Power GaN 2018: Epitaxy, Devices, Applications and Technology Trends report by Yole Développement

From Technologies to Market
GaN Power 2018:
Epitaxy, Devices,
Applications and
TechnologyTrends
From Technologies to Market
November 2018
Sample

2
Biographies & contacts
Dr. AnaVillamor
Dr Ana Villamor serves as a Technology & Market Analyst | Power Electronics at Yole Développement. She is involved in many custom
studies and reports focused on emerging power electronics technologies, including device technology and reliability analysis. Previously Ana
was involved in a high-added value collaboration related to of SJ Power MOSFETs, within the CNM research center for the leading power
electronic company ON Semiconductor. During this partnership, and after two years as Silicon Development Engineer, she acquired
relevant technical expertise and a deep knowledge of the power electronic industry. Ana is author and coauthor of several papers as well
as a patent. She holds an Electronics Engineering degree completed by a Master in Micro and Nano electronics, both from UAB (SP).
Email: villamor@yole.fr
Dr. Ezgi Dogmus
Dr. Ezgi Dogmus is Technology & Market Analyst at Power & Wireless division at Yole, contributing to the development of compound
semiconductor activities with a dedicated collection of market & technology reports as well as custom consulting projects. Prior Yole, Ezgi
was deeply involved in the development of GaN-based solutions at IEMN (Lille, France). Ezgi also participated in numerous international
conferences and has authored or co-authored more than 12 papers. Upon graduating from University of Augsburg (Germany) and
Grenoble Institute of Technology (France), Ezgi received her PhD in Microelectronics at IEMN (France).
Email: dogmus@yole.fr
Dr. Hong LIN
Dr. Hong Lin has worked at Yole Développement as a technology and market analyst since 2013, specializing in compound semiconductors
and providing technical and economic analysis. Before joining Yole Développement, she worked as an R&D Engineer at Newstep
Technologies, overseeing the development of cold cathodes made by plasma-enhanced chemical vapor deposition for visible and UV lamp
applications based on nanotechnology. She holds a PhD in physics and chemistry of materials.
Email: lin@yole.fr
GaN Power 2018: Epitaxy, Devices, Applications and Technology Trends | Sample | www.yole.fr | ©2018

3
TABLE OF CONTENTS
What is in this report? 4
What is new? 5
What we saw, what we missed? 6
Executive summary
News
7
45
Overview of WBG power devices 49
Replacing Si MOSFET by GaN HEMT 57
GaN power device market by application 65
• Power supply 71
• Server and data center 87
• EV/HEV 99
• PV and energy storage 110
• UPS 121
• Wireless power 129
• Envelope tracking 146
• LiDAR 152
• Other applications 163
• Power GaN market by application and
by device type (Discrete vs IC)
172
Market shares and discussion 185
GaN-on-Si Power device technology 194
• GaN-on-Si power technology,
(transistor vs diodes)
196
• GaN-on-GaN, technology and market 212
• Packaging & integration 223
• GaN reliability status 239
• GaN-on-Si epitaxy 248
• Commercial GaN power devices 268
GaN power industry landscape 277
GaN cost structure 297
Discussion on power electronics 305
Conclusions 311

4
WHAT IS IN THIS REPORT?
• GaN penetration in different applications (power supply, PV, EV/HEV, UPS, LiDAR, wireless power,
envelope tracking, etc.).
• Discussion regarding GaN power market dynamics, forecasts, possible scenarios
• Market projection (application split, low-voltage/high-voltage GaN split, Discrete/Power IC split) for
GaN power devices through 2023
• Market projection for the GaN epitaxy market through 2023
• Description of the GaN technology, designs, topologies, etc.
• Packaging and integration roadmaps
• Reliability status in Power GaN
• State-of-the-art GaN power devices, including product charts, R&D and commercial products
• Description of the GaN power industrial landscape, from epitaxy and device design to device
processing.
• Cost analysis for Power GaN products

5
COMPANIES CITED IN THIS REPORT
Aixtron,Allos,Alpha&Omega,Amec,Amkor,Apple,ASE,AT&S, BMW, Coorstek, Delta electronics, Dialog Semiconductors, Dowa,
Efficient Power Conversion, Egtronics, EpiGaN, Episil, Epistar, Evatran, Exagan, Fairchild, Finsix, Ford, Fuji Electric, GaN Systems,
GaN Power, Imec, Infineon, IQE, LG electronics, Jedec, Kyma, Navitas Semiconductors, Neditek, Nexgen, Nordic Power
Converters, NXP, On Semiconductor, Panasonic, Philos, Powerex, Power Integrations, Qualcomm, Samsung, Sanken, SAS, Sharp,
Siltronic, STMicroelectronics, Sumco, Sumitomo SEI,Tagore Technology,Toshiba,Toyota,Tesla,Texas Instruments,TSMC,
Transphorm,Veeco,Velodyne,VisIC Technologies, Xfab,Yaskawa, and more.

6
WHY USE WBG IN POWER?
WBG power
devices allow
loss reduction,
and/or size
and weight
reduction
Wider bandgap than
silicon, allowing higher
breakdown electric field
Higher electron
velocity than silicon
Low RDS(ON)
System size and
weight reduction
Fast switching
Intrinsic
properties
Device
performance
System
benefits
High current
density
Reduction of
conduction and
switching loss
High temperature
operation
Yole Développement - 2018

7
GLOBAL POWER ELECTRONICS MARKET, INCLUDING POWER IC
Si, SiC, GaN: 2017-2023
Power Management
Integration
Discrete
Packaging
Module
BCD
Efficiency / Reliability
GaN
Diodes, MOSFET, IGBT IGBT
Generally speaking, bigger markets,
very simplified version
SiC
Si
SiC
Power
PMIC, BMIC,Voltage
regulator, Gate driver,
Voltage switching, etc.
GaN

8
FUTURE MARKET DEVELOPMENT
In terms of voltage
High voltage
600–700V
Low voltage
0–100V
High–endLow–end
SiC
Super
Junction
Planar
GaN
GaN
Trench
Lateral
Advanced
Trench
High voltage
600–700V
Low voltage
0–100V
High–endLow–end
Super
Junction
Planar
Trench
Lateral
Advanced
Trench
GaN SiC
GaN
5 years
2018 2023

9
MARKET DEVELOPMENT:TIMELINE DISCUSSION
Different scenarios
Market
discussion

10
HIGH FREQUENCY POWER SUPPLY
There are
different start-
ups working
on high
frequency
power supply.
FINsix® was founded by a team of MIT graduate students
in 2010 to develop high frequency (30 MHz -300 MHz)
power supply. Dart laptop adapter was their first product
based on VHF power technology (Q2 2015). In May
2018, the company announced its partnership with
Toyota Industries Corporation (TICO) to develop a new
generation of highly miniaturized power electronics
modules for hybrid vehicles. The first prototype will
come in 2019. The company has 20 issued and pending
patents.
In 2015, Avogy released the laptop charger Zolt
using SiC devices. The company is rebranded as
NexGen. Its resonant circuit topologies and
control circuits are designed to achieve loss-less
switching by fully exploiting the benefits of GaN
technology.

