.
DIRECT PRODUCT MARKING
Labels are the most flexible way to
maintain traceability in manufacturing.
LABELING:
• Low capital investment
• Cost ef cient
• Easy to read
• No additional cleaning
LASER:
• High capital investment
• Marking errors increase
scrap rate
• Cost efficient

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PCB Labels: Properties you need for your process

  • 1. YOUR PROCESS PROPERTIES YOU NEED FOR PCB LABELS: PROPERTIES HIGH TEMPERATURE RESISTANCE • Needed for pre-process labeling
  • 2. RESISTANCE 300˚C (572˚F) • Needed for pre-process labeling • Labels need to survive temperatures as high as ELECTROSTATIC DISCHARGE A high performance ESD label should INCLUDE: • ANSI Grade A topcoat designed to dissipate a static charge. • Adhesive with a short static decay time. Labels can create a static discharge that can ruin PCB components.
  • 3. PROCESSES INLINE AND BATCH WASH SYSTEMS AUTO-APPLY COMPATIBLE The label topcoat and adhesive MUST PROTECT AGAINST: ABRASION CHEMICALS PRESSURE HEAT Wash processes attack a label in many different ways.
  • 4. AUTO-APPLY COMPATIBLE BARCODING TRACEABILITY BENEFITS: • Data rich • Error correction • Consistency • Small • Omnidirectional • Good contrast Label rigidity designed to lay at to maximize performance in automation equipment or applications. ABRASION CHEMICALS PRESSURE HEAT flat
  • 5. TRACEABILITY • Omnidirectional • Good contrast BENEFITS: • Reduce labor • Reduce material waste • Improve asset utilization • Improve reliability • Reduce rework • Reduce product recall • Reduce cost of warranty • Improve root cause analysis LABELING VS. DIRECT PRODUCT MARKING Labels are the most flexible way to maintain traceability in manufacturing.
  • 6. BROUGHT TO YOU BY: BRADY Sources: http://en.wikipedia.org/wiki/Thermal_transfer_printingz http://encyclopedia2.thefreedictionary.com/Electrostatic+Discharge http://www.europe.fasson.com/FRE/planets/deposit.nsf/vObjectStore/FINAL%2028582-1_Avery%20Brochure_EN.pdf/$file/FINAL%2028582-1_Avery%20Brochure_EN.pdf https://www.google.com/search?q=reflow+definition&oq=reflow+definition&aqs=chrome..69i57j0l5.3870j0j4&sourceid=chrome&es_sm=91&ie=UTF-8 LABELING VS. DIRECT PRODUCT MARKING Labels are the most flexible way to maintain traceability in manufacturing. LABELING: • Low capital investment • Cost ef cient • Easy to read • No additional cleaning LASER: • High capital investment • Marking errors increase scrap rate • Cost efficient