Advanced RF SiP for Cellphones 2017 report from Yole Développement

© 2017
From Technologies to Market
Advanced RF SiP
for Cell Phones
2017

2
REPORT METHODOLOGY
Market segmentation methodology
Market forecast methodology
©2017 | www.yole.fr | Advanced RF SiP for Cell Phones 2017 | Sample

3
REPORT METHODOLOGY
Technology analysis methodology Information collection

4
METHODOLOGIES AND DEFINITIONS
Yole’s market forecast model is based on the following elementary structured blocks:
Yole’s
analysis
framework

5
o Technology 56
o Challenges and requirements for 5G packaging
o Analysis on RF SiP packaging platforms in
development
o RF SiP Packaging roadmaps
o Players and Supply Chain 87
• Player landscape and positioning
• Company strategies
• Business model shifts
TABLE OF CONTENTS
o Introduction 3
• Methodology
• Report Synergies
• Objectives, Scope, Glossary
• Advanced Packaging platforms
o Executive Summary ___________15
o Market drivers and dynamics ___________35
• Advanced Packaging drivers
• RF packaging environment
o Disruptions and opportunities
• Market forecasts 102
• RF SiP Forecasts
• Unit count
• Wafer count
• Revenue
o Conclusions 117
o YOLE presentation 121

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Advanced RF SiP for Cellphones
Reverse Costing Review: Physical Analyses & Cost Estimations
RF report by Stéphane ELISABETH
October 2017
THIS REPORT IS ACCOMPANIED
BY A PHYSICAL TEARDOWN AND
REVERSE COSTING REPORT!

7
COMPANIES CITED IN THE REPORT
Amkor (J-Devices, Nanium),Apple,ASE Group, Broadcom Ltd. (Avago Technologies, Javelin Semiconductor), Cavendish Kinetics,
Cisco, Deca Technologies, Ericsson, Fujitsu, GLOBALFOUNDRIES, Google, Huawei (Hisilicon), Infineon, Intel, JCET/STATS
ChipPAC, Kyocera, Lenovo, LG, Marvell, Mediatek, Nepes, NXP Semiconductors (Freescale), Microsoft, Murata Manufacturing
Company, NTT Docomo, ON Semiconductor, OPPO, Panasonic, Peregrine Semiconductor/Murata, Powertech Technology,
Qorvo (RFMD,Triquint), Qualcomm (RF360), Samsung, Skyworks Solutions, Soitec, Spreadtrum, SPIL, STMicroelectronics,TDK-
EPC (EPCOS), Texas Instruments,TSMC, UMC,Vivo, Xiaomi, ZTE and more…
(non-exhaustive list)

8
WHAT’S NEW IN THE ADVANCED PACKAGING TEAM?
Advanced Substrates and RF packaging activities
• From 2017, the Advanced Packaging team at Yole Développement is establishing “Advanced Substrates” and “RF Packaging” as
standalone and separate activities, to allow deeper focus on these segments
• The “Advanced Substrate” activity is dedicated to exploring the market and technologies of PCBs, IC substrates and thin film RDLs
• The “RF Packaging” activity will deal with low power RF packaging as requirements for high frequency packages rise (5G)
• The objectives of these activities will be to:
• Propose a common terminology framework
• Identify and analyze competitive and overlapping technologies
• Analyze the supply chain and business model shifts
• Provide related market forecasts
• Provide related technology roadmaps
• Provide an outlook on market dynamics and disruptions
• Identify market shares of involved players
• Provide analysis on substrate and RF package - architectures, equipment and materials
Start of
the
standalone
Advanced
Substrates
and RF
packaging
activities

9
KEY FEATURES OF THIS REPORT
Market overview
o Drivers and dynamics for 5G flavors: 5G mmWave and 5G sub 6 GHz
o Disruptions and opportunities thereof
o Focus on FEM and PAM architectures in RF Front-End of cellphones
o RF Front End SiP forecast (Revenue,Wafers, Units)
Technology trends and forecasts
o RF Front-End multi-die System-in-Package challenges and technology
requirements for 5G sub 6 GHz and 5G mmWave (>24 GHz) bands
o 5G SiP packaging roadmaps for smartphone Front-End
o RF SiP Revenue,Wafer and Unit forecasts
Supply chain analysis
• Supply chain changes in the new 5G era
• Strategies and outlook of current RF SiP manufacturers
• New entries and supply chain disruptions for mmWave packaging
The “Advanced RF SiP for Cell Phones 2017” is the first report of the RF advanced packaging series.
The objectives of the report are as follows:

10
SCOPE OF THE REPORT
• RF Front-
End SiP
packaging
for 5G in
cell
phones
Mobile phones
Mobile Infrastructure
RF front-end components (PA, LNA, filters, switches, antenna tuners)
2G, 3G, 4G, 5G technologies
Modems, transceivers, baseband processors,Wi-fi & Bluetooth modules…
Antennas, IPDs, …
Topics NOT included in the report
Focus of the report

11
OSAT services
RF COMPONENT AND MODULE SUPPLY CHAIN (KEY PLAYERS)
RF component stage
FEM stage
Handset device stage
Antenna device
(tuner & switch)
RF switch
PA/LNA
RF filter
(Module maker + test + assembly)
Pure players Integrated players
Discrete components Integrated modules
CMOS-based
5G mmWave FEM
Focus of this
report!

12
Leadframes
QFN
w/o IC substrates
Fan-in Fan-out
IC substrates-based
Package Substrate
(organic)
W/B BGA
Flip Chip
BGA
3DIC
Interposer
based
(Si, Glass, Org)
SiP
Integration:2D 3D
ADVANCED PACKAGING PLATFORMS
• Overview
of advanced
packaging
platforms
PCB
(organic board)
Increased functionality,performance…
Interconnect:
Bumping,Pillars,Studs,Through-silicon-via,Bump-less,EmbeddedTechnologies...
X
Embedded die
(in substrate or
PCB)
Focus packaging platform

13
HOW DOES A 4G SiP (PAMID) LOOK LIKE TODAY ?
• Example
with the
Broadcom
AFEM 8050
module in
the iphone 7
Plus phone
• Mid Band
PAMiD
PA
PA
sPxT
switch
sPxT
switch
RF IC
BAW
filters
BAW
filters
BAW
filters
BAW
filters
BAW
filters
BAW
filters
BAW
filters
BAW
filters
BAW
filters
BAW
filters
BAW
filters
BAW
filters
Passives
Passives
Passives
in a 43mm2 !

14
DEVELOPMENT OF TECHNOLOGY FOR 5G
• Advancem
ents in 4G
in sub 6
GHz range
(labeled
4G+) will
go in
parallel
with 5G
mmWave
developme
nts
2G 3G 4G
5G
mm
Wave
5G
IoT
• Upgrade of 4G technology - incremental innovation
• Will stay at frequencies < 6 GHz
• Modification of current RF packaging architectures
• Minimal change in BOM
• mmWave 5G technology - disruptive innovation
• Introduction of mmWave frequencies >24 GHz
• Adoption off new packaging architectures and
platforms
• Heavy design changes and new materials required
Different flavors of 5G are developing in
parallel!
All tracks include higher integration and
further RF SiP development
5G
sub 6
GHz
• Used frequencies <1GHz
• To address transfer of data generated by many IoT
end devices (mainly sensors)
• Still undefined standards/protocols
• Little to no innovation regarding semiconductor
packaging

15
SMARTPHONE RF PACKAGING ARCHITECTURES
• Disruptive
packaging
ahead!
Tomorrow, 5G sub 6 GHz and mmWave 5G (>2019)
Sub 2.7 GHz
FC substrate SiP
Today (4G in 2017)
• 10-15 dies in Flip Chip SiP
• Mix of Si and III/V Front End
(i.e. PA)
• Flip Chip balls or Cu pillars
• Power amplifiers still
wirebonded
Improvements in sub 6 GHz and mmWave
bands (28, 39, 60 GHz)
Glass substrate
Fan-OutWLP
Enhanced
FC substrate SiP
Which
package
architecture
will win?

16
OSAT services
SUPPLY CHAIN CHANGES EXPECTED IN 5G!
• Supply
chain to get
more
complex
with
Qualcomm
5G push
and
potential
new entries
OSAT services
Key RF FEM/PAM SiP
suppliers in 4G
5G sub 6GHz
mmWave
5G
Potential new
semiconductor entries
?
Technology strategy
and competition
ongoing
Working on
incremental
advancements
Directly to disruptive
mmWave 5G
Key OEM mobile drivers
More OEM
involvement +
others