11
LED DRIVERS
Power requirement per applications
Power (W)
< 25W
60W
• Tubes
• Light bulb
• Automotive headlight
• Smart bulb
>100W
• Outdoors
• Ceiling light
• Flat light
• Down light
• Troffers
• Street light
• Flood light
• Industrial lightning
Classification
of LED
Drivers by
power output

12
GaN FOR PV INVERTER
PV inverter voltage trends and their impact on GaN device potential
GaN devices
have been
developed mainly
for the voltage
range <900V,
typically 650V
and lower.
This may
significantly
restrain the GaN
potential for
future PV
inverters.
The input voltage for different inverter types and the voltage trends
Yole Développement
Microinverter String inverter Central inverter
48V
62V
600V
1,000V
1,500V
600V
1,000V
1,500V
Max. input
voltage: 1,500V
1,000V 1,500V
1,500V

13
SERVER AND DATA CENTER
48V to load (2/2)
GaN could
assume a
greater role
in the
transition
towards
48V data
centers
GaN-based solution
without intermediate
bus architecture
• Today’s servers generally use 12V power supplies that are stuck at
efficiency levels of around 84%.
• Google is calling for 48V motherboards to cut waste power in
data-center servers.
• 48V parts have been used by telecom systems for many years,
providing an ecosystem that servers can tap. Several companies,
includingVicor and STMicroelectronics, have proposed 48V-based
solutions for data centers.
Si-based solution
today, with
intermediate bus
architecture:
85% efficiency
Typical data-center power flow
90% efficiency, Pd=80W/in3

14
TECHNOLOGY TRENDS

15GaN Power 2018: Epitaxy, Devices, Applications and Technology Trends | Sample | www.yole.fr | ©2018
POWER GaN INDUSTRY
Integration roadmap
Integration
System in Package
E-mode GaN transistor
Discrete
D-mode GaN transistor
System on Chip
Others may follow…
* Non-exhaustive list of companies
** R&D, Sampling and commercial devices

16
0
10
20
30
40
50
60
70
80
90
100
0 200 400 600 800 1000 1200
Ids(A)
Vds (V)
GaN products I-V by Player
EPC
Transphorm
Panasonic
GaN Systems
ON Semiconductor
TI
Sanken
VisIC
COMMERCIAL GaN POWER DEVICES
Existing GaN HEMT I-V values for different GaN players
While
most
players are
working in
the 600V -
650V
range, EPC
is highly
focused on
low-voltage
GaN
devices
Yole Développement 2018
Production
+
R&D
Find more in the full report version

17
POWER GaN INDUSTRY OVERVIEW 2018
* Non-exhaustive list, including R&D
Note:The area in the figure is not representative
of the size of the applicative market.

18
RELATED REPORTS
Power Module Packaging: Material Market and Technology Trends | Sample | www.yole.fr | ©2018

Today, it is crystal-clear that, from theoretical point
of view, GaN offers fantastic technical advantages
over traditional Si MOSFETs. Even though the
current GaN power market remains tiny compared
to $32.8B silicon power market, GaN devices are
penetrating confidently into different applications:
for example, LiDAR applications, which are high-
end solutions that take full benefit of high-frequency
switching in GaN power devices. The accumulation
of the market growth in this application and
other various applicative markets confirms a first
scenario in which the GaN market is expected to
grow steadily (base scenario).
However, this is not the only possibility. Is there
any killer application that could cause the GaN
power device market to explode?
As matter of fact, several industrial players confirm
that Apple is interested in GaN technology for its
wireless charging solution. It goes without saying
that the potential adoption of GaN by Apple or
another smartphone giant would completely
change the market’s dynamics and finally provide
a breath of life to the GaN power device industry.
We imagine that after a company like Apple
adopts GaN, numerous other companies would
follow on the commercial electronics market.
Indeed, the biggest segment in the power GaN
market is still power supply applications, i.e. fast
charging for cellphones. In fact, this year Navitas
and Exagan introduced 45W fast-charging power
adaptors with an integrated GaN solution.
And what about the EV market, where SiC
is replacing Si IGBTs in main inverters? What
is GaN’s role here? Various players, such as
EPC and Transphorm, have already obtained
automotive qualification in preparation for GaN’s
potential ramp-up. Moreover, BMW i Ventures’s
investment in GaN Systems clearly demonstrates
the auto industry’s interest in GaN solutions for
EV/HEV technology.
Globally, Yole Développement’s (Yole) second
scenario (bull scenario), which is more aggressive,
projects that the GaN power business will reach
around $423M by 2023, with a compound annual
growth rate (CAGR) of 93%.
This report conveys Yole’s understanding of GaN
implementation in different market segments, with
two possible scenarios. Our report also delivers
comprehensive market projections for GaN power
discrete and the IC device market, and conveys our
understanding of the market’s current dynamics and
future evolution.
POWER GAN 2018: EPITAXY, DEVICES, APPLICATIONS
AND TECHNOLOGY TRENDS
Market & Technology report - November 2018
THE GAN POWER DEVICE MARKET FACES TWO POSSIBLE SCENARIOS:
WHICH APPLICATION WILL CAUSE THE MARKET TO EXPLODE?
GaN market growth is fed by LiDAR, wireless charging and fast charging solutions.
KEY FEATURES
• In-depth analysis of GaN’s
penetration in different
applications, including power
supplies, PV, EV/HEV, UPS, LiDAR,
and wireless power
• State-of-the-art GaN power
devices review, including product
charts and device descriptions
• Description of the GaN power
industrial landscape, from epitaxy
and device design to device
processing
• Discussion of GaN power market
dynamics
• State-of-the-art developments
for power GaN packaging and
integration
• GaN reliability overview
• Market projection for GaN epitaxy
through 2023, by value and volume
WHAT’S NEW
• Updated market segmentation
from Yole Développement
• Comprehensive analysis of the
power supply segment, including
GaN power supplies for data
center applications
• LED-driver market segment
• Device segmentation, by discrete
and power IC
• Discussion on GaN diode
technology and its market potential
• Review of GaN-on-GaN for power
electronics
• Technological analysis and impact
on the value chain
• Integration roadmap
• Cost analysis
(Yole Développement, November 2018)
Market(M$)
Bull case scenario #1
2018
Fast
charger
2023
Wireless
charging
EV/HEV
Data centers
400
100
++
+++
LiDAR
+++
Base case scenario #2
300
200
500
++ Moderate penetration
+++ Big penetration
EV/HEV
EV/HEV
Power Supply
Power Supply
Server and
Data Center
Server and
Data Center
LiDAR
LiDAR
Wirless
Power
GaN for power electronics application:
evolution of the market with two scenarios

