MicroLED Displays 2018 report by Yole Développement

© 2017
From Technologies to Market
MicroLED
Displays 2018
Courtesy of Sony
Sample
© 2018

2
OBJECTIVE OF THE REPORT
Deep
understanding
of the
technology,
current status
and prospects,
roadblocks
and key
players.
• Understand the Current Status of the µLED Display Technologies:
• What are microLED? What are the key benefits? How do they differ from other display technologies? What are the cost
drivers?
• What are the remaining roadblocks? How challenging are they?
• Detailed analysis of key technological nodes: epitaxy, die structure and manufacturing, front plane structure and display designs,
color conversion, backplanes, massively parallel pick and place and continuous assembly processes, hybridization, defect
management, light extraction and beam shaping.
• Which applications could µLED display address and when?
• Detailed analysis of major display applications: TV, smartphones, wearables, augmented and virtual reality (AR/VR/MR), laptops
and tablets, monitors, large LED video displays...
• What are the cost targets for major applications? How do they impact technology, design and process choices?
• How disruptive for incumbent technologies: LCD, OLED, LCOS…
• MicroLED display application roadmap, forecast and SWOT analysis
• Competitive Landscape and Supply chain
• Identify key players in technology development and manufacturing.Who owns the IP?
• Potential impact on the LED supply chain: epimakers, MOCVD reactor and substrate suppliers.
• Potential impact on the display chain: LCD and OLED panel makers.
• Scenario for a µLED display supply chain.
EverythingYou AlwaysWanted to Know About µLED Displays!
MicroLED Displays | Sample | www.yole.fr | ©2018

3
Biography & contact
EricVirey - Principal Analyst,Technology & Market, Sapphire & Display
Dr. Eric Virey serves as a Senior Market and Technology Analyst at Yole Développement (Yole), within the Photonic & Sensing & Display division. Eric is
a daily contributor to the development of LED, OLED, and Displays activities, with a large collection of market and technology reports as well as
multiple custom consulting projects. Thanks to its deep technical knowledge and industrial expertise, Eric has spoken in more than 30 industry
conferences worldwide over the last 5 years. He has been interviewed and quoted by leading media over the world.
Previously Eric has held various R&D, engineering, manufacturing and business development positions with Fortune 500 Company Saint-Gobain in
France and the United States.
Dr. EricVirey holds a Ph-D in Optoelectronics from the National Polytechnic Institute of Grenoble.
Contact: virey@yole.fr

4
COMPANIES CITED IN THE REPORT
Aixtron (DE),Aledia (FR), Allos Semiconductor (DE),AMEC (CN),Apple (US),AUO (TW), BOE (CN), CEA-LETI (FR), CIOMP (CN), Columbia
University (US), Cooledge (CA), Cree (US), CSOT (CN), eLux (US), eMagin (US), Epistar (TW), Epson (JP), Facebook (US), Foxconn (TW),
Fraunhofer Institute (DE), glō (SE), GlobalFoundries (US), Goertek (CN), Google (US), Hiphoton (TW), HKUST (HK), HTC (TW), Ignis (CA),
InfiniLED (UK), Intel (US), ITRI (TW), Jay Bird Display (HK), Kansas State University (US), KIMM (KR), Kookmin U. (KR), Kopin (US), LG (KR),
LightWave Photonics Inc (US), Lumens (KR), Lumiode (US), LuxVue (US), Metavision (US), Microsoft (US), Mikro Mesa (TW), mLED (UK), MIT
(US), NAMI (HK), Nanosys (US), NCTU (TW), Nichia (JP), Nth Degree (US), NuFlare (JP), Oculus (US), Optovate (UK), Osterhout Design Group
(US), Osram (DE), Ostendo (US), PlayNitride (TW), PSI Co (KR), QMAT (US), Rohinni (US), Saitama University (JP), Samsung (KR), Sanan (CN),
SelfArray (US), Semprius (US), Smart EquipmentTechnology (FR), Seoul Semiconductor (KR), Sharp (JP), Sony (JP), Strathclyde University (UK),
SUSTech (CN), SunYat-sen University (TW), Sxaymiq Technologies (US),Tesoro (US),Texas Tech (US),Tianma (CN),TSMC (TW),Tyndall National
Institute (IE), Uniqarta (US), U. Of Hong Kong (HK), U. of Illinois (US),Veeco (US),VerLASE (US),V-Technology (JP),VueReal (CA),Vuzix (US), X-
Celeprint (IE)…and more.

5
TABLE OF CONTENTS
• Executive summary p10
• Introduction to microLED displays p51
• Definition and history
• What is a microLED display?
• Comparisons with LCD and OLED
• Assembly
• Display structure
• SWOT analysis
• MicroLED display manufacturing yields p63
• Overview
• Individual die testing.
• KGD mapping and individual transfer
• Transfer fields and interposers
• Defect management strategies
• Yield roadmap
• Redundancy
• Conclusions
• MicroLED epitaxy (FE Level 0) p79
• Wafer size
• Wavelength homogeneity
• Epitaxy defects
• Cycle time and thickness
• Blue shift
• Wafer flatness
• GaN-based red chips
• Conclusions and impact on supply chain
• Chip manufacturing and singulation (FE Level 1) p96
• MicroLED singulation p97
• Impact on cost related to the epiwafer
• Illustrations
• MicroLED efficiency p104
• LED and microLED efficiency
• Development thrust areas
• Current confinement structures
• Status
• MicroLED chip manufacturing p112
• Example of process flow – Apple 6 masks
• Lithography
• Fab types comparison: infrastructure & equipment
• MicroLED in CMOS fabs
• Transfer and assembly technologies p124

6
TABLE OF CONTENTS
• Overview p125
• Major types and key attributes of transfer processes
• Challenges
• Pick and place processes p129
• Sequence and challenges
• Transfer sequences
• Transfer arrayVs. display pixel pitch
• Throughput and cost drivers
• Direct transfer vs. interposer
• Interposer and yields
• Other use of interposers.
• Example (X-CeLeprint)
• Continuous/ semi-continuous assembly p141
• Overview
• Laser-based sequential transfer
• QMAT-TESORO
• Uniqarta
• GLO
• Optovate
• Self assembly p150
• Fluidic self assembly
• Example: Sharp/ELUX
• Summary p154
• Intellectual property landscape
• Selectivity
• Major transfer processes: most mature
• Transfer processes: others
• Conclusion
• Transfer and assembly equipment p165
• Introduction
• Traditional single chip tools
• Assembly environment
• Specific challenge for mass transfer
• Bulk microLED arrays p171
• Full array level microdisplay manufacturing.
• Hybridization & bonding process
• Wafer level bonding
• Monolithic integration of LTPS TFT: lumiode
• 3D integration: Ostendo
• Yields and costs
• Color generation in bulk arrays

7
TABLE OF CONTENTS
• Pixel repair p183
• Emitter redundancy
• Example of repair strategies
• Defect management strategies
• Light extraction and beam shaping p189
• Optical crosstalk
• Emission pattern, viewing angle and power consumption
• Emission pattern and color mixing
• Die-level light management
• Array-level beam shaping
• Color conversion p204
• Overview
• Phosphors
• Quantum dots
• Flux requirements
• Patterning and deposition
• Backplanes and pixel driving p214
• Introduction
• Channel materials for microLED displays
• Mobility vs display specifications
• Stability and signal distortion
• Pixel density
• Analog driving: microLED driving regime
• MicroLED-specific challenges
• Illustration: 75” 4K TV, QHD smartphone
• Digital driving: introduction
• Digital driving: benefits & challenges
• Hybrid driving
• AnalogVs digital: summary
• TFT versus discrete micro IC.
• Cost zspects
• Cost reduction path
• Conclusions
• Economics of microLED – cost down paths p240
• Baseline hypothesis and sensitivity
• Television p247
• Cost target and price elasticity
• 75” TV panel assembly strategies
• Yield impact
• Very large panels
• Benefit of sequential transfer
• Interposers
• Die size
• Cost-down path