17
RELATED REPORTS
Discover more related reports within our bundle here

The 5th
generation of cellular networks is
anticipated to arrive in the timeframe of the
next 2-5 years, enabling Gbps datarates and
a plethora of new applications and services.
One of the key drivers for developing such
speed is high resolution video demand (4K, 8K
etc.) over mobile devices. Furthermore, future
applications such as mobile driven augmented
and virtual reality would benefit greatly from
such technical capabilities. In addition, certain
amounts of data generated by the Internet of
Things end devices will need to be transmitted
over the cellular network as well. Global mobile
data traffic is growing at an astonishing rate,
with >40% CAGR predicted from 2017-2022.
While some parts of 5G might be available
as soon as 2019, in reality, there are many
uncertainties which keep the global community
in discussion:
• Accuracy of future projected data
demands and market growth
• Growth of applications and services which
would require 5G networks
• Justification of financial investment in
infrastructure required
• Allocation of appropriate frequency bands
• Technology readiness
• Competition from advanced WiFi (i.e.
WiGiG)
• Capabilities of ongoing 4G innovation
The fundamental motivation for developing 5G
networks is the assumption that much higher
datarates will be needed, than current 4G
allows. The speed of 5G adoption will highly
depend on market demand and status of RF
semiconductor technology quality. While the
step from 3G to 4G was more incremental,
5G is considered a disruptive step, both from
financial and technology viewpoint. 5G has 3
aspects: mmWave, sub 6GHz and sub 1 GHz
(5G Internet-of-Thing - IoT). Highest frequency
5G targets mmWave frequency bands, in the
range from 28 GHz to 60 GHz and even in some
cases up to 80 GHz. This requires significant
technology overhaul and installation of a large
number of smaller local cells to assure signal
quality. Meanwhile, significant efforts are being
allocated to improve current 4G technology
in the sub 6 GHz bands, towards 100 Mbit/s
and beyond. The semiconductor industry, from
front end to assembly and test is under heavy
pressure to innovate at a very fast pace while
maintaining desired quality and reliability.
RF front end modules today are utilizing complex
System-in-Package (SiP) architectures with 10-
15 dies (switches, filters, power amplifiers)
included and several types of interconnects
(wire bond, flip chip, Cu pillars) in a single
package. Future smartphone connectivity relies
on SiP innovation with SiP packaging revenue
expected to grow 10% CAGR 2017 to 2022,
more than the overall fast growing advanced
packaging sector with CAGR 2017-2022 of 7%.
Overall RF front end component market for
smartphones is expected to grow from 12.3
$B in 2017 to 22.8 $B in 2022, with a CAGR
of 13%. Advanced multi die SiP packaging holds
a large set of key technologies to address all
flavors of 5G requirements with the ability to
enable or slow down the 5G market!
ADVANCED RF SYSTEM-IN-PACKAGE FOR CELL PHONES 2017
Market Technology report - October 2017
5G – THE DISRUPTION IS AROUND THE CORNER!
The transition from 4G to 5G requires disruptive packaging innovation. 5G mmWave, 5G sub 6
GHz - which packaging architectures can rise to the occasion?
KEY FEATURES OF THE REPORT
Get the sample of the report
on www.i-Micronews.com
Market overview
• Drivers and dynamics for 5G
flavors: 5G mmWave and 5G sub
6 GHz
• Disruptions and opportunities
thereof
• Focus on FEM and PAM
architectures in RF front-end of
cellphones
• RF front end SiP forecast
(revenue, wafers, units)
Technology trends and forecasts
• RF front-end multi-die System-in-
Package challenges and technology
requirements for 5G sub 6 GHz
and 5G mmWave (24 GHz) bands
• 5G SiP packaging roadmaps for
smartphone front-end
• RF SiP revenue, wafer and unit
forecasts
Supply chain analysis
• Supply chain changes in the new
5G era
• Strategies and outlook of current
RF SiP manufacturers
• New entries and supply chain
disruptions for mmWave packaging
(Yole Développement, October 2017)
All flavors of 5G are developing in parallel!
• Upgrade of 4G technology - incremental
innovation
• Will stay at frequencies 6 GHz
• Modification of current RF packaging architectures
• Minimal change in BOM
• mmWave 5G technology - disruptive
innovation
• Introduction of mmWave frequencies 24 GHz
• Adoption of new packaging architectures and
platforms
• Major design changes and new materials
required
• Used frequencies 1GHz
• To address transfer of data generated by many
IoT end devices (mainly sensors)
• Still undefined standards/protocols
• Little to no innovation regarding semiconductor
packaging
5G
mm
Wave
5G
sub 6
GHz
5G
IoT
4G2G 3G
All tracks include higher integration
and further RF SiP development