POWER GAN 2018: EPITAXY, DEVICES, APPLICATIONS AND TECHNOLOGY TRENDS
IS GAN A COST-EFFECTIVE SOLUTION?
The integration of GaN solutions in a final electronics
product is a very attractive idea: if properly designed,
it will increase system efficiency, and passive
components will be smaller because the system can
work at higher frequencies. These are significant
advantages for the final user…but is that true?
Cost is one of the key aspects to take into account
when introducing a new technology to the market,
and it is currently not one of GaN’s strong points.
GaN’s principal competitor is silicon MOSFET, which
has been on the market for many years and offers
very competitive cost with high average efficiencies,
excellent quality, and superb reliability. Currently,
only one company, EPC claims to be at the same
price level as silicon with its low-voltage wafer-
level package products. However, when standard
Eight years have passed since the first release of
commercial power GaN devices. People in the power
industry are becoming increasingly familiar with
the names of start-ups that are actively promoting
GaN technology. Not surprisingly, the list of pure
GaN start-up players is getting longer: Efficient
Power Conversion (EPC), GaN System, Transphorm,
Navitas, and more are coming, according to Yole’s
intelligence. Most of these start-up players choose
the foundry model, mostly using TSMC, Episil, or
X-fab as their preferred partner. Meanwhile, other
foundries might offer this service if the market
takes off. The foundry model affords fabless or fab-
lite start-ups the possibility of ramping up quickly if
the market suddenly takes off, as discussed in the
previous section.
It is fascinating to see that along with these start-
up players, companies with very different profiles
are competing in the same playground: industrial
giants like Infineon, On Semi, STMicroelectronics,
Panasonic, and Texas Instruments. Several news
items caught our attention in 2018:
• Infineon announced it would start volume
production for CoolGaN 400V and 600V e-mode
HEMT products by the end of 2018
• STMicroelectronics and CEA Leti announced their
cooperation in developing GaN -on-Si technologies
for both diode and transistor on Leti's 200mm
RD line, and expect to have validated engineering
samples in 2019. In parallel, STMicroelectronics will
create a fully qualified manufacturing line, including
GaN-on-Si hetero-epitaxy, for initial production
running in the company’s front-end wafer fab in
Tours, France, by 2020.
These IDMs will leverage their vertically integrated
structure and bring to market cost-competitive
products.
This report furnishes an overview of the GaN power
industry playground, covering the value chain from epitaxy
and device design, to device processing. Also outlined is
Yole’s understanding of the market’s current dynamics
and future evolution.
Power GaN industry – Integration roadmap*
WHAT IS POWER GAN’S SUPPLY CHAIN STATUS?
E-mode GaN transistor
D-mode GaN transistor
Others may follow…
*RD, Sampling and commercial devices
** Non-exhaustive list of companies
Integration
System in Package
Discrete
System on Chip
Power GaN industry overview* 2018
* Non-exhaustive list, including RD
Note: The area in the figure is not representative
of the size of the applicative market.
Designer is needed Si substrate suppliers
GaN-on-Si epiwafer suppliers
GaN power foundries:
epi + device fabrication
Device design +
manufacturing
GaN epi
Fabless
(also Epi design in some cases)
players: Device design
Pure foundries: Device
processing
Manufacturers: Device design
+ device processing (without epi)
IDM: Device design + epi
+ device fabrication

MARKET TECHNOLOGY REPORT
COMPANIES CITED IN THE REPORT (non exhaustive list)
Aixtron, Allos, AlphaOmega, Amec, Amkor, Apple, ASE, ATS, BMW, Coorstek, Delta
electronics, Dialog Semiconductors, Dowa, Efficient Power Conversion, Egtronics, EpiGaN,
Episil, Epistar, Evatran, Exagan, Fairchild, Finsix, Ford, Fuji Electric, GaN Systems, GaN
Power, Imec, Infineon, IQE, LG electronics, Jedec, Kyma, Navitas Semiconductors, Neditek,
Nexgen, Nordic Power Converters, NXP, On Semiconductor, Panasonic, Philos, Powerex,
Power Integrations, Qualcomm, Samsung, Sanken, SAS, Sharp, Siltronic, STMicroelectronics,
Sumco, Sumitomo SEI, Tagore Technology, Toshiba, Toyota, Tesla, Texas Instruments, TSMC,
Transphorm, Veeco, Velodyne, VisIC Technologies, Xfab, Yaskawa, and more...
Find more
details about
this report here:
RELATED REPORTS
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• Status of the Power Electronics Industry
2018
• LiDARs for Automotive and Industrial
Applications 2018
• Texas Instruments' LMG5200 GaN
Power Stage
• GaN on Si HEMT vs SJ MOSFET:
Technology and Cost Comparison
• Power SiC 2018: Materials, Devices and
Applications
Find all our reports
on www.i-micronews.com
Ana Villamor, PhD serves
as a Technology Market
Analyst, Power Electronics
Compound Semiconductors. She is involved
in many custom studies and reports focused on
emerging power electronics technologies at Yole
Développement, including device technology
and reliability analysis (MOSFET, IGBT, HEMT,
etc). . Previously Ana was involved in a high-
added value collaboration related to SJ Power
MOSFETs, within the CNM research center
for the leading power electronic company ON
Semiconductor. During this partnership and
after two years as Silicon Development Engineer,
she acquired a relevant technical expertise and
a deep knowledge of the power electronic
industry. She holds an Electronics Engineering
degree completed by a Master in micro and nano
electronics, both from Universitat Autonoma de
Barcelona (SP).