8
TABLE OF CONTENTS
• Smartphones p265
• Cost target
• Illustration: 6” QHD phone panel
• Key outputs
• Die size optimization
• Interposers
• Applications and markets for microLED displays p277
• MicroLED attributes vs application requirement
• Application roadmap
• SWOT per application
• Key hypothesis for equipment forecast
• 2017-2027 microLED adoption forecast
• AR, MR andVR p284
• The reality-to-virtual-reality continuum.
• Market volume headset forecasts forVR and aR
• MicroLED adoption and volume forecast
• Head up displays
• Smartwatches p290
• Smartwatch volume forecast
• MicroLED Adoption and volume forecast
• Smartphones p294
• Who can afford a smartphone?
• Smartphone panel volume forecast
• Mobile phones: display for differentiation
• Foldable smartphones
• MicroLED adoption and volume forecast
• TVs p301
• The “Better Pixel”
• Resolution
• TV panel forecast
• 8K adoption
• MicroLED adoption and panel volume forecast
• Others: tablets, laptops, monitors p310
• Overview
• Tablets
• Laptop and convertibles
• Desktop monitors
• Wafer and equipment forecast p315
• Epiwafer
• MOCVD
• Transfer equipment

9
TABLE OF CONTENTS
• Competitive landscape p322
• Time evolution of patent publications
• Leading patent applicants
• What happened In the last 18 months
• Time evolution of patent applications per company
• Breakdown by company headquarters
• Positioning of established panel makers
• Breakdown by company type
• Supply chain p332
• Overview
• Capex aspects
• Supply chain requirement
• Front END (LED Manufacturing)
• Back end: backplane, assembly and module.
• Supply chain scenarios
• Intellectual property
• Conclusion

10
SCOPE OF THE REPORT
This report
provides an
extensive review
of µLED display
technologies and
potential
applications as
well as the
competitive
landscape and key
players.
Smartwatches and
wearables
Virtual reality
Large video
displays
TV
Smartphones
Laptops and
convertibles
Automotive HUD
Augmented/Mixed
Reality
LG
Samsung
HP
BMW
Microsoft
Oculus
Apple
Tablets
Acer
The report does not cover
non-display applications of
µLED:AC-LEDs, LiFi,
Optogenetics, Lithography,
lighting…
MicroLED TV prototype (Sony, CES 2012)
Contrary to the 2017
edition, this report does not
cover applications in large
LED videowalls: those will be
discussed extensively in our
upcoming report on
miniLED applications and
technologies

11
SCOPE OF THE REPORTChips
(toscale)
Packages
(Nottoscale)

12
WHO SHOULD BE INTERESTED IN THIS REPORT
• LED supply chain: sapphire makers, MOCVD
suppliers, epi-houses.
• Understand the µLED display opportunity
• What does it entail for the LED supply?
• What are the technical challenges?
• How can my company participate in this emerging
opportunity?
• Who should we partner with?
• R&D Organizations and Universities
• Understand the market potential of your
technologies for this emerging market
• Identify the best candidates for collaboration and
technology transfer.
• OEMs/ODMs
• What are the potential benefits of µLED displays?
• Are they a threat or an opportunity for my
products?
• When will they be ready
• Should I get involved in the supply chain.
• Display Makers and supply chain
• Hype versus reality: what is the status of µLED
displays? What can we expect in the near
future?
• Are they a threat to my LCD and OLED
investments?
• Which display applications and markets can
µLED displays address? A detailed roadmap.
• Find the right partner: detailed mapping of the
µLED ecosystem and supply chain
• OSAT and foundries
• Are µLED a new opportunity for my
company?
• Venture capital, financial and strategic
investors.
• Hype versus reality. Understand the
technology and the real potential.
• How is the supply chain shaping up?
• Identify the key players and potential
investment targets.
• Could µLED hurt my existing investments?

13
MAJOR MANUFACTURINGTECHNOLOGY BRICKS
Pixel AssemblySubstrate Defect
Management
Pixel
Driving
100 - 150 mm
Sapphire
200 - 300 mm
Silicon
Single wafer
Multi wafer
Monolithic
Arrays
Massively
Parallel Pick
and Place
Semi-
continuous
Pixel
Redundancy
Pixel Repair
Si-
CMOS
TFT
Epitaxy & wafer
processing
• Hybridization
• Monolithic
Integration
• Electrostatic
• Electromagnetic
• Magnetic
• Adhesive…
• Fluidic assembly
• Film cartridges
• Flexographic
• Laser…
• LTPS
• Oxide
• Pick and replace
• Add repair
Epi
Mask
Aligners
Steppers
Litho
Repair
Contactless
Optical (PL)
Contactless
Electrical (EL)
Test
Backplanes
Micro
Drivers
Color
Light Extraction
& shaping
Quantum
dots
Nano-
phosphor
Optically
pumped
quantum
wells
Direct
RGB LED
Colorconversion
Die Level
(shaping,
mirrors)
External optics
Testing and
binning
Die-level
(KGD map)
Transfer
field level
Binning
Interposers
with KGD
KGD transfer
only [1]
[1]: need Known Good Die (KGD) map and addressable transfer process
Pixel bank
level (mirrors,
black matrix)

14
MicroLED DISPLAYS TECHNOLOGY EVOLUTION
Cree:
Micro-led arrays with
enhanced light extraction University of Strathclyde:
active matrix and color
conversion
HKUST: Full color with
phosphor conversion
LETI: Monochrome active
matrix > 2000 PPI
Ostendo:
full RGB 5000 PPI
Sony:
55” FHD
microLEDTV at
2012 CES

15
ASSEMBLY
• The art of making µLED displays consists in processing a bulk LED substrate into an array of micro-LEDs which are
poised for pick up and transfer to a receiving substrate for integration into heterogeneously integrated system: the
display (which integrates, LEDs, transistors, optics, etc.). Epiwafers can accommodate 100’s of millions of µLED chips
compared to 1000’s with traditional LEDs.
• The micro-LEDs can be picked up and transferred individually, in groups, or as the entire array of 100,000’s of
µLEDs:
Monolithic
integration of
µLED arrays is
preferred for
the realization
of displays
with high pixel
densities.
Pixel Per Inch
0 1000 2000 3000 4000
Si-CMOS Backplane
µLED array
Backplane
Hybridization
Low to Mid Pixel density: Pick and Place High Pixel Density: Monolithic Array Integration
OculusOppo
AppleSamsung
Projection micro display
Microsoft
AR/MRTV Wearable Smartphones VR
Laptop/
Tablets
LTPS or Oxide TFT backplane
µLED epiwafer
µLED epiwafer

16
TRANSFER FIELDS AND INTERPOSERS
Yield loss = hatched surfaces +
transfer fields where the number n
of KBD and point defects exceeds
specification.
Transfer field with ≥ n point defect
are eliminated.
Transfer directly to backplane or create interposers with transfer fields
that are within the wavelength bin and ≤ n KBD/point defects.
Some bad die are transferred and need to be repaired.
Epiwafer wavelength homogeneity
and defective die map.
If individual functional die testing
not available, use PL + traditional
surface inspection.
Interposer with only good
transfer fields