Supply chain to get more complex with Qualcomm 5G push and
potential new entries
ADVANCED RF SYSTEM-IN-PACKAGE FOR CELL PHONES 2017
5G BRINGS BOTH COMPLEXITY AND NEW BUSINESS OPPORTUNITIES
NEW DESIGNS FOR CHALLENGING 5G REQUIREMENTS
The SiP supply chain in the smartphone RF
front end (FEM/PAM) in today’s 4G technology
is clearly led by 5 IDMs: Qorvo, Broadcom
(Avago), Skyworks, Murata and TDK Epcos.
Part of their production is outsourced to top
OSATs: ASE, Amkor, JCET Group and SPIL.
The future brings diversified strategies on
which markets to target first. Today’s IDMs are
more focusing on 5G sub 6 GHz solutions while
Qualcomm is attempting to skip a step directly
focusing on promoting and developing mmWave
5G technologies while working on establishing
a 5G mmWave supply chain in order to ensure
early leadership. Various packaging technology
options and market uncertainties leave OSATs
to make difficult choices on targeted customers,
markets and packaging architectures to qualify
and offer, in order to motivate IDMs for further
outsourcing.
With 5G mmWave, 5G sub 6 GHz and 5G IoT
developing in parallel, what are the strategies of
each RF SiP manufacturer and their long term
Accomplishing Gbps wireless datarates on the
cellular network requires operation of devices at
GHz frequencies. While allocation of frequency
bands is still in discussion, mmWave bands around
28 GHz, 39 GHz and 60 GHz come most into
discussion. Meanwhile 5G below 6GHz is targeting
expansion to 3.5 GHz and 4.5 GHz. Although
5G below 6 GHz also requires semiconductor
packaging innovation, it can be considered mostly
incremental. However, the 5G mmWave domain is
opening completely new sets of requirements that
requires considerable technology disruptions. At
mmWave frequencies signal path length becomes
particularly critical and any design imperfection is
transformed into considerable signal losses and
deteriorated device performance. Today, RF SiPs,
namely FEMiD and PAMiD are rather complex
and contain 10-15 heterogeneous dies (Si based,
III/V, MEMS etc.) with mixed wirebonding, flip
chip ball or Cu pillar interconnects attaching to
organic package substrates with up to 7 metal
layers. Future 5G sub 6 GHz and especially 5G
mmWave will require even denser integration of
dies in order to minimize signal paths and keep
losses under control.
Finding new innovative substrate/RDL solutions
will directly impact the performance and success
of a product. On top of that, integration of the
antenna within the SiP is more a need than an
option, bringing a set of additional challenges
from placement options, processing, shielding etc.
Future RF packaging innovation in cellphones is
being performed on several levels and in parallel
for 5G sub 6GHz and 5G mmWave, however the
real packaging disruption is expected on mmWave
frequencies 24 GHz. Some of the future RF
packaging quests are search for low loss materials,
antenna integration, possible integration of dies
in front end, overhaul in packaging architectures
and exploration of shielding options – all in
order to develop new generations of 5G RF SiPs.
Investigated packaging platforms for 5G so far
include advanced Flip Chip substrate solutions,
Fan-Out WLP and glass interposers.
What are the requirements and challenges in
5G packaging? How does that reflect on RF
packaging architectures and materials? What are
the advantages and limitations of developing RF
packaging architectures? How will the dies and
interconnects change at higher frequencies? Is
there a better fit for lower and higher mmWave
5G bands? Which RF packaging architectures will
win? Take a look into the full report for an in depth
analysis providing answers to these questions.
More and disruptive SiP architectures expected in 5G mmWave
Tomorrow, 5G sub 6 GHz and mmWave 5G (2019)
Sub 2.7 GHz
FC substrate SiP
Today (4G in 2017)
• 10-15 dies in Flip Chip SiP
• Mix of Si and III/V Front End
(i.e. PA)
• Flip Chip balls or Cu pillars
• Power amplifiers still
wirebonded
Improvements in sub 6 GHz and mmWave bands (28, 39, 60 GHz)
Glass substrate
Fan-Out WLP
Enhanced
Flip Chip substrate
SiP
Which package
architecture
will win?
OSAT services
OSAT services
Key RF FEM/PAM
SiP suppliers in 4G
5G sub 6GHz
mmWave
5G
Potential new
semiconductor entries
?
Technology
strategy and
competition
ongoing
Working on
incremental
advancements
Directly to disruptive
mmWave 5G
Key OEM mobile drivers
More OEM
involvement
+ others