What is included in this report? 4
What is new? 5
What did we get wrong? 6
Executive summary 7
Overview of WBG power devices 49
Replacing silicon with GaN 57
GaN power device market, by application 65
Power supply
EV/HEV
PV and energy storage
UPS
Wireless power
Envelope tracking
LiDAR
LED drivers
Other applications
Power GaN market, by application and
device type (discrete vs. IC) 172
GaN-on-Si power - Device technology 194
GaN-on-Si power - Technology
GaN-on-GaN - Technology and market
Discrete vs. power IC
Commercial GaN power devices
Packaging
Integration
GaN-on-Si epitaxy
GaN reliability status
GaN power - Industry landscape 277
GaN cost structure 297
Power electronics discussion 305
Conclusions 311
TABLE OF CONTENTS (complete content on i-Micronews.com)
Hong Lin, PhD works as
a Senior Technology and
Market Analyst, Compound
Semiconductors since 2013. She is specialized
in compound semiconductors and provides
technical and economic analysis. Before joining
Yole Développement, she worked as RD
engineer at Newstep Technologies. She was
in charge of the development of cold cathodes
by PECVD for visible and UV lamp applications
based on nanotechnologies. She holds a Ph.D in
Physics and Chemistry of materials.
As a Technology Market
Analyst, Compound Semi-
conductors, Ezgi Dogmus,
PhD is daily contributing to the development
of these activities with a dedicated collection
of market technology reports as well as
custom consulting projects. Prior Yole, Ezgi
was deeply involved in the development of
GaN-based solutions at IEMN (Lille, France).
Ezgi also participated in numerous international
conferences and has authored or co-authored
more than 12 papers. Upon graduating
from University of Augsburg (Germany) and
Grenoble Institute of Technology (France), Ezgi
received her PhD in Microelectronics at IEMN
(France).
packaging is added and voltage is increased, the
GaN product would cost more than the silicon
alternative – and higher cost is often cited as a
main barrier to adoption.
Many players have started building integrated
systems to be cost-competitive at system level.
This is happening not only with D-mode solutions,
but also E-mode integrated solutions, which seem
appealing for the end user as an easy-to-use
product. We also find system-in-package solutions
that include Si, i.e. Texas Instruments’ and Exagan’s
products, as well as integrated solutions where
the driver, ESD protections, and other functions
are monolithically integrated i.e. Navitas solutions.
This report features a discussion on device technology
and landscape from a cost point of view for the next
several years, including not just Si and GaN products
but also passive and integrated solutions.
Ana Villamor, PhD, Ezgi Dogmus, PhD, and Hong Lin, PhD, all part of the Power Wireless division at Yole
Développement co-authored the Power GaN 2018: Epitaxy, Devices, Applications and Technology Trends report:
AUTHORS