17
DEFECT DENSITY
For the smallest
die required for
TV or
smartphone
applications, the
largest
allowable defect
size will fall
below 1 µm
• The actual specification and the maximum acceptable defect
size will depend on:
• The die size
• The chip structure
• The yield and defect management strategy adopted by each
manufacturer: driven by cost of ownership (cost of increasing
yield vs managing defects)
• A plot of a simple Murphy defect density model with a
triangular distribution shows that to get 90% of 1x1 cm2
transfer fields defect free, the defect density needs be ≤
0.1/cm2.
• For 2x2 cm2 transfer fields, the requirement increases to
<0.03 defect/cm2. Larger stamps quickly lead to unacceptable
wafer yield losses and/or unrealistic demands on defect
density and can only be envisioned if efficient downstream
yield management and repair techniques can be deployed.
• Regarding defect size, abiding by the 1/5th rule used in
semiconductor manufacturing, a 3x3 µm µLED will likely
require ~1 µm features or less, which could be bringing the
acceptable defect size to about 0.2 um. Even if more relaxed
targets are acceptable, 0.5-0.8 µm seems like a reasonable
range.
Above: plot of a simple Murphy defect density model with a
triangular distribution. This model is widely used in the
semiconductor industry for estimating the effect of process defect
density. More complex models should be used to account from
the fact that defects often ten d to appear in clusters etc.

18
Substrate
n-GaN
MQW
p-GaN
Mask#5: opening of the sacrificial layer
(about 1 x 1 µm), dry etching (CF4 or NF3) or wet
etching (more likely to produce the overhang)
Substrate
n-GaN
MQW
p-GaN
Stabilization layer deposition:
Spin coating of thermosetting material such as
benzocyclobutene (BCP) + adhesion layer (e.g.:AP3000
from Dow chemical). Cured to 70% so it doesn’t reflow
Carrier wafer bonding
(Semi-cured stabilization layer provides sufficient
adhesion)
Substrate
n-GaN
MQW
p-GaN
Carrier Substrate
n-GaN
MQW
p-GaN
Carrier Substrate
Epitaxial substrate removal (LLO)
n-GaN
MQW
p-GaN
Carrier Substrate
n-GaN dry etching or CMP
n-GaN
MQW
p-GaN
Carrier Substrate
Mask #6: deposition and patterning of ohmic
contacts (NiAu or NiAl, typ. 50 Å thick)
Annealing at 320 deg. C. for 10 minutes
Ohmic contacts
n-GaN
MQW
p-GaN
Carrier Substrate
ITO deposition (typ. 600 Å thick)
n-GaN
MQW
p-GaN
Carrier Substrate
Planarization resist
n-GaN
MQW
p-GaN
Carrier Substrate
Resist is stripped (wet etching or plasma ashing) until the ITO and the
passivation layers are removed from the bottom of the large mesa,
exposing the sacrificial layers. Residual resist is then fully stripped
EXAMPLE OF PROCESS FLOW – APPLE 6 MASKS

19
Marginal
CHIP MANUFACTURING: SUMMARY
µLED displays
might require a
paradigm shift
from traditional
LED
manufacturing
to silicon
CMOS-type of
environment
and tools.
Plasma Etching
Lithography
Clean Room
Traditional LED
Manufacturing
µLED Display Manufacturing
Sidewall quality not critical to LED
efficiency. High tolerance for particles
xxxxxxxxxxxx
Mask aligners, single shot xxxxxxxxxxxx
Class 10,000 and above xxxxxxxxxx
Laser Lift Off
(sapphire-based platform)
xxxxxxxxxxxx
Wafer Bonding Marginal xxxxxxxxxxxx
Substrate
platform
Sapphire dominant
Little opportunity for Silicon
xxxxxxxxxxx
Testing PL + EL Probe testing xxxxxxxxxxxxx
Paradigm
shift?

20
KEY ATTRIBUTES OF TRANSFER PROCESSES
Throughput
• Cycle time
• Number of die
per cycle
Yields
• Pick up
• Drop off
• Assembly/Inter-
connect
Capability
• Die size
• Die Shape
• Placement
accuracy
KGD
compatibility
• Individual die
addressability
• Interfacing with
inspection/test
equipment –
KGD map
Intellectual
Property
• Freedom of
exploitation
• Licensing
Cost
• Equipment cost
• Footprint
• Consumables
(transfer stamp
etc.)
Cost of Ownership

21
DIRECT TRANSFERVS. INTERPOSER
Red, Green, Blue LED
Epiwafers
Transistor backplane (TFT, direct hybridization on Silicon…)
Interposers (intermediate carriers) or various forms of pixel “banks”
can be used for:
- Binning / yield management purpose
- Intermediate pitch step up
- Pre-assembly of RGB or RGB + driver IC sub-assembly

22
TRANSFER AND ASSEMBLY
• As of Q2-2018, massively parallel pick and place methods are the
most mature, lead by X-Celeprint and Apple with passive (PDMS
stamps) and active (MEMS) transfer head respectively. Various other
companies have demonstrated display prototypes assembled with
similar technologies: XXX, XXX, XXX and probably more who
haven’t publically shown their work.
• Semi-continuous or self assembly processes have also been pitched
and/or demonstrated by a variety of companies including Vuereal
and eLux.
• Semi-continuous process reduce the cycle time by reducing or
eliminating the X-Y print-head motion steps between donor and
receiver substrate (see discussion in the “Cost Analysis” section of
this report).
• Laser transfer potentially offers compelling benefits such as high
throughput and compatibility with KGD yield management
strategies. But development is less advanced than massively parallel
P&P. To our knowledge, glō is so far the only company to have
realized display prototypes using the concept.
Massively
parallel P&P
technologies
are the most
mature.
Massively Parallel P&P Leading companies
Continuous/Semi-Continuous and self
assembly
Laser Processes

23
TRANSFER PROCESSES: MOST MATURE
xxxxxx xxxxxxx xxxxxxxxxx xxxxxxxx
Type • Pick & Place • Pick & Place • Self Assembly • Sequential
Sub-type • xxxxx • xxxxxx • xxxxxx • xxxxxx
Cycle time • 10-15s (est) • 30s, target 10s • Continuous • Continuous
Scalability
• Small to mid size stamps (1-2”?)
• Probably challenging to scale up (
• Up to XX cm stamp demonstrated but
unknown impact on yield, placement
accuracy and cycle time
• Current work on XXX tool delivers
50M die/hr throughput.
• Wafer size (up to 6”)
Placement
accuracy
• ? • ±1.5µm 3 • ~ ± 2.5 µm (determined by xxxxx) • ±1.0 µm
Constrain on
die structure
• Flat top surface required
• Horizontal or vertical
• Flat top surface required
• Tether and anchors
• Horizontal or vertical
• Horizontal LED
• Circular geometry preferred.
• Vertical LEDs
Yield status
(Q12018)
• ? • 3N to 4N • 2N8 • > 4N
Die Size • As small as 3 µm • As small as 3 µm
• As small as 10 µm but perform
better above 20-40 µm
• 2 to 20 µm
Active stamp [2] • xxxxxxxx • No • NA • Yes. Placement selectivity
KGD
management
• xxxx
• Via additional step to eject bad die from
the stamp.
• Die binned/sorted upstream (laser
lift off)
• Yes (placement selectivity)
Strengths • Possible high accuracy
• Low cost stamp
• Possibly scalable
• Potentially very cost-effective • KGD management, throughput
Limitations
• High cost stamps
• Scalability (large areas?)
• Not addressable
• Die size can affect cycle time
• Best for low PPI (0.2 to 1 mm pitch)
• Large die
• Need transparent substrate
(sapphire or interposer)