MARKET TECHNOLOGY REPORT
outlook? Can Qualcomm outpace the competitors by being first to develop 5G mmWave
technologies or are the timelines premature? How are OSATs responding and is outsourcing
expected to increase or decrease at mmWave frequencies? With specific technology changes
at 5G mmWave, doors are open for other fabless and IDM to enter the competition at RF
front end. Why are they considered as potential new entries and how can the supply chain?
This report aims to provide answers to these diverse and challenging questions.
Find more
details about
this report here:
COMPANIES CITED IN THE REPORT (non exhaustive list)
Amkor (J-Devices, Nanium), Apple, ASE Group, Broadcom Ltd. (Avago Technologies, Javelin
Semiconductor),CavendishKinetics,Cisco,DecaTechnologies,Ericsson,Fujitsu,GLOBALFOUNDRIES,
Google, Huawei (Hisilicon), Infineon, Intel, JCET/STATS ChipPAC, Kyocera, Lenovo, LG, Marvell,
Mediatek, Nepes, NXP Semiconductors (Freescale), Microsoft, Murata Manufacturing Company,
NTT Docomo, ON Semiconductor, OPPO, Panasonic, Peregrine Semiconductor/Murata, Powertech
Technology, Qorvo (RFMD, Triquint), Qualcomm (RF360), Samsung, Skyworks Solutions, Soitec,
Spreadtrum, SPIL, STMicroelectronics, TDK-EPC (EPCOS), Texas Instruments, TSMC, UMC, Vivo,
Xiaomi, ZTE and more…

Introduction3
Methodology
Report synergies
Objectives, scope, glossary
Advanced packaging platforms
Executive summary 15
Market drivers and dynamics 35
Advanced packaging drivers
RF packaging environment
Disruptions and opportunities
Technology56
Challenges and requirements for 5G
packaging
Analysis on RF SiP packaging platforms in
development
RF SiP packaging roadmaps
Players and supply chain 87
Player landscape and positioning
Company strategies
Business model shifts
Market forecasts 102
RF SiP forecasts
Unit count
Wafer count
Revenue
Conclusions117
Yole Développement presentation 121
TABLE OF CONTENTS (complete content on i-Micronews.com)
• Smartphone RF Front-End Module Review
• Status of the Advanced Packaging Industry
2017
• Glass Substrate Manufacturing in the
semiconductor field 2017
• 5G’s Impact on the
RF Front-End Industry
RELATED REPORTS
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AUTHORS
Andrej Ivankovic is a Technolo-
gy Market Analyst, in the Advanced
Packaging and Semiconductor Manu-
facturing team, at Yole Développement
the «More than Moore» market re-
search and strategy consulting company.
He holds a master’s degree in Electri-
cal Engineering, with specialization in
Industrial Electronics from the Univer-
sity of Zagreb, Croatia and a PhD in
Mechanical Engineering from KU Leuven,
Belgium. He started as an intern at ON
Semiconductor performing reliability
tests, failure analysis and characteriza-
tion of power electronics and packages.
The following 4 years he worked as a
RD engineer at IMEC Belgium on the
development of 3D IC technology, focu-
sing on electrical and thermo-mechani-
cal issues of 3D stacking and packaging.
Part of this time he also worked at GLO-
BALFOUNDRIES as an external resear-
cher. He has regularly presented at in-
ternational conferences authoring and
co-authoring 18 papers and 1 patent.
Claire Troadec is leading the RF
activity at Yole Développement. She
has been a member of the MEMS
manufacturing team from 2013. She
graduated from INSA Rennes in
France with an engineering degree in
microelectronics and material sciences.
She then joined NXP Semiconductors,
and worked for 7 years as a CMOS
process integration engineer at the
IMEC RD facility. During this time, she
oversaw the isolation and performance
boost of CMOS technology node
devices from 90 nm down to 45 nm.
She has authored or co-authored
seven US patents and nine international
publications in the semiconductor field
and before joining Yole Développement
managed her own distribution company.
Find all our reports on www.i-micronews.com
OBJECTIVES OF THE REPORT
• Translate 5G market drivers to semiconductor packaging dynamics
• Summarize multi die packaging (SiP) technology challenges and requirements for RF Front-End
in smartphones
• Analyze various developing RF SiP architectures for sub 6 GHz and mmWave frequencies,
advantages and suitability thereof
• Analyze supply chain changes and opportunities for 5G in smartphones

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Advanced RF System-in-Package for Cell Phones 2017
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SERVING THE ENTIRE SUPPLY CHAIN
Our analysts
provide
market
analysis,
technology
evaluation,
and business
plans along
the entire
supply chain
Integrators and
end-users
Device manufacturers
Suppliers: material, equipment,
OSAT, foundries…
Financial investors,
RD centers

