1. What is a Smartphone?
Mokwon University
Yong Heui CHO(조용희)
yhcho@mu.ac.kr

2. Definition
 Smartphone
 Mobile phone + computer + sensors +
wireless I/O
 Mobile OS: speed vs. battery life
2
←inbritech.com

3. Computer of Tomorrow
3
Devoid of CPU and memory

4. Smartphone HW: AP
 Application Platform Chip
 AP: Application Processor
 Flash memory
 Mobile Dynamic RAM
 PMU: Power Management Unit
 Audio Codec
 Bluetooth
 WiFi
4

5.  Connectivity Platform Chip
 CPU: Central Processing Unit
 DSP: Digital Signal Processing
 RF baseband processing
 Voice processing
 PA: Power Amplifier
 Tx-Rx switch
 DAC + ADC
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Smartphone HW: CP

6.  UMTS/HSDPA/HSUPA
 850, 900, 1900, 2100 MHz
 GSM/EDGE
 850, 900, 1800, 1900 MHz
 CDMA EV-DO Rev. A
 800, 1900 MHz
World Phone Capability
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-UMTS: Universal Mobile Telecommunications System
-HSDPA: High Speed Downlink Packet Access
-GSM: Global System for Mobile communication
-EDGE: Enhanced Data rates for GSM Evolution
-EV-DO: Evolution-Data Optimized

7. Openmoko Project
 Open source mobile phone project
7
UART: Universal Asynchronous Rx/Tx
SDIO: Secure Digital I/O
GPIO: General Purpose I/O
I2C: Inter-Integrated Circuit

8. Apple iPhone 4S
8 ←techrepublic.com
 Apple released iPhone 4S in Oct. 2011.
 A5: powerful and faster than A4
 Twin antenna: diversity

9. Breakdown of iPhone 4S
9
EMI Shield
←ifixit.com
Without battery
Mother-Board

10. Li-ion Battery
 3.7 [V]: used for bias of active
devices (amplifiers, mixers, …)
 This voltage should be small to
consume smaller power (P = I x V)
 5.3 [Whr]: unit for energy (W x hour)
10

11. A5 Processor
 1 GHz, 500 MB RAM
 Designed by Apple (licensed from
ARM) and manufactured by Samsung
11
Chip R,L,C
Instruction Data
NEON: Multimedia

12. Power Amplifier
 PA: transmitting the RF power into air
 Heat sink is needed. Look at the metal
part below.
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Avaga PA: 2G and 3G
Skyworks PA: GSM, EDGE, WCDMA

13. Mother-Board
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Qualcomm Multi-Band RF Transceiver
TriQuint SAW (Surface Acoustic Wave) BPF
TriQuint WCDMA/HSUPA PA-Duplexer

14. Samsung Galaxy S III
14 ←techrepublic.com
 Samsung released Galaxy S III in May 2012.
 Quad-core A9 processor

15. Breakdown of Galaxy S III
15

16. Li-ion Battery
 3.8 [V]: used for bias of active devices
(amplifiers, mixers, …)
 This voltage should be small to consume
smaller power (P = I x V)
 2,100 [mAh]: unit for energy (W x hour)
16

17. A9 Processor
 1.4 GHz, 2 GB RAM
 Designed by Samsung (licensed from
ARM) and manufactured by Samsung
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NEON: Multimedia

18. Jack, Speaker, GPS Antenna
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19. 2 GB Mobile DRAM
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20. PMIC
 Qualcomm Power Management IC
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21. RF Transceiver
 Qualcomm multiband/mode RF
transceiver
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22. Quad-Band PA
 TriQuint GSM/GPRS/EDGE power
amplifier
22
LTE PA