24
HYBRIDIZATION: EXAMPLES OF BONDING PROCESS
Hybrid bonding: Cu + oxide
Hybrid bonding: Cu + Polymer
Microtube bonding
Hybridized active-matrix GaN 873 x
500 pixel microdisplay at 10 μm pitch
using microtube bonding (LETI)

25
EMISSION PATTERN AND COLOR MIXING
• If the red, green and blue emitters have different light emission patterns, the color calibration performed at one angle (typically
perpendicular to the display plane) will shift when viewed off-angle as the relative intensities of R,G,B viewed in that given
direction will changes.
• This issue often occurs when the red emitter is formed from a different material (InGaAlP) and has a different structure than
the green and blue die (InGaN).
[1]:
30
60
90
-30
-60
-90
0
Hypothetical beam pattern of Red, Blue and Green emitters (not actual, illustration purpose):
the relative intensity of the red green and blue emitters at 0 degree and 30 or 60 degrees varies,
resulting in a shift of color balance at those different angles.
(Source:Yole Development)

26
FLUX REQUIREMENTS
Max Display
Brightness
(Cd/m2)
Pixel
Density
(PPI)
LED Chip
Size
Optical Flux at
LED surface [1]
(W/cm2)
Driving
current
(A/cm2)
TV 4k 5000 80 X µm xxx-xxx xxx-xxx
TV 8K 5000 100 X µm xxx-xxx xxx-xxx
Wearable 1500 300 X µm xxx-xxx xxx-xxx
Smartphone 1500 500 X µm xxx-xxx xxx-xxx
RGB AR/MR
(State of the art)
5,000 3000 X um xxx-xxx xxx-xxx
RGB AR/MR
(Goal)
500,000 5000 X µm xxx-xxx xxx-xxx
Likelihood
that
quantum
dots color
conversion
be
adopted
[1]: for all applications, it is assumed that the downconverter is deposited directly at the surface of the pixel (discussion next page). In addition, an overall
optical efficiency of 60% for the red and green pixels and 80% for blue (unconverted) was assumed.
[2]: optimal efficiency with GaN LED is achieved with current density in the 1-10 A/cm2 range. For applications where the required driving current is
significantly below that range, the LED will likely be driven in pulsed mode, ie at higher current density with a low duty cycle

27
INTRODUCTION
• The different functions required for active display
driving are shared between discrete ICs positioned
at the edges or behind the panel and Thin Film
Transistor (TFT) circuitry deposited directly onto
the display substrate (=backplane).
• Emissive displays such as OLED or microLED are
current-driven. The simplest mode of operation for
the TFT circuit requires 2 transistors and 1 capacitor
(2T1C).
• However, very small variations in current result in
visible brightness differences visible by the human
eye. The 2T1C simple design doesn’t compensate for
pixel to pixel variations in the threshold voltage,
carrier mobility, or series resistance that result from
TFT processing or from variability in the emitters
(LED or OLED)
• Compensation schemes relying on a larger number
of transistors per pixel (up to 7 in some designs) are
therefore used. The complexity of the TFT however
can be reduced in some designs by offloading some
of the compensation function onto external ICs [1].
Driving emissive
displays (OLED,
µLED) requires
complex
compensation
schemes
Row Driver
Column
Driver
Timing
Controller
Gamma circuit
Test circuits
etc.
Power
TFT
Pixels
Simple, non compensated pixel circuit
with 2 transistors [1]
Example of a 4 transistor
compensated circuit [1]
[1]: Source:“AM backplane for AMOLED”; Min-Koo Han, Proc. of ASID ’06,
Simple block diagram for display driving
Other circuits
[1]: LG OLEDTV for example are driven by 2T1C circuit with compensation performed by external ICs

28
ILLUSTRATION: 75” 4K TV
• MicroLED makers usually strive to:
• Use the smallest die possible to minimize cost.
• Operate close to peak efficiency in the typical brightness
range of the display.
• For a 75” 4K TV, a 1000 Nits brightness can be
achieved with XX µm die operated near peak
efficiency at XX A/cm2 (blue and green chips).
• At this average brightness level, the current per chip is
XX µA.
• For the lowest and highest brightness levels, the
current range between XX nA and XX nA
Panel characteristics
• 75 Inch diagonal
• 4K resolution (3840x2160)
Die size 5 x 5 um
Peak Brightness 3000 nits
Average Brightness 1000 nits
Lowest brightness 3 nits
LED emission pattern Lambertian (120 ° APEX angle)
Optical efficiency (Photon losses in
pixel cavity, external optic etc..)
80%
Display
Brightness
Current Density Current EQE
Low (3 Nits) XXX A/cm2 XX µA 14%
Average (1000
Nits)
XXX A/cm2 XX µA 22%
Peak (3000
Nits)
XXX A/cm2 XX µA 19%
20%
10%

29
TFTVERSUS DISCRETE MICRO IC.
• Another debate is whether TFT used for OLED panel driving (LTPS for smartphones and wearable, Oxide for TVs) are
suitable for microLED.
• Due to the non linear characteristics of microLED, the different ranges of operating currents and the added complexity
of using 2 types of semiconductors in RGB solutions (InGaN and InGaAlP), driving circuits will likely be more complex
than OLED and integration with traditional TFT be more challenging.
• Apple/Luxvue and X-Celeprint have both suggested using discrete Si-Based microdrivers to drive the pixels. X-
Celeprint has demonstrated multiple display prototypes using this concept.
Sub pixel with 2x µLED redundancy
IC driver
A µLED display where discrete ICs
positioned on the front face drives groups of
12 subpixels featuring a 2x redundancy.
(Source: LuxVue patent US 9,318,475)
Patent XXX from XXX [1]
[1]: we believe that XXX is a company created by Apple and under which name its has been filing its microLED patents after 2015

30
COST ANALYSIS: INTRODUCTION
• At the current stage of maturation of the
industry, there are still many plausible technology
and process choices. This precludes
comprehensive cost modeling.
• However, there are some fundamentals that
anchor all those processes: alignment dominates
assembly cycle times, die size can’t get infinitely
small, and epitaxy has already been through a
more than 20 years cost reduction curve.
• Basic cost analysis can therefore be performed
to narrow the process space to a more
economically realistic window.
• The objective of this section is to provide such
analyses for the major building blocks and cost
contributors in to order validate the fundamental
economics of microLED displays and identify
credible cost-down paths and targets.
• The effort is focused on the 2 high volume
applications where microLEDs have the most
potential to both disrupt the existing display
chain and generate large, new business
opportunities:TV and Smartphones.
Many unknowns
in term of
technological
choices prevent
detailed cost
modeling but a
high level
analysis can still
provide valuable
insights
By defining cost targets and performing a basic cost analysis within realistic
process parameters, it is possibly to narrow the size of the process windows
compatible with economical targets for each application.
Current microLED process window
Realistic process window narrowed
down with high level cost analyses
Product and
volume
manufacturing
-compatible
process
window
Die:
Size,cost,redundancy,yield…
Assembly:
Cycle time, yield, stamp size, sequential/continuous, self assembly, redundancy…