SERVING MULTIPLE INDUSTRIAL FIELDS
We work
across
multiples
industries to
understand
the impact of
More-than-
Moore
technologies
from device
to system
From A to Z…
Transportation
makers
Mobile phone
and
consumer
electronics
Automotive
Medical
systems
Industrial
and defense
Energy
management

o Yole Développement publishes a comprehensive collection of market technology reports and patent analysis in:
• MEMS Sensors
• RF devices technologies
• Imaging
• Medical technologies (MedTech)
• Photonics
• Advanced packaging
• Manufacturing
• Advanced substrates
• Power electronics
• Batteries and energy management
• Compound semiconductors
• Solid state lighting
• Displays
o You are looking for:
• An analysis of your product market
• A review of your competitors evolution
• An understanding of your manufacturing and production costs
• An understanding of your industry technology roadmap and related IPs
• A clear view on the evolution of the supply chain
The combined team of 60+ experts (PhDs, MBAs, industry veterans…) from Yole Développement, System Plus Consulting and KnowMade, collect information, identify
the trends, the challenges, the emerging markets, the competitive environments and turn it into results to give you a complete picture of your industry landscape.
In the past 19 years, we worked on more than 2 000 projects, interacting with technology professionals and high level opinion makers from the main players of the
industry.
o Every year, Yole Développement, System Plus Consulting and Knowmade publish +120 reports. Gain full benefit from our Bundle and Annual Subscription offers.
REPORTS COLLECTION
www.i-Micronews.com

OUR 2017 REPORTS PLANNING (1/2)
MARKET ANDTECHNOLOGY REPORTS byYole Développement
o MEMS SENSORS
− Acoustic MEMS and Audio Solutions 2017
− Integrated Passive Devices Market Status 2017
− 3D Imaging Sensing 2017
− Status of the MEMS Industry 2017
− Silicon Photonics 2017*
− MEMS Sensors for Automotive 2017
− High End Inertial Sensors for Defense and Industrial Applications 2017*
− Magnetic Sensors Market and Technologies 2017
− Sensors and Sensing Modules for Smart Homes and Buildings 2017
− Sensing and Display for AR/VR/MR 2017**
− MEMS Packaging 2017
− Fingerprint Sensor Applications and Technologies - Consumer Market Focus 2017
o RF DEVICES AND TECHNOLOGIES
− RF Front End Modules and Components for Cellphones 2017
− Advanced RF SiP for Cellphones 2017
− 5G Impact on RF Industry: From Wireless Infrastructure to Cellphone Terminals
2017
− RF Technologies for Automotive Applications 2017
− GaN and Si LDMOS Market and Technology Trends for RF Power 2017
o MANUFACTURING
− Glass Substrate Manufacturing 2017
− Equipment Materials for Fan Out Technology 2017
− Equipment and Materials for 3D TSV Applications 2017
− Emerging Non Volatile Memories 2017*
o MEDTECH
− Status of the Microfluidics Industry 2017
− Solid State Medical Imaging 2017
− Connected Medical Devices: the Internet of Medical Things 2017
− Sensors for Medical Robotics 2017
− Artificial Organs: Market Technology Analysis 2017
− Organs-on-a Chip 2017
o ADVANCED PACKAGING
− Advanced Substrates Overview 2017
− Status of the Advanced Packaging Industry 2017
− Fan Out Packaging: Market Technology Trends 2017*
− 3D TSV and 2.5D Business Update - Market and Technology Trends 2017
− Advanced QFN: Market Technology Trends 2017**
− MEMS Packaging 2017
− Advanced Packaging for Memories 2017
− Advanced RF SiP for Cellphones 2017
− Power Packaging Market and Technology Trends 2017
− Embedded Die Packaging: Technologies and Markets Trends 2017
o IMAGING OPTOELECTRONICS
− 3D Imaging Sensing 2017
− Status of the CMOS Image Sensor Industry 2017*
− Camera Module for Consumer and Automotive Applications 2017*
− Uncooled Infrared Imaging Technology Market Trends 2017*
− Solid State Medical Imaging 2017
− Embedded Software for Machine Vision Systems 2017**
o BATTERY AND ENERGY MANAGEMENT
− Status of the Rechargeable Li-ion Battery Industry*2016 version still available / **To be confirmed

