There are so many things to consider when designing a PCB that oversights happen easily. One crucial area that can be overlooked is the thermal design. We've all heard about electronics devices overheating…
As if that's not enough, design requirements are often contradictory. So, the best PCB layout for signal integrity is often the worst for thermal design. In the end, getting a good design that also boasts robust thermal performance is a tough ask.
But we're here to help. Our award-winning thermal simulation tool – 6SigmaET – gives you a unique visual representation of the temperature and airflow. And that allows you to optimize your designs so that they are 'right' before you even consider physical prototyping.
This presentation is intended for designers with little or no thermal design experience: we'll teach you how to simply and easily integrate thermal simulation in to your design process. We'll also demonstrate how 6SigmaET reduces the risk of design mistakes, helps you push the boundaries of your own design skills, enables innovation, and saves your company both time and money.
Intro – Tom Gregory 6SigmaET Product Specialist
In this workshop I will be discussing how you can reduce you time to market with advanced thermal modelling techniques.
I will be happy to answer any questions at the end of the presentation.
the best PCB layout for electrical performance is usually the worst for thermal performance.
Thermal design is often an after thought. A bad thermal design can have a huge impact on the final quality of the equipment.
Performance: Functional operation of device, Efficiency – minimisation of leakage current
Reliability: Temperature dependency of failures
Safety: Flammability, user safety, user comfort
Xbox – High Failure rate. Widely believed to be caused by the device overheating - Reliability
Hotmail – Overheating data center caused 18 hour shutdown - Performance
MAC – Safety User Comfort. The component may be within specification but it does not feel ok.
Bosch Dishwasher – Caused house fire. Over 600,000 recalled. - Safety
I am sure you have all seen this graph before. It is important that any design issue are found early. Any mistake found late in the design cycle are expensive to fix.
Bosch and Xbox – Recall very expensive
Cost of a design issue through the product lifecycle
Many engineers find thermal issues at the prototype stage
Can impact the entire design
Cost could be huge
Weight – Bigger Heatsink
Noise – Faster fan
Increased cost – High spec components (military standard, heatsinks)
Reduced equipment functionality – Reduce CPU speed, removal of functions.
Airflow is invisible.
Temperature in electronic equipment is very difficult to measure and often not very accurate.
Avoid time and money prototyping a cooling system that will not work.
Thermal simulation should be performed early and throughout the design cycle.
You don’t need a full detailed design before doing simulation.
The cost goes up the later in the design cycle the problem is found.
Once parts are manufactured the cost of modification is very high
Cost – Optimize design – remove unnecessary heatsink, fans etc.
Over simplification
Simple reporting
Use CAD not blocks
Animation
Expert is required to build an interpret
6SigmaET has been design to be really easy to use
Reduce time use the data that is already available to you.
The object based gridding in 6SigmaET automatically recognizes the CAD model and prepares it for the simulation.