31
75” TV PANEL ASSEMBLY STRATEGIES
75”TV Panel
• 18 transfer field per wafer
• 72% of the wafer surface used
12.73 x 12.73 mm2 transfer stamps
• 86 transfer fields per wafer
• 86% of the wafer surface used 9694 transfer cycle per color
• 1 transfer field per wafer
• 64% of the wafer surface used
2442 transfer cycle per color
170 transfer cycle per color
Drawings approximately to scale
We first consider the following 3 assembly scenario with increasing transfer stamp sizes and no interposers:

32
SEQUENTIAL TRANSFER – 4NYIELD

33
CAPEX
Investment to
set up a
microLED fab
should be at
least on par and
most likely lower
than that of an
OLED or even
Oxide TFT LCD
Fab

34
COST TARGET
• The microLED die +
assembly budget to strictly
match OLED by 2022 is
around ~$XX.
• If microLED can deliver
unique and desirable
features that no other
panel technologies can
offer (e.g.: sensing
functionalities, superior
and local brightness
adjustment, reduced
power draw etc.), this
cost budget could increase
up to $XX, after
budgeting for additional
cost related to those new
functionalities
(microsensors etc)

35
MICROLED APPLICATION ROADMAP
Smartphone
• xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx.
• xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx.
• xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx
xxxxxxxxxxxxxxx.
Smartwatch and wearables
• xxxxxxxxxxxxxxxxxxxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxx
xxxxx.
xxxxxx.
xxxxxxxxxxxxx.
Tablets and laptop
• xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx
xxxxxxxxxx
• xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx
xxxxxxxxxxxxxxxxxxxx.
• Xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx.
2020 Longer term2022
High endTVs and monitors (4K, HDR)
• xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx.
• xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx.
• xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx
xxxxxxxxxxxxxxxxxxxxx.
AR/MR HMDs
xxxxxx.
xxxxxxxxx.
xxxxxxxxxxxxx.
xxxxxxxxxxxxxxx.
Now
(2018)
Automotive HUD
• Xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx
xxxxxxxxxxxxxxxxx.
Small pitch (<2mm)
large video displays.
• Brings significant
performance improvement
(contrast) and potential
cost reduction (eliminates
LED package)
• Large die OK (30 µm) but
low transfer efficiency.
• Available from Sony since
2017:
2023+
Other Automotive Displays
• xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx
xxxxxxxxxxxxxxxx
2024+
Virtual Reality
(VR)
• High cost.
• Limited benefits
vs OLED.
2021

36
MICROLED TV PANELVOLUME FORECAST
Distinguishing
8K is important
since they
feature 4x more
microLED die
than 4K panels

37
BREAKDOWN BY COMPANYTYPE

38
RELATED REPORTS

MicroLED technology could match or exceed
OLEDs for most key display attributes. However,
it is also an inherently complex technology.
Manufacturing a 4K resolution display implies
assembling and connecting 25 million microLED
chips the size of large bacteria without a single
error, with placement accuracy of 1 µm or less.
This challenge alone appears daunting, but many
others were still seen as potential showstoppers
as recently as early 2017. Eighteen months later,
some assembly technologies are delivering close to
99.99% or 99.999% yields, and small die efficiency
is approaching or exceeding that of OLEDs.
MOCVD reactor suppliers also have credible
roadmaps to deliver tools with the capabilities
and cost ownership that the industry needs. Color
conversion and other aspects are also progressing.
Increasingnumbersofcompaniesaredemonstrating
prototypes. Most are microdisplays on CMOS
backplanes but the number of “large” displays
prototypes is increasing as well, whether they are
using discrete microdrivers like X-Celeprint or
thin-film transistor (TFT) backplanes like AUO
and Playnitride.
Many are still focusing on realizing their first
prototype, but the most advanced have realized
that bringing up the technology from the level of
functioning demo to consumer-grade products
might require more effort than anticipated. Among
others, driving microLEDs is more complex than
OLEDs and using standard low temperature
polysilicon (LTPS) or oxide TFT backplanes might
not be as straightforward as expected.
The report presents a comprehensive analysis of all
critical technology blocks with a focus on the most
recent advancements, emerging options and remaining
challenges.
MICROLED DISPLAYS 2018
Market & Technology report - July 2018
MICROLED TECHNOLOGY IS NOT READY YET - BUT IS PROGRESSING
ON ALL FRONTS
MicroLED technology advances enable a credible cost reduction path toward high volume applications.
KEY FEATURES
• Detailed analysis of MicroLED
technologies
• Key players
• Intellectual property
• Supply chain
• MicroLED die and assembly cost
analysis for TVs and smartphones
• MicroLED display applications:
Strength, weakness opportunity
and threat (SWOT) analysis,
roadmap and forecast for
TVs, smartphones, wearables,
augmented, mixed and virtual
reality, laptops, tablets and
monitors, plus detailed forecast
through 2027
• Wafer, MOCVD reactor and
transfer equipment demand
forecast
WHAT’S NEW
• Technology update: recent
progress and status on epitaxy,
chip manufacturing, microLED
efficiency, mechanical, laser-
based and self-assembly transfer
processes, light management and
color conversion
• Yield and defect management:
What are the reasonable targets
for microLEDs?
• Can Thin Film Transistor (TFT)
backplanes be used to drive
microLED displays? Specific
challenges in comparison to OLED
displays
• Cost analysis: Can microLED TV or
smartphone display manufacturing
costs be compatible with these
applications? Which cost reduction
paths are realistic?
• Updated adoption roadmap and
volume forecast
(Yole Développement, July 2018)
Sony’s demonstration of a full HD 55” microLED
TV at CES 2012, more than six years ago, was the
first exposure for microLED displays and generated
a lot of excitement. Since Apple acquired Luxvue in
2014, many leading companies such as Facebook,
Google, Samsung, LG or Intel have entered the
gameviasizableinternaldevelopments,acquisitions,
like those of mLED and eLux, or investments in
startups such as glō or Aledia.
Analyzing Apple’s microLED patent activity shows
that the company essentially halted its filing around
2015. This is a surprising finding in the light of
the fact that the consumer electronics giant has
maintained a large project team and consistently
spent hundreds of millions of dollars annually on
microLED development. A closer analysis however
brought up the name of a possible strawman entity
used by Apple to continue filing patents and shows
that the company is still advancing key aspects of
microLED technologies.
Major microLED display yield contributors
APPLE IS STILL THE BEST POSITIONED TO BRING HIGH VOLUME
CONSUMER MICROLEDS TO MARKET
Total
microLED
Process
Yield
=
Assembly /
Interconnect
Faulty
connections
to the
backplane
Dead, missing or
always -on pixel
X
Die not
properly
picked up or
positioned
on the
backplane
Dead or
missing pixel
X
Transfer
MicroLED
epitaxy
Pits,
scratches,
particles,
other epi
defects…
Dead or
dim pixels
X
Lithography
(particles),
etching,
deposition,
etc.
Dead or
dim pixels
MicroLED
chip Others
X
Panel
assembly,
color
conversion
…
Upstream yield management:
Identify and remove bad die
X
X
X
X
Avoid blind printing:
Transfer only good die