OUR 2017 REPORTS PLANNING (2/2)
o POWER ELECTRONICS
− Status of Power Electronics Industry 2017
− Power MOSFET 2017: Market and Technology Trends
− IGBT Market and Technology Trends 2017
− Power Module Packaging: Material Market and Technology Trends 2017
− Power SiC 2017: Materials, Devices, and Applications
− Power GaN 2017: Materials, Devices, and Applications*
− Materials Market Opportunities for Cellphone Thermal Management (Battery
Cooling, Fast Charging, Data Processing, etc.) 2017
− Gate Driver Market and Technology Trends 2017
− Power Management ICs Market Quarterly Update 2017
− Thermal Management for LED and Power 2017
o COMPOUND SEMICONDUCTORS
− Power SiC 2017: Materials, Devices, and Applications
− Power GaN 2017: Materials, Devices, and Applications*
− GaN and Si LDMOS Market and Technology Trends for RF Power 2017
− 5G Impact on RF Industry: From Wireless Infrastructure to Cellphone Terminals
2017
− Bulk GaN Substrate Market 2017
o DISPLAYS
− MicroLED Displays 2017
− MicroLED IP 2017
− Quantum Dots for Display Applications 2017
− Phosphors Quantum Dots 2017 - LED Downconverters for Lighting Displays
o SOLID STATE LIGHTING
− UV LEDs 2017 - Technology, Manufacturing and Application Trends*
− Horticultural Lighting 2017 - Technology, Industry and Market Trends
− Automotive Lighting 2017 - Technology, Industry and Market Trends*
− Active Imaging and Lidar 2017 - IR Lighting**
− LED Lighting Module 2017 - Technology, Industry and Market Trends
− IR LEDs and VCSELs - Technology Applications and Industry Trends 2017
− Phosphors Quantum Dots 2017 - LED Downconverters for Lighting Displays
− MicroLED Displays 2017
− CSP LED Lighting Module 2017
− LED Packaging 2017
− Thermal Management Technology and Market Perspectives in Power Electronics
and LEDs 2017
PATENT ANALYSIS by Knowmade
− Consumer Physics SCiO Molecular Sensor Patent-to-Product Mapping 2017
− Patent Licensing Companies in the Semiconductor Market - Patent Litigation Risk
and Potential Targets 2017
− MEMS Microphone: Patent Landscape Analysis 2017
− Knowles MEMS Microphones in Apple iPhone 7 Plus Patent-to-Product Mapping
− Microbolometer: Patents Used in Products 2017
− Microfluidic Technologies for Diagnostic Applications Patent Landscape 2017
− Pumps for Microfluidic Devices Patent Landscape
− III-N Patent Watch
− MicroLEDs: Patent Landscape Analysis 2017
− Uncooled Infrared Imaging: Patent Landscape Analysis 2017
− 3D Monolithic Memory: Patent Landscape Analysis 2017
− NMC Lithium-Ion Batteries Patent Landscape Analysis
− FLUIDIGM Patent Portfolio Analysis
TEARDOWN REVERSE COSTING by System Plus Consulting
More than 60 teardowns and reverse costing analysis and cost simulation tools to be
published in 2017.
*2016 version still available / **To be confirmed

OUR 2016 PUBLISHED REPORTS LIST (1/2)
MARKET AND TECHNOLOGY REPORTS by Yole Développement
o MEMS SENSORS
− Gas Sensors Technology and Market 2016
− Status of the MEMs Industry 2016
− Sensors for Cellphones and Tablets 2016
− Market and Technology Trends of Inkjet Printheads 2016
− Sensors for Biometry and Recognition 2016
− Silicon Photonics 2016
o IMAGING OPTOELECTRONICS
− Status of the CMOS Image Sensor Industry 2016
− Uncooled Infrared Imaging Technology Market Trends 2016
− Imaging Technologies for Automotive 2016
− Sensors for Drones Robots: Market Opportunities and Technology Evolution 2016
o MEDTECH
− BioMEMS 2016
− Point of Care Testing 2016: Application of Microfluidic Technologies
o ADVANCED PACKAGING
− Embedded Die Packaging: Technology and Market Trends 2017
− 2.5D 3D IC TSV Interconnect for Advanced Packaging: Business Update 2016
− Fan-Out: Technologies and Market Trends 2016
− Fan-In Packaging: Business update 2016
− Status and Prospects for the Advanced Packaging Industry in China 2016
o MANUFACTURING
− Thin Wafer Processing and Dicing Equipment Market 2016
− Emerging Non Volatile Memories 2016
o COMPOUND SEMICONDUCTORS
− Power GaN 2016: Epitaxy and Devices, Applications and Technology Trends
− GaN RF Devices Market: Applications, Players, Technology and substrates 2016
− Sapphire Applications Market 2016: from LED to Consumer Electronics
− Power SiC 2016: Materials, Devices, Modules, and Applications
o LED
− UV LED Technology, Manufacturing and Applications Trends 2016
− OLED for Lighting 2016 – Technology, Industry and Market Trends
− Automotive Lighting: Technology, Industry and Market Trends 2016
− Organic Thin Film Transistor 2016: Flexible Displays and Other Applications
− Sapphire Applications Market 2016: from LED to Consumer Electronics
o POWER ELECTRONICS
− Power Electronics for EV/HEV 2016: Market, Innovations and Trends
− Status of Power Electronics Industry 2016
− Passive Components Technologies and Market Trends for Power Electronics 2016
− Power SiC 2016: Materials, Devices, Modules, and Applications
− Power GaN 2016: Epitaxy and Devices, Applications, and Technology Trends
− Inverter Technologies Trends Market Expectations 2016
− Opportunities for Power Electronics in Renewable Electricity Generation 2016
− Thermal Management Technology and Market Perspectives in Power Electronics and
LEDs 2017
− GaN RF Devices Market: Applications, Players, Technology and substrates 2016
o BATTERY AND ENERGY MANAGEMENT
− Beyond Li-ion Batteries: Present and Future Li-ion Technology Challengers 2016
− Stationary Storage and Automotive Li-ion Battery Packs 2016
− Opportunities for Power Electronics in Renewable Electricity Generation 2016