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or as a bundled offer. (i.e. subscription for a period of 12 calendar
months).
“Report”: Reports are established in PowerPoint and delivered
in a PDF format with an additional Excel file. 30min of QA with
an Analyst arecan be included for each report. More time can be
allocated on a fee basis.
“License”: For the reports 3 different licenses are proposed.
The buyer has to choose one license type:
• Single user license: one person at the company can use the
report. Sharing is strictly forbidden.
• Multi-user license: the report can be accessed by an unlimited
number of users within the company, but only in the country of
the primary user. Subsidiaries and Joint-Ventures are excluded.
• Corporate license: the report can be used by an unlimited
number of users within the company, but only in the country of
the primary user. Joint-Ventures are included, while subsidiaries
are excluded.
“Monitor”: Monitors are established and delivered in Excel. An
additional PDF can also join it. QA with an Analyst is possible for
each monitor with a maximum limit of 100h/year. Frequency of
the release varies according to the monitor or service.
“Seller”: Based in Villeurbanne (France headquarters Yole
Développement Développement is providing marketing,
technology and strategy consulting, media and corporate
finance services, reverse engineering/costing services as well
as IP and patent analysis). With more than 70 market analysts,
Yole Développement works worldwide with the key industrial
companies, RD institutes and investors to help them understand
the markets and technology trends.
1. SCOPE
1.1 The Contracting Parties undertake to observe the following
general conditions when agreed by the Buyer and the Seller.
ANY ADDITIONAL, DIFFERENT, OR CONFLICTING
TERMS AND CONDITIONS IN ANY OTHER DOCUMENTS
ISSUED BY THE BUYER AT ANY TIME ARE HEREBY
OBJECTED TO BY THE SELLER, SHALL BE WHOLLY
INAPPLICABLE TO ANY SALE MADE HEREUNDER AND
SHALL NOT BE BINDING IN ANY WAY ON THE SELLER.
1.2 This agreement becomes valid and enforceable between the
Contracting Parties after clear and non-equivocal consent by
any duly authorized person representing the Buyer. For these
purposes, the Buyer accepts these conditions of sales when
signing the purchase order which mentions “I hereby accept
Yole Développement’s Terms and Conditions of Sale”. This
results in acceptance by the Buyer.
1.3 Orders are deemed to be accepted only upon written
acceptance and confirmation by the Seller, within [7 days] from
the date of order, to be sent either by email or to the Buyer’s
address. In the absence of any confirmation in writing, orders
shall be deemed to have been accepted.
2. MAILING OF THE PRODUCTS
2.1 Products are sent by email to the Buyer:
• within [1]
month from the order for Products already
released; or
• within a reasonable time for Products ordered prior to
their effective release. In this case, the Seller shall use its best
endeavours to inform the Buyer of an indicative release date
and the evolution of the work in progress.
2.2 The Seller shall by no means be responsible for any delay in
respect of article 2.2 above, and including in cases where a
new event or access to new contradictory information would
require for the analyst extra time to compute or compare
the data in order to enable the Seller to deliver a high quality
Products.
2.3 The mailing of the Product will occur only upon payment
by the Buyer, in accordance with the conditions contained
in article 3.
2.4. The mailing is operated through electronic means either by
email via the sales department or automatically online via an
email/password. If the Product’s electronic delivery format
is defective, the Seller undertakes to replace it at no charge
to the Buyer provided that it is informed of the defective
formatting within 90 days from the date of the original
download or receipt of the Product.
2.5 The person receiving the Products on behalf of the Buyer
shall immediately verify the quality of the Products and their
conformity to the order. Any claim for apparent defects or
for non-conformity shall be sent in writing to the Seller within
8 days of receipt of the Products. For this purpose, the Buyer
agrees to produce sufficient evidence of such defects. .
2.6 No return of Products shall be accepted without prior
information to the Seller, even in case of delayed delivery.
Any Product returned to the Seller without providing prior
information to the Seller as required under article 2.5 shall
remain at the Buyer’s risk.
3. PRICE, INVOICING AND PAYMENT
3.1 Prices are given in the orders corresponding to each Product
sold on a unit basis or corresponding to bundled offers. They
are expressed to be inclusive of all taxes. The prices may be
reevaluated from time to time. The effective price is deemed
to be the one applicable at the time of the order.
3.2 Payments due by the Buyer shall be sent by cheque payable to
Yole Développement, credit card or by electronic transfer to
the following account:
HSBC, 1 place de la Bourse 69002 Lyon France
Bank code: 30056
Branch code: 00170
Account n°: 0170 200 1565 87
BIC or SWIFT code: CCFRFRPP
IBAN: FR76 3005 6001 7001 7020 0156 587
To ensure the payments, the Seller reserves the right to request
down payments from the Buyer. In this case, the need of down
payments will be mentioned on the order.
3.3 Payment is due by the Buyer to the Seller within 30 days
from invoice date, except in the case of a particular written
agreement. If the Buyer fails to pay within this time and fails
to contact the Seller, the latter shall be entitled to invoice
interest in arrears based on the annual rate Refi of the «BCE»
+ 7 points, in accordance with article L. 441-6 of the French
Commercial Code. Our publications (report, database, tool...)
are delivered only after reception of the payment.
3.4 In the event of termination of the contract, or of misconduct,
during the contract, the Seller will have the right to invoice
at the stage in progress, and to take legal action for damages.
4. LIABILITIES
4.1 The Buyer or any other individual or legal person acting on
its behalf, being a business user buying the Products for its
business activities, shall be solely responsible for choosing the
Products and for the use and interpretations he makes of the
documents it purchases, of the results he obtains, and of the
advice and acts it deduces thereof.
4.2 The Seller shall only be liable for (i) direct and (ii) foreseeable
pecuniary loss, caused by the Products or arising from a
material breach of this agreement
4.3 In no event shall the Seller be liable for:
a) damages of any kind, including without limitation, incidental
or consequential damages (including, but not limited to,
damages for loss of profits, business interruption and loss of
programs or information) arising out of the use of or inability
to use the Seller’s website or the Products, or any information
provided on the website, or in the Products;
b) any claim attributable to errors, omissions or other
inaccuracies in the Product or interpretations thereof.
4.4 All the information contained in the Products has been
obtained from sources believed to be reliable. The Seller
does not warrant the accuracy, completeness adequacy or
reliability of such information, which cannot be guaranteed to
be free from errors.
4.5 All the Products that the Seller sells may, upon prior notice
to the Buyer from time to time be modified by or substituted
with similar Products meeting the needs of the Buyer. This
modification shall not lead to the liability of the Seller,
provided that the Seller ensures the substituted Product is
similar to the Product initially ordered.
4.6 In the case where, after inspection, it is acknowledged that
the Products contain defects, the Seller undertakes to replace
the defective products as far as the supplies allow and without
indemnities or compensation of any kind for labor costs,
delays, loss caused or any other reason. The replacement is
guaranteed for a maximum of two months starting from the
delivery date. Any replacement is excluded for any event as set
out in article 5 below.
4.7 The deadlines that the Seller is asked to state for the mailing
of the Products are given for information only and are not
guaranteed. If such deadlines are not met, it shall not lead to
any damages or cancellation of the orders, except for non
acceptable delays exceeding [4] months from the stated
deadline, without information from the Seller. In such case only,
the Buyer shall be entitled to ask for a reimbursement of its first
down payment to the exclusion of any further damages.
4.8 The Seller does not make any warranties, express or implied,
including, without limitation, those of sale ability and fitness for
a particular purpose, with respect to the Products. Although
the Seller shall take reasonable steps to screen Products for
infection of viruses, worms, Trojan horses or other codes
containing contaminating or destructive properties before
making the Products available, the Seller cannot guarantee
that any Product will be free from infection.
5. FORCE MAJEURE
The Seller shall not be liable for any delay in performance directly
or indirectly caused by or resulting from acts of nature, fire, flood,
accident, riot, war, government intervention, embargoes, strikes,
labor difficulties, equipment failure, late deliveries by suppliers or
other difficulties which are beyond the control, and not the fault
of the Seller.
6. PROTECTION OF THE SELLER’S IPR
6.1 All the IPR attached to the Products are and remain the
property of the Seller and are protected under French and
international copyright law and conventions.
6.2 The Buyer agreed not to disclose, copy, reproduce,
redistribute, resell or publish the Product, or any part of it
to any other party other than employees of its company. The
Buyer shall have the right to use the Products solely for its
own internal information purposes. In particular, the Buyer
shall therefore not use the Product for purposes such as:
• Information storage and retrieval systems;
• Recordings and re-transmittals over any network (including
any local area network);
• Use in any timesharing, service bureau, bulletin board or
similar arrangement or public display;
• Posting any Product to any other online service (including
bulletin boards or the Internet);
• Licensing, leasing, selling, offering for sale or assigning the
Product.
6.3 The Buyer shall be solely responsible towards the Seller of
all infringements of this obligation, whether this infringement
comes from its employees or any person to whom the Buyer
has sent the Products and shall personally take care of any
related proceedings, and the Buyer shall bear related financial
consequences in their entirety.
6.4 The Buyer shall define within its company point of contact for
the needs of the contract. This person will be the recipient
of each new report in PDF format. This person shall also be
responsible for respect of the copyrights and will guaranty that
the Products are not disseminated out of the company.
6.5 In the context of annual subscriptions, the person of contact
shall decide who within the Buyer, shall be entitled to receive
the protected link that will allow the Buyer to access the
Products.
6.6 As a matter of fact the investor of a company, the joint venture
done with a third party etc..cannot access the report and
should pay a full license price.
7. TERMINATION
7.1 If the Buyer cancels the order in whole or in part or postpones
the date of mailing, the Buyer shall indemnify the Seller for
the entire costs that have been incurred as at the date of
notification by the Buyer of such delay or cancellation. This
may also apply for any other direct or indirect consequential
loss that may be borne by the Seller, following this decision.
7.2 In the event of breach by one Party under these conditions
or the order, the non-breaching Party may send a notification
to the other by recorded delivery letter upon which, after a
period of thirty (30) days without solving the problem, the
non-breaching Party shall be entitled to terminate all the
pending orders, without being liable for any compensation.
8. MISCELLANEOUS
All the provisions of these Terms and Conditions are for the
benefit of the Seller itself, but also for its licensors, employees
and agents. Each of them is entitled to assert and enforce those
provisions against the Buyer.
Any notices under these Terms and Conditions shall be given in
writing. They shall be effective upon receipt by the other Party.
The Seller may, from time to time, update these Terms and
Conditions and the Buyer, is deemed to have accepted the latest
version of these terms and conditions, provided they have been
communicated to him in due time.
9. GOVERNING LAW AND JURISDICTION
9.1 Any dispute arising out or linked to these Terms and
Conditions or to any contract (orders) entered into in
application of these Terms and Conditions shall be settled
by the French Commercial Courts of Lyon, which shall have
exclusive jurisdiction upon such issues.
9.2 French law shall govern the relation between the Buyer and
the Seller, in accordance with these Terms and Conditions.
TERMS AND CONDITIONS OF SALES