MICROLED DISPLAYS 2018
TECHNOLOGY ADVANCEMENTS PAVE THEWAY FORVARIOUS COST REDUCTION
PATHS TOWARDVOLUME MANUFACTURING, BUT NONE ARE STRAIGHTFORWARD
Dozens of technologies are being developed for
microLED assembly and pixel structures. The cost
and complexity range can be staggering. However,
there are some fundamentals that anchor all those
processes. Alignment dominates assembly cycle
times, die size can’t get infinitely small, epitaxy cost
has already been through more than 20 years on
the cost reduction curve. Cost analysis therefore
allows companies to narrow the process parameters
down to economically realistic windows and identify
efficient cost reduction strategies.
MicroLED companies must understand the cost
targets for each application and work backward,
making process choices and developing each step
so it fits the cost envelope. Processes that can’t
deliver the right economics will disappear. If none
can deliver the right economics, the opportunity
will never materialize. MicroLED is entering the
valley of death between technology development and
industrialization and commercialization.
As the technology improves, there are credible
cost reduction paths for microLED to compete in
the high-end segment of various applications such
as TV, augmented and virtual reality (AR/VR) and
wearables. With the right approaches, assembly cost
could become a minor contributor. For smartphones,
however, approaching OLED cost implies pushing
microLEDs toward what is likely to be the limits
of the technology in term of die size. To succeed,
microLEDs will have to count on some level of price
elasticity. It must deliver performance and features
that no other display technology can offer and that are
perceived by the consumer as highly differentiating.
Microdisplays for AR and head-up displays (HUD)
will be the first commercial applications, followed by
smartwatches. TVs and smartphones could follow
3-5 years from now.
The report features a detailed analysis of the contribution
of die and assembly costs, looking at factors such as die
size, redundancy, yield and assembly strategy for both TV
and smartphone applications.
Despite a later start compared to pioneers such as
Sony or Sharp, Apple’s portfolio is one of the most
complete, comprehensively covering all critical
technologies pertinent to microLEDs. The company is
the most advanced and still one of the best positioned
to bring high volume microLED products to the
market. However, it also faces unique challenges:
• It can’t afford to introduce a product featuring such
a highly differentiating technology that is anything
but flawless.
• It requires high volumes, which makes setting up the
supply chain more challenging than for any other
company.
• It has no prior experience in display manufacturing
and due to its need for secrecy, has to develop
pretty much everything internally, duplicating
technologies and infrastructures that others have
the option to outsource.
The report provides a detailed overview of key players
and analysis the challenges associated with setting up an
efficient microLED display supply chain, including front
end and display assembly.
Apple microLED patent portfolio as of December 2017
Note: 1 patent can belong to
multiple categories.
IC drivers,
20
10
20
30
40
50
60
70
80
Total #
of fam
ilies
Epitaxy
Chip
structure

m
anufacturing
Transfer
interconnect
Color conversion
Light extraction
/ shaping
Pixel or display architecture

driving
D
efect m
anagem
ent
repair
Testing
Sensors in
display
Numberoffamilies
71
10
47
4 5
17
4 6
This analysis has been performed by KnowMade, part of Yole Group of Companies.
Current
confinement,
nanowire, reduced
sidewall
recombination…
Redundancy
Schemes
Color
conversion
layers
IR sensors
MicroLED displays technology: cost reduction path
for 75-inch 8K TV with 99.99% (4N) yield
100
71
65
52
20
-
20
40
60
80
100
Small stamp
10 m die
Medium stamp
10 m die
Large stamp
10 m die
Interposer
10 m die
Interposer
5 m die
Transfer cost Die cost Repair cost (4N yield)
5x Reduction
Arbitraryunit
A complete analysis and figures in value are detailed in the report.
Reference technology
75 8K TV die assembly cost

MARKET TECHNOLOGY REPORT
COMPANIES CITED IN THE REPORT (non exhaustive list)
Aixtron (DE), Aledia (FR), Allos Semiconductor (DE), AMEC (CN), Apple (US), AUO (TW),
BOE (CN), CEA-LETI (FR), CIOMP (CN), Columbia University (US), Cooledge (CA), Cree (US),
CSOT (CN), eLux (US), eMagin (US), Epistar (TW), Epson (JP), Facebook (US), Foxconn (TW),
Fraunhofer Institute (DE), glō (SE), GlobalFoundries (US), Goertek (CN), Google (US), Hiphoton
(TW), HKUST (HK), HTC (TW), Ignis (CA), InfiniLED (UK), Intel (US), ITRI (TW), Jay Bird Display
(HK), Kansas State University (US), KIMM (KR), Kookmin U. (KR), Kopin (US), LG (KR), LightWave
Photonics Inc (US), Lumens (KR), Lumiode (US), LuxVue (US), Metavision (US), Microsoft (US),
Mikro Mesa (TW), mLED (UK), MIT (US), NAMI (HK), Nanosys (US), NCTU (TW), Nichia (JP),
Nth Degree (US), NuFlare (JP), Oculus (US), Optovate (UK), Osterhout Design Group (US), Osram
(DE), Ostendo (US), PlayNitride (TW), PSI Co (KR), QMAT (US), Rohinni (US), Saitama University
(JP), Samsung (KR), Sanan (CN), SelfArray (US), Semprius (US), Smart Equipment Technology (FR),
Seoul Semiconductor (KR), Sharp (JP), Sony (JP), Strathclyde University (UK), SUSTech (CN), Sun
Yat-sen University (TW), Sxaymiq Technologies (US), Tesoro (US), Texas Tech (US), Tianma (CN),
TSMC (TW), Tyndall National Institute (IE), Uniqarta (US), U. Of Hong Kong (HK), U. of Illinois
(US), Veeco (US), VerLASE (US), V-Technology (JP), VueReal (CA), Vuzix (US), X-Celeprint (IE)...
and more.

Executive summary 10
Introduction to microLED displays 51
MicroLED display manufacturing yields 63
MicroLED epitaxy (FE Level 0) 79
Chip manufacturing and singulation (FE Level 1) 96
MicroLED singulation 97
MicroLED efficiency 104
MicroLED chip manufacturing 112
Transfer and assembly technologies 124
Overview 125
Pick and place processes 129
Continuous/semi-continuous assembly 141
Self assembly 150
Summary 154
Transfer and assembly equipment 165
Bulk microLED arrays 171
Pixel repair 183
Light extraction and beam shaping 189
Color conversion 204
Backplanes and pixel driving 214
Economics of microLED – cost
reduction paths 240
Television 247
Smartphones 265
Applications and markets for microLED
displays 277
AR, MR and VR 284
Smartwatches 290
Smartphones 294
TVs 301
Others: tablets, laptops, monitors 310
Wafer and equipment forecast 315
Competitive landscape 322
Supply chain 332
TABLE OF CONTENTS (complete content on i-Micronews.com)
AUTHOR
Dr. Eric Virey serves as a Senior
Market and Technology Analyst at Yole
Développement (Yole), within the
Photonic Sensing Display division. Eric
is a daily contributor to the development
of LED, OLED, and Displays activities,
with a large collection of market and
technology reports as well as multiple
custom consulting projects. Thanks to its
deep technical knowledge and industrial
expertise, Eric has spoken in more than 30
industry conferences worldwide over the
last 5 years. He has been interviewed and
quoted by leading media over the world.
Previously Eric has held various RD,
engineering, manufacturing and business
development positions with Fortune 500
Company Saint-Gobain in France and the
United States. Dr. Eric Virey holds a Ph-D
in Optoelectronics from the National
Polytechnic Institute of Grenoble.
Find more
details about
this report here:
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OBJECTIVES OF THE REPORT
Understand microLED display technologies:
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• Key technology bricks and associated challenges, cost drivers
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Which applications could microLED display address and when?
• Detailed analysis and roadmaps for major display applications
• Cost analysis
• How disruptive will microLED be for incumbent technologies?
Competitive landscape and supply chain
• Identify the key players and IP owners in technology development and manufacturing
• Scenario for a microLED display supply chain
• Impact on the LED supply chain
• Impact on the display supply chain