OUR 2016 PUBLISHED REPORTS LIST (2/2)
PATENT ANALYSIS by Knowmade
− Microbattery Patent Landscape Analysis
− Miniaturized Gas Sensors Patent Landscape Analysis
− 3D Cell Culture Technologies Patent Landscape
− Phosphors and QDs for LED Applications Patent Landscape
− TSV Stacked Memory Patent Landscape
− Fan-Out Wafer Level Packaging Patent Landscape Analysis
TEARDOWN REVERSE COSTING by System Plus Consulting
More than 45 teardowns and reverse costing analysis and cost simulation tools published
in 2016.
MORE INFORMATION
o All the published reports from the Yole Group of Companies are available on our website
www.i-Micronews.com.
o Ask for our Bundle and Annual Subscription offers: With our bundle offer, you choose the
number of reports you are interested in and select the related offer. You then have up to 12
months to select the required reports from the Yole Développement, System Plus Consulting
and KnowMade offering. Pay once and receive the reports automatically (multi-user format).
Contact your sales team according to your location (see the last slide).

MICRONEWS MEDIA
o About Micronews Media
To meet the growing demand for market,
technological and business information,
Micronews Media integrates several tools able
to reach each individual contact within its
network.We will ensure you benefit from this.
ONLINE ONSITE INPERSON
@Micronews e-newsletter
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Events Webcasts
Unique, cost-effective ways
to reach global audiences.
Online display advertising
campaigns are great strategies
for improving your
product/brand visibility.They
are also an efficient way to
adapt with the demands of the
times and to evolve an effective
marketing plan and strategy.
Brand visibility, networking
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Today's technology makes it
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regularly, quickly, and
inexpensively – but when
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Targeted audience
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Webcasts are a smart,
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Benefit from the i-Micronews.com
traffic generated by the 8,500+
monthly visitors, the 11,500+
weekly readers of @Micronews
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Seven main events planned for
2017 on different topics to
attract 100 attendees on average
Gain new leads for your business
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registrants per webcast
Contact: CamilleVeyrier (veyrier@yole.fr), Marketing Communication Project Manager.

CONTACT INFORMATION
o CONSULTING AND SPECIFIC ANALYSIS
• North America: Steve LaFerriere, Director of Northern America Business Development
Email: laferriere@yole.fr – +1 31 06 008 267
• Japan Rest of Asia: Takashi Onozawa, General Manager, Asia Business Development
Email: onozawa@yole.fr - +81 3 4405 9204
• Greater China: Mavis Wang, Director of Greater China Business Development
Email: wang@yole.fr - +886 979 336 809
• RoW: Jean-Christophe Eloy, CEO President, Yole Développement
Email eloy@yole.fr - +33 4 72 83 01 80
o REPORT BUSINESS
• North America: Steve LaFerriere, Director of Northern America Business Development
Email: laferriere@yole.fr – +1 31 06 008 267
• Europe: Lizzie Levenez, EMEA Business Development Manager
Email: levenez@yole.fr - +49 15 123 544 182
• Rest of Asia: Takashi Onozawa, General Manager, Asia Business Development
Email: onozawa@yole.fr - +81 3 4405 9204
• Japan Asia: Miho Othake, Account Manager
Email: ohtake@yole.fr - +81 3 4405 9204
• Greater China: Mavis Wang, Director of Greater China Business Development
Email: wang@yole.fr - +886 979 336 809
o FINANCIAL SERVICES (in partnership with Woodside Capital Partners)
• Jean-Christophe Eloy, CEO President
Email: eloy@yole.fr - +33 4 72 83 01 80
o GENERAL
• Public Relations: leroy@yole.fr - +33 4 72 83 01 89
• Email: info@yole.fr - +33 4 72 83 01 80
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