© 2018
Yole Développement
FromTechnologies to Market
Source: Wikimedia Commons

2©2018 | www.yole.fr | About Yole Développement
YOLE DEVELOPPEMENT – FIELDS OF EXPERTISE
Life Sciences
Healthcare
o Microfluidic
o BioMEMS
o Inkjet Printing
o Solid-State Medical Imaging BioPhotonics
o Bio Technologies
Power
Wireless
o RF Devices Technology
o Compound Semiconductors Emerging Materials
o Power Electronics
o Batteries Energy Management
Semiconductor
Software
o Package Assembly Substrates
o Semiconductor Manufacturing
o Memory
o Software Computing
Photonics,
Sensing Display
o Solid-State Lighting Display
o MEMS, Sensors Actuators
o Imaging
o Photonics Optoelectronics
Semiconductor
Software
Power Wireless
Photonics,
Sensing
Display
Life
Sciences
Healthcare

4 BUSINESS MODELS
o Consulting and Analysis
• Market data research,
marketing analysis
• Technology analysis
• Strategy consulting
• Reverse engineering costing
• Patent analysis
• Design and characterization
of innovative optical systems
• Financial services (due
diligence, MA with our
partner)
www.yole.fr
o Syndicated reports
• Market technology reports
• Patent investigation and patent
infringement risk analysis
• Teardowns reverse costing
analysis
• Cost simulation tool
www.i-Micronews.com/reports o Media
• i-Micronews.com website
• @Micronews e-newsletter
• Communication webcast
services
• Events:TechDays, forums,…
www.i-Micronews.com
o Monitors
• Monthly and/or Quarterly
update
• Excel database covering supply,
demand, and technology
• Price, market, demand and
production forecasts
• Supplier market shares
www.i-Micronews.com/reports

6 COMPANIES TO SERVEYOUR BUSINESS
Due diligence
www.yole.fr
Manufacturing costs analysis
Teardown and reverse engineering
Cost simulation tools
www.systemplus.fr
Market, technology and strategy
consulting
www.yole.fr
IP analysis
Patent assessment
www.knowmade.fr
Innovation and business maker
www.bmorpho.com
Design and characterization of
innovative optical systems
www.piseo.fr
Yole Group of Companies

OUR GLOBAL ACTIVITY
30%of our business
40%of our business
30%of our business
Greater
China office
Yole Japan
HQ in Lyon
Nantes
Paris
Nice
Vénissieux
Europe office
Frankfurt
Hsinchu
Tokyo
Yole Inc.
Phoenix
Yole Korea
Seoul
Palo Alto

ANALYSIS SERVICES - CONTENT COMPARISON
Technology
and Market
Report
Leadership
Meeting
QA
Service
Depth of the analysis
Breadthoftheanalysis
Meet the
Analyst
Custom
Analysis
High
High
Low

SERVING THE ENTIRE SUPPLY CHAIN
Our analysts
provide
market
analysis,
technology
evaluation,
and business
plans along
the entire
supply chain
Integrators, end-
users and software
developers
Device manufacturers
Suppliers: material, equipment,
OSAT, foundries…
Financial investors, RD centers

SERVING MULTIPLE INDUSTRIAL FIELDS
We work
across
multiples
industries to
understand
the impact of
More-than-
Moore
technologies
from device
to system
From A to Z…
Transportation
makers
Mobile phone
and
consumer
electronics
Automotive
Medical
systems
Industrial
and defense
Energy
management

o Yole Développement, System Plus Consulting, KnowMade and PISEO, all part of Yole Group of Companies, keep on increasing their collaboration to offer, in 2018, a
collection of 150+ reports. Combining respective expertise and methodologies from the 4 companies, the reports aim to provide market technology analysis, patent
investigation and patent infringement risk analysis, teardowns reverse costing analysis.They cover:
o You are looking for:
• An analysis of your product market
• A review of your competitors evolution
• An understanding of your manufacturing and production costs
• An understanding of your industry technology roadmap and related IPs
• A clear view on the evolution of the supply chain…
Our reports are for you!
The combined team of 60+ experts (PhDs, MBAs, industry veterans…) from Yole Développement, System Plus Consulting, KnowMade and PISEO, collect information,
identify the trends, the challenges, the emerging markets, the competitive environments and turn it into results to give you a complete picture of your industry
landscape.
In the past 20 years, we worked on more than 1 700 projects, interacting with technology professionals and high level opinion makers from the main players of the
industry.
o In 2018, Yole Group of Companies plan to publish +150 reports. Gain full benefit from our Bundled Offer and receive at least a 36% discount.
REPORTS COLLECTION
www.i-Micronews.com
• MEMS Sensors
• RF devices technologies
• Imaging
• Medical technologies (MedTech)
• Photonics
• Advanced packaging
• Manufacturing
• Advanced substrates
• Power electronics
• Batteries and energy management
• Compound semiconductors
• Solid state lighting
• Displays
• Software
• Memory