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− RF Standards and Technologies for Connected Objects 2018
− RF Photonic Components Technologies for 5G Infrastructure2018
o REVERSE COSTING® – STRUCTURE, PROCESS COST REPORT– by System
Plus Consulting
− Automotive Radar Comparison 2018
− RF Acoustic Wave Filters 2017 – Patent Landscape Analysis
o LINKED REPORTS – by Yole Développement, System Plus Consulting andKnowMade
− 5G impact on RF Front End Modules and Connectivity for Cellphones 2018 – Market
Technology Report – Update
− RF Front-End Module Comparison 2018 – Structure, Process Cost Report
− RF Front End Modules for Cellphones 2018 – Patent Landscape Analysis
− Advanced RF System-in-Package for Cellphones 2018 – Market Technology
Report – Update*
− Advanced RF SiPs for Cell Phones Comparison 2017 – Structure, Process
Cost Report
− RF GaN Market: Applications, Players, Technology, and Substrates 2018-2023
Market Technology Report – Update
− RF GaN Comparison 2018* – Structure, Process Cost Report
− RF GaN 2018 – Patent Landscape Analysis
SOFTWARE
− Consumer Biometrics: Sensors Software 2018 – Update
− Processing Hardware and Software for AI 2018 - Vol. 1 2
− From Image Processing to Deep Learning, Introduction to Hardware and Software
Update : 2017 version still available / *To be confirmed

IMAGING OPTOELECTRONICS
− Status of the Compact Camera Module and Wafer Level Optics
− Industry 2018 – Update
− 3D Imaging and Sensing 2018 – Update
− Sensors for Robotic Vehicles 2018
− Machine Vision for Industry and Automation 2018
− Imagers and Detectors for Security and Smart Buildings 2018
− Uncooled Infrared Imagers 2017
− iPhone X Dot Projector – Patent-to-Product Mapping
− Status of the CMOS Image Sensor Industry 2018 – Market Technology Report -
Update
− CMOS Image Sensor Comparison 2018 – Structure, Process Cost Report
− CMOS Image Sensors Monitor 2018* – Quaterly Update**
− Camera Module 2017 – Market Technology Report
− Compact Camera Module Comparison 2018 – Structure, Process Cost Report
− LiDARs for Automotive and Industrial Applications 2018 – Market Technology
Report
− LiDAR for Automotive 2018 – Patent Landscape Analysis
ADVANCED PACKAGING
− Status of Advanced Packaging Industry 2018 – Update
− Status of Advanced Substrates 2018: Embedded Die andInterconnects,
Substrate Like PCB Trends
− 3D TSV and Monolithic Business Update 2018 – Update
− Power Modules Packaging 2018 – Update
− Discrete Power Packaging 2018 – Update*
− Status of Panel Level Packaging 2018
− Trends in Automotive Packaging 2018
− Hardware and Software for AI 2018 - Vol. 1 2
− Integrated Passive Devices (IPD) 2018
− Thin-Film Integrated Passive Devices 2018
− Memory Packaging Market and Technology Report 2018 – Update*
− Hybrid Bonding for 3D Stack – Patent Landscape Analysis
o LINKED REPORTS– by Yole Développement and System Plus Consulting
− Advanced RF System-in-Package for Cellphones 2018 – Market Technology Report -
Update*
− Advanced RF SiPs for Cell Phones Comparison 2017 – Structure, Process
Cost Report
− Fan-Out Packaging 2018 – Market Technology Report – Update*
− Fan-Out Packaging Comparison 2018* – Structure, Process Cost Report
MANUFACTURING
− Wafer Starts for More Than Moore Applications 2018
− Equipment for More than Moore: Technology Market Trends
for Lithography Bonding/Debonding 2018
− Polymeric Materials for wafer-level Advanced Packaging 2018
− Laser Technologies for Semiconductor Manufacturing 2017
− Glass Substrate Manufacturing in the Semiconductor Field 2017
− Equipment and Materials for Fan-Out Packaging 2017
− Equipment and Materials for 3D TSV Applications 2017
o LINKED REPORTS – by Yole Développement and System Plus Consulting
− Equipment for More than Moore: Technology Market Trends for
Lithography Bonding/Debonding 2018 – Market Technology Report
− Wafer Bonding Comparison2018 – Structure, Process Cost Report

MEMORY
− Emerging Non Volatile Memory 2018 – Update
− Memory Packaging Market and Technology Report 2018 – Update*
o QUARTERLY UPDATE – by Yole Développement**
− Memory Market Monitor 2018 (NAND DRAM)
o MONTHLY UPDATE – by Yole Développement**
− Memory Pricing Monitor 2018 (NAND DRAM)
o REVERSE ENGINEERING COSTING REVIEW – by System Plus Consulting
− DRAM Technology Cost Review 2018
− NAND Memory Technology Cost Review 2018
− 3D Non-Volatile Memories – Patent Landscape
COMPOUND SEMICONDUCTORS
− Status of Compound Semiconductor Industry 2018*
− GaAs Materials, Devices and Applications 2018
− InP Materials, Devices and Applications 2018
− Bulk GaN Substrate Market 2017
− Power SiC 2018: Materials, Devices, and Applications – Market Technology
Report – Update
− SiC Transistor Comparison 2018 – Structure, Process Cost Report
− Power SiC 2018 – Patent Landscape Analysis
− Power GaN 2018: Materials, Devices, and Applications – Market Technology Report
– Update
− GaN-on-Silicon Transistor Comparison 2018 – Structure, Process Cost Report
− Status of the GaN IP – Patent Watch 2018 Patent Activity 2017
− RF GaN Market: Applications, Players, Technology, and Substrates 2018-2023
– Market Technology Report – Update
− RF GaN – Patent Landscape Analysis
POWER ELECTRONICS
− Status of Power Electronics Industry 2018 – Update
− Discrete Power Packaging 2018 – Update*
− Power Electronics for Electric Vehicles 2018 – Update
− Integrated Passive Devices (IPD) 2018
− Wireless Charging Market Expectations and Technology Trends 2018
− Thermal Management Technology and Market Perspectives in Power
− Electronics and LEDs 2017
− Gate Driver 2017
− Power MOSFET 2017
− IGBT 2017
− Market Opportunities for Thermal Management Components in
Smartphones 2017
o LINKED REPORTS – by Yole Développement, System Plus Consulting
and KnowMade
− Power Modules Packaging 2018 – Market Technology Report – Update
− Automotive Power Module Packaging Comparison2018 – Structure,
Process Cost Report
− Power ICs Market Monitor 2018 – Quaterly Update**
− Power ICs Market Comparison 2018* – Structure, Process Cost Report
BATTERY AND ENERGY MANAGEMENT
− Li-ion Battery Packs for Automotive and Stationary Storage Applications 2018 –
Update
− Status of the Battery Patents – Patent Watch 2018 Patent Activity 2017
o LINKED REPORTS – by Yole Développement and KnowMade
− Solid State Electrolyte Battery 2018 – Market Technology Report
− Solid-State Batteries 2018 – Patent Landscape Analysis
Update : 2017 version still available / *To be confirmed / ** Can not be selected within an Annual Subscription offer