OUR 2018 REPORTS COLLECTION (1/4)
MEMS SENSORS
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Status of the MEMS Industry 2018 – Update
− Silicon Photonics 2018 – Update
− Consumer Biometrics: Hardware Software 2018 – Update
− Inkjet Functional and Additive Manufacturing for Electronics 2018 - Update
− Fingerprint Sensor Applications and Technologies – Consumer Market Focus 2017
− Sensors and Sensing Modules for Smart Homes and Buildings 2017
− Acoustic MEMS and Audio Solutions 2017
− MEMS Sensors for Automotive Market Technology Trends 2017
− High End Inertial Sensors 2017
− Magnetic Sensor 2017
o REVERSE COSTING® – STRUCTURE, PROCESS COST REPORT
– by System Plus Consulting
− Piezo MEMS 2018 *
o PATENT ANALYSES – by KnowMade
− Knowles MEMS Microphones in Apple iPhone 7 Plus – Patent-to-Product
Mapping 2017
o LINKED REPORTS – by Yole Développement, System Plus Consulting and KnowMade
− MEMS Pressure Sensor 2018 – Market Technology Report
− MEMS Pressure Sensor Comparison 2018 – Structure, Process Cost Report
− Gas Particles 2018 – Market Technology Report
− Gas Sensors Comparison 2018 – Structure, Process Cost Report
− LiDARs for Automotive and Industrial Applications 2018 – Market
Technology Report
− LiDAR for Automotive 2018 – Patent Landscape Analysis
− MEMS Packaging 2017 – Market Technology Report
− MEMS Packaging Comparison 2017 – Structure, Process Cost Report
RF DEVICES ANDTECHNOLOGIES
− Wireless technologies (Radar, V2X) for Automotive 2018 - New
− Internet of Things RF Protocols and their Impacts on the Electronics
Industry 2018 – New
o REVERSE COSTING® – STRUCTURE, PROCESS COST REPORT– by System
Plus Consulting
− Automotive Radar Comparison 2018
− RF Acoustic Wave Filters 2017 – Patent Landscape Analysis
− 5G impact on RF Front End Modules and Connectivity for Cellphones 2018 – Market
Technology Report – Update
− RF Front-End Module Comparison 2018 – Structure, Process Cost Report
− RF Front End Modules for Cellphones 2018 – Patent Landscape Analysis
− Advanced RF System-in-Package for Cellphones 2018 – Market Technology
Report – Update*
− Advanced RF SiPs for Cell Phones Comparison 2017 – Structure, Process
Cost Report
− RF GaN Market: Applications, Players, Technology, and Substrates 2018-2023
Market Technology Report – Update
− RF GaN Comparison 2018* – Structure, Process Cost Report
− RF GaN 2018 – Patent Landscape Analysis
SOFTWARE
− Consumer Biometrics: Sensors Software 2018 – Update
− Hardware and Software for AI 2018 – Consumer focus – New
− From Image Processing to Deep Learning, Introduction to Hardware and
Software 2017
Update : 2017 version still available / *To be confirmed

IMAGING OPTOELECTRONICS
− 3D Imaging and Sensing 2018 – Update
− Sensors for Robotic Vehicles 2018
− Machine Vision for Industry and Automation 2018 - Update
− Uncooled Infrared Imagers 2017
− STMicroelectronics ToF Proximity Sensor Flood Illuminator in the Apple
iPhone X – Patent-to-Product Mapping
− Status of the CMOS Image Sensor Industry 2018 – Market Technology Report -
Update
− CMOS Image Sensor Comparison 2018 – Structure, Process Cost Report
− Camera Module 2017 – Market Technology Report
− Compact Camera Module Comparison 2018 – Structure, Process Cost Report
− LiDARs for Automotive and Industrial Applications 2018 – Market Technology
Report
− LiDAR for Automotive 2018 – Patent Landscape Analysis
ADVANCED PACKAGING
− Status of Advanced Packaging Industry 2018 – Update
− Status of Advanced Substrates 2018: Embedded Die and Interconnects,
Substrate Like PCB Trends - Update
− 3D TSV and Monolithic Business Update 2018 – Update
− Power Modules Packaging 2018 – Update
− Discrete Power Packaging 2018 – Update*
− Status of Panel Level Packaging 2018
− Trends in Automotive Packaging 2018
− Hardware and Software for AI 2018 – Consumer Focus - New
− Thin-Film Integrated Passive Devices 2018
o LINKED REPORTS– by Yole Développement and System Plus Consulting
− Advanced RF System-in-Package for Cellphones 2017 – Market Technology Report -
Update
− Advanced RF SiPs for Cell Phones Comparison 2017 – Structure, Process
Cost Report
− Fan-Out Packaging Comparison 2018* – Structure, Process Cost Report
MANUFACTURING
− Wafer Starts for More Than Moore Applications 2018 – New
− Polymeric Materials for Advanced Packaging at the Wafer-Level 2018 – New
− Laser Technologies for Semiconductor Manufacturing 2017
− Glass Substrate Manufacturing in the Semiconductor Field 2017
− Equipment and Materials for Fan-Out Packaging 2017
− Equipment and Materials for 3D TSV Applications 2017
o LINKED REPORTS – by Yole Développement and System Plus Consulting
− Bonding and Lithography Equipment Market for More than Moore
Devices 2018 – New
− Wafer Bonding Comparison 2018 – Structure, Process Cost Report

MEMORY
− Emerging Non Volatile Memory 2018 – Update
o QUARTERLY UPDATE – by Yole Développement**
− Memory Market Monitor 2018 (NAND DRAM)
o MONTHLY UPDATE – by Yole Développement**
− Memory Pricing Monitor 2018 (NAND DRAM)
o REVERSE COSTING® – STRUCTURE, PROCESS COST REPORT – by System
Plus Consulting
− DRAM Technology Cost Review 2018
− NAND Memory Technology Cost Review 2018
− 3D Non-Volatile Memories – Patent Landscape
COMPOUND SEMICONDUCTORS
− GaAs Wafer and Epiwafer Market: RF, Photonics, LED and PV
Applications 2018 - New
− InP Materials, Devices and Applications 2018 - New
− Bulk GaN Substrate Market 2017
− Power SiC 2018: Materials, Devices, and Applications – Market Technology
Report – Update
− SiC Transistor Comparison 2018 – Structure, Process Cost Report
− Power GaN 2018: Materials, Devices, and Applications – Market Technology
Report – Update
− GaN-on-Silicon Transistor Comparison 2018 – Structure, Process Cost Report
− Status of the GaN IP – Patent Watch 2018 Patent Activity 2017
− RF GaN Market: Applications, Players, Technology, and Substrates 2018-2023
– Market Technology Report – Update
− RF GaN Materials, Devices and Modules 2018 – Patent Landscape Analysis
POWER ELECTRONICS
− Introduction to the Power IC Market 2018 - New
− Status of Power Electronics Industry 2018 – Update
− Power Electronics for Electric Vehicles 2018 – Update
− Wireless Charging Market Expectations and Technology Trends 2018
− Thermal Management Technology and Market Perspectives in Power
Electronics and LEDs 2017
− Gate Driver 2017
− Power MOSFET 2017
− IGBT 2017
− Market Opportunities for Thermal Management Components in
Smartphones 2017
o LINKED REPORTS – by Yole Développement, System Plus Consulting
and KnowMade
− Power Modules Packaging 2018 – Market Technology Report – Update
− Automotive Power Module Packaging Comparison 2018 – Structure,
Process Cost Report
− Power ICs Market Comparison 2018* – Structure, Process Cost Report
BATTERY AND ENERGY MANAGEMENT
− Li-ion Battery Packs for Automotive and Stationary Storage Applications
2018 – Update
− Solid State Battery 2018 – Market Technology Report – New
− Status of the Battery Patents – Patent Watch 2018 Patent Activity 2017
Update : 2017 version still available / *To be confirmed / ** Can not be selected within an Annual Subscription offer

SOLID STATE LIGHTING
− IR LEDs and Lasers 2018: Technology, Industry and Market Trends – Update
− Automotive Lighting 2018: Technology, Industry and Market Trends – Update
− UV LEDs 2018: Technology, Industry and Market Trends – Update
− LiFi: Technology, Industry and Market Trends
− LED Lighting Module Technology, Industry and Market Trends 2017
− CSP LED Lighting Modules
− Phosphors Quantum Dots 2017 - LED Downconverters for Lighting Displays
− Horticultural Lighting 2017
o LINKED REPORTS – by Yole Développement and System Plus Consulting
− VCSELs 2018: Technology, Industry and Market Trends – Market Technology
Report - New
− VCSELs Comparison 2018 – Structure, Process Cost Report
DISPLAYS
− MiniLED for Display Applications: LCD and Digital Signage 2018 – New
− Displays and Optical Vision Systems for VR/AR/MR 2018
− MicroLED Displays 2018 – Market Technology Report – Update
− MicroLED Display – Patent Landscape Analysis
MEDTECH
− BioMEMS Non-Invasive sensors: microsystems for Life sciences Healthcare
2018 – Update
− Point-of-Need Testing Application of Microfluidic Technologies 2018 – Update
− Neurotechnologies and Brain Computer Interface 2018 - New
− CRISPR-Cas9 Technology: From Lab to Industries 2018 – New
− Ultrasound Sensing Technologies for Medical, Industrial and Consumer
Applications 2018 – New
− Inkjet Functional and Additive Manufacturing for Electronics 2018 - New
− Liquid Biopsy: from Isolation to Downstream Applications 2018 - New
− Chinese Microfluidics Industry 2018 - New
− Artificial Organ Technology and Market 2017
− Connected Medical Devices Market and Business Models 2017
− Status of the Microfluidics Industry 2017
− Organs-On-Chips 2017
− Solid-State Medical Imaging 2017
− Medical Robotics Market Technology Analysis 2017
− OCT Medical Imaging – Patent Landscape
− Pumps for Microfluidic Devices – Patent Landscape 2017
− Microfluidic Technologies for Diagnostic Applications – Patent Landscape 2017
− FLUIDIGM – Patent Portfolio Analysis 2017
− Consumer Physics SCiO Molecular Sensor – Patent-to-Product Mapping 2017
− Organs-On-Chips 2017 – Market Technology Report
− Organ-on-a-Chip – Patent Landscape Analysis

OUR 2017 PUBLISHED REPORTS LIST (3/3)
OUR PARTNERS’ REPORTS
PATENT ANALYSES – by KnowMade
− Wireless Charging Patent Landscape Analysis
− RF Acoustic Wave Filters Patent Landscape Analysis
− NMC Lithium-Ion Batteries Patent Landscape Analysis
− Pumps for Microfluidic Devices Patent Landscape
− III-N PatentWatch
− FLUIDIGM Patent Portfolio Analysis
− Knowles MEMS Microphones in Apple iPhone 7 Plus Patent-to-Product Mapping 2017
− Consumer Physics SCiO Molecular Sensor Patent-to-Product Mapping
− Patent Licensing Companies in the Semiconductor Market - Patent Litigation Risk and Potential Targets
− MicrofluidicTechnologies for Diagnostic Applications Patent Landscape
TEARDOWN REVERSE COSTING – by System Plus Consulting
More than 60 teardowns and reverse costing analysis and cost simulation tools published in 2017
MORE INFORMATION
o All the published reports from theYole Group of Companies are available on our website www.i-Micronews.com.
o Ask for our Bundle Subscription offers: With our bundle offer, you choose the number of reports you are interested in and select the related offer. You then have up
to 12 months to select the required reports from the Yole Développement, System Plus Consulting and KnowMade offering. Pay once and receive the reports
automatically (multi-user format). Contact your sales team according to your location (see the last slide).

MICRONEWS MEDIA
o About Micronews Media
To meet the growing demand for market,
technological and business information,
Micronews Media integrates several tools able
to reach each individual contact within its
network.We will ensure you benefit from this.
ONLINE ONSITE INPERSON
@Micronews e-newsletter
i-Micronews.com
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product/brand visibility.They
are also an efficient way to
adapt with the demands of the
times and to evolve an effective
marketing plan and strategy.
Brand visibility, networking
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Today's technology makes it
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Benefit from the i-Micronews.com
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Several key events planned for
2018 on different topics to
attract 120 attendees on average
Gain new leads for your business
from an average of 340
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Contact: CamilleVeyrier (veyrier@yole.fr), Marketing Communication Project Manager

CONTACT INFORMATION
o CONSULTING AND SPECIFICANALYSIS, REPORT
BUSINESS
• North America:
• Steve LaFerriere, Senior Sales Director forWestern US
Canada
Email: laferriere@yole.fr – + 1 310 600-8267
• Troy Blanchette, Senior Sales Director for Eastern US
Canada
Email: troy.blanchette@yole.fr – +1 704 859-0453
• Japan Rest of Asia:
• Takashi Onozawa, General Manager,Asia Business
Development (India ROA)
Email: onozawa@yole.fr - +81 34405-9204
• Miho Othake, Account Manager (Japan)
Email: ohtake@yole.fr - +81 3 4405 9204
• Itsuyo Oshiba, Account Manager (Korea Singapore)
Email: oshiba@yole.fr - +81-80-3577-3042
• Greater China: Mavis Wang, Director of Greater China Business
Development
Email: wang@yole.fr - +886 979 336 809
• Europe: Lizzie Levenez, EMEA Business Development Manager
Email: levenez@yole.fr - +49 15 123 544 182
• RoW: Jean-Christophe Eloy, CEO President,Yole Développement
Email eloy@yole.fr - +33 4 72 83 01 80
o FINANCIAL SERVICES (in partnership withWoodside
Capital Partners)
• Jean-Christophe Eloy, CEO President
Email: eloy@yole.fr - +33 4 72 83 01 80
• Ivan Donaldson,VP of Financial Market Development
Email: ivan.donaldson@yole.fr - +1 208 850 3914
o CUSTOM PROJECT SERVICES
• Jérome Azémar,Technical Project Development Director
Email: azemar@yole.fr - +33 6 27 68 69 33
o GENERAL
• Sandrine Leroy, Director, Public Relations
Email: leroy@yole.fr - +33 4 72 83 01 89 / +33 6 33 11 61 55
• Email: info@yole.fr - +33 4 72 83 01 80
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