SOLID STATE LIGHTING
− IR LEDs and Lasers 2018: Technology, Industry and Market Trends – Update
− Automotive Lighting 2018: Technology, Industry and Market Trends – Update
− UV LEDs 2018: Technology, Industry and Market Trends – Update
− LiFi: Technology, Industry and Market Trends
− LED Lighting Module Technology, Industry and Market Trends 2017
− CSP LED Lighting Modules
− Phosphors Quantum Dots 2017 - LED Downconverters for Lighting Displays
− Horticultural Lighting 2017
o LINKED REPORTS – by Yole Développement and System Plus Consulting
− VCSELs 2018: Technology, Industry and Market Trends – Market Technology
Report
− VCSELs Comparison 2018 – Structure, Process Cost Report
DISPLAYS
− Quantum Dots and Wide Color Gamut Display Technologies 2018 – Update
− Displays and Optical Vision Systems for VR/AR/MR 2018
− MicroLED Displays 2018 – Market Technology Report – Update
− MicroLED Display – Patent Landscape Analysis
MEDTECH
− BioMEMS Non Invasive Emerging Biosensors: Microsystems for Medical
− Applications 2018 – Update
− Point-of-Need Testing Application of Microfluidic Technologies 2018 – Update
− Neurotechnologies and Brain Computer Interface 2018
− CRISPR-Cas9 Technology: From Lab to Industries 2018
− Ultrasound technologies for Medical, Industrial and Consumer 2018
− Inkjet Functional and Additive Manufacturing for Electronics 2018
− Liquid Biopsy: from Isolation to Downstream Applications 2018
− Chinese Microfluidics Industry 2018
− Scientific Cameras for the Life Sciences Analytical Instrumentation
Laboratory Markets 2018*
− Artificial Organ Technology and Market 2017
− Connected Medical Devices Market and Business Models 2017
− Status of the Microfluidics Industry 2017
− Organs-On-Chips 2017
− Solid-State Medical Imaging 2017
− Medical Robotics Market Technology Analysis 2017
− Microfluidic IC Cooling – Patent Landscape
− Circulating Tumor Cell Isolation – Patent Landscape
− OCT Medical Imaging – Patent Landscape
− Pumps for Microfluidic Devices – Patent Landscape 2017
− Microfluidic Technologies for Diagnostic Applications– Patent Landscape 2017
− FLUIDIGM – Patent Portfolio Analysis 2017
− Consumer Physics SCiO Molecular Sensor – Patent-to-Product Mapping 2017
− Organs-On-Chips 2017 – Market Technology Report
− Organ-on-a-Chip– Patent Landscape Analysis

OUR 2017 PUBLISHED REPORTS LIST (3/3)
OUR PARTNERS’ REPORTS
PATENT ANALYSES – by KnowMade
− Wireless Charging Patent LandscapeAnalysis
− RF Acoustic Wave Filters Patent LandscapeAnalysis
− NMC Lithium-Ion Batteries Patent LandscapeAnalysis
− Pumps for Microfluidic Devices Patent Landscape
− III-N PatentWatch
− FLUIDIGM Patent Portfolio Analysis
− Knowles MEMS Microphones in Apple iPhone 7 Plus Patent-to-Product Mapping 2017
− Consumer Physics SCiO Molecular Sensor Patent-to-Product Mapping
− Patent Licensing Companies in the Semiconductor Market - Patent Litigation Risk and Potential Targets
− Microfluidic Technologies for Diagnostic Applications Patent Landscape
TEARDOWN REVERSE COSTING – by System Plus Consulting
More than 60 teardowns and reverse costing analysis and cost simulation tools published in 2017
MORE INFORMATION
o All the published reports from theYole Group of Companies are available on our website www.i-Micronews.com.
o Ask for our Bundle Subscription offers: With our bundle offer, you choose the number of reports you are interested in and select the related offer. You then haveup
to 12 months to select the required reports from the Yole Développement, System Plus Consulting and KnowMade offering. Pay once and receive the reports
automatically (multi-user format). Contact your sales team according to your location (see the last slide).

MICRONEWS MEDIA
o About Micronews Media
To meet the growing demand for market,
technological and business information,
Micronews Media integrates several tools able
to reach each individual contact within its
network.We will ensure you benefit from this.
ON L IN E ON SITE IN PERSON
@Micronews e-newsletter
i-Micronews.com
i-Micronewsjp.com
FreeFullPDF.com
Events Webcasts
Unique, cost-effective ways
to reach global audiences.
Online display advertising
campaigns are great strategies
for improving your
product/brand visibility.They
are also an efficient way to
adapt with the demands of the
times and to evolve an effective
marketing plan and strategy.
Brand visibility,networking
opportunities
Today's technology makes it
easy for us to communicate
regularly, quickly,and
inexpensively – but when
understanding each other is
critical, there is no substitute
for meeting in-person.Events
are the best way to exchange
ideas with your customers,
partners, prospects while
increasing your brand/product
visibility.
Targeted audience
involvement equals clear,
concise perception of your
company’s message.
Webcasts are a smart,
innovative way of
communicating to a wider
targeted audience.Webcasts
create very useful,dynamic
reference material for
attendees and also for
absentees, thanks to the
recording technology.
Benefit from the i-Micronews.com
traffic generated by the 11,200+
monthly unique visitors, the
10,500+ weekly readers of
@Micronew se-newsletter
Several key events planned for
2018 on different topics to
attract 120 attendees on average
Gain new leads for your business
from an average of 340
registrants per webcast
Contact: Camille Veyrier (veyrier@yole.fr),Marketing Communication Project Manager

CONTACT INFORMATION
o CONSULTINGANDSPECIFICANALYSIS,REPORT
BUSINESS
• North America:
• Steve LaFerriere, Senior Sales Director for Western US
Canada
Email: laferriere@yole.fr – + 1 310 600-8267
• Troy Blanchette, Senior Sales Director for Eastern US
Canada
Email: troy.blanchette@yole.fr – +1 704 859-0453
• Japan Rest ofAsia:
• Takashi Onozawa, General Manager,Asia Business
Development (Korea, Singapore, India ROA)
Email: onozawa@yole.fr - +81 34405-9204
• Miho Othake, Account Manager (Japan)
Email: ohtake@yole.fr - +81 3 4405 9204
• Itsuyo Oshiba, Account Manager (Japan)
Email: oshiba@yole.fr - +81-80-3577-3042
• Greater China: MavisWang, Director of Greater China Business
Development
Email: wang@yole.fr - +886 979 336 809
• Europe: Lizzie Levenez,EMEA Business Development Manager
Email: levenez@yole.fr - +49 15 123 544 182
• RoW: Jean-Christophe Eloy,CEO President,Yole Développement
Email eloy@yole.fr - +33 4 72 83 01 80
o FINANCIAL SERVICES (in partnershipwithWoodside
CapitalPartners)
• Jean-Christophe Eloy,CEO President
Email: eloy@yole.fr - +33 4 72 83 01 80
• Ivan Donaldson,VP of Financial Market Development
Email: ivan.donaldson@yole.fr - +1 208 850 3914
o GENERAL
• Public Relations: leroy@yole.fr - +33 4 72 83 01 89
• Email: info@yole.fr - +33 4 72 83 01 80
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