SPONSORSHIP OPPORTUNITIES: For more information, contact Mike Hendrickson at mikeh@oreilly.com or 617.499.7463
Software/Hardware/Everywhere San Francisco, CA | May 21 – 22, 2014
We placed big bets on Web 2.0 and Big Data,
and now, with our new conference, Solid,
we’re betting on the opportunities we see
coalescing around software-enhanced,
networked hardware.
We invite you to join us.
©2014 O’Reilly Media, Inc. The O’Reilly logo is a registered trademark of O’Reilly Media, Inc. 14228

2
SOLID CONFERENCE
MAY 21 – 22, 2014
SAN FRANCISCO, CA
FOR MORE INFORMATION
CONTACT MIKE HENDRICKSON
MIKEH@OREILLY.COM
617.499.7463
SOLIDCONF.COM
THE BIG IDEA
The physical world is about to experience the disruption of the Internet. Software and
hardware are blurring together and new ways of manufacturing are emerging. Now you
can create products never before imagined, exploit new efficiencies, and build entirely
new business models.
SIGNALS THAT IT’S CATCHING ON
Searches for the common terms that describe this space—Internet of Things, Internet
of Everything, Industrial Internet, the Programmable World, Intelligent Things, M2M,
Maker-Pro, Generative Things, and Machine-Data—are increasing dramatically, pointing
to growing interest in this emerging market.
HOW BIG IS THE MARKET? HUGE
Opinions on how fast the industry will grow (and even how the industry is defined) vary.
Rob Lloyd, Cisco’s president of development and sales, predicts the Internet of Things
will be a $14.4 trillion industry within the next decade; IDC predicts a $7.3 trillion market
by 2017; and Gartner predicts a $1.9 trillion dollar market by 2020. But all signs point
towards phenomenal growth.
“The O’Reilly
conferences are
the gold standard
for drawing together
a critical mass of
thought leaders.”
STEVE GILLMOR
CRN

3
SOLID CONFERENCE
MAY 21 – 22, 2014
SAN FRANCISCO, CA
FOR MORE INFORMATION
CONTACT MIKE HENDRICKSON
MIKEH@OREILLY.COM
617.499.7463
SOLIDCONF.COM
The O’Reilly Solid Conference is where engineers, software programmers, researchers,
product managers, roboticists, designers, venture capitalists, innovators, and business
leaders will gather to explore how the worlds of programming and engineering are
colliding—and what opportunities this perfect storm of intelligent things will bring.
CORE THEMES & TRACKS
The collision of software and hardware is fueling the creation of a software-enhanced,
networked physical world. The impact of this phenomenon goes far beyond the
development of intelligent new consumer products, exploiting new efficiencies, and
creating entirely new business models. Some of the themes that we see as essential:
■■ Manufacturing made frictionless
■■ APIs for the physical world
■■ Software intelligence above the level of a single machine
■■ Every company is a software company
■■ Data-driven things as a service
■■ Designing for the post-screen world
Solid will be tackling the full depth and breadth of the disruption. Sessions are organized
into 5 main tracks:
■■ Solid Companies: Funding, product development, marketing—everything you
need for success, whether your organization is a nimble start-up or a long-established
business.
■■ Solid Machines: Design, prototyping, manufacturing, implementation—the entire
process of making things real, from idea to manufacturing and shipping.
■■ Solid Society: Cities, health, developing world, economics—how to build products
and services which improve our cities, personal health, and the world economy.
■■ Solid Foundations: Materials, synthetic biology, fundamental technologies—all the
underlying technologies that compose and power our connected world.
■■ Solid Tools: The protocols, technologies, and techniques necessary to make ideas
become reality.
“Hardware startups
are looking like the
software startups
of the previous
digital age.”
JOI ITO
DIRECTOR, MIT MEDIA LAB,
AND SOLID CONFERENCE CO-CHAIR

4
SOLID CONFERENCE
MAY 21 – 22, 2014
SAN FRANCISCO, CA
FOR MORE INFORMATION
CONTACT MIKE HENDRICKSON
MIKEH@OREILLY.COM
617.499.7463
SOLIDCONF.COM
WHAT IS SOLID?
A new market is emerging at the intersection of hardware and software. Solid is telling the story and
convening the players.
The Solid Program Committee, led by Program Chairs Joi Ito of MIT Media Lab and Jon Bruner of O’Reilly
Radar, have lined up a stellar lineup of the movers, shakers, experts, designers, innovators,
investors, and visionaries in this nascent space to provide a clear vision of what the future holds.
But Solid will also showcase how to use these technologies today to create new products,
go from idea to prototype to market in weeks rather than years; to optimize their operations;
to instrument inexpensively; and to bring their products into new markets.
This industry requires something more than a typical butts-in-seats, heads-on-stage conference.
That’s why Solid isn’t being held at some cookie-cutter conference center. It’s being held on the San
Francisco waterfront at Fort Mason. Expect an Expo Hall with some jaw-dropping demos and a crowd
of thought leaders, decision makers, and influencers from fields as diverse as manufacturing, supply
chain, wearables, robotics, environmental sensing, health monitoring, and 3D printing, who are all
looking for the chance to get up close with the tools and technologies they’ll need to chart their future.
So it’s also not a cookie-cutter conference exhibiting opportunity. Solid is a great opportunity
to break out of your booth and use your imagination. Want to make a really big splash? Solid is the
place to do it.
WHY O’REILLY?
From Web 2.0 to web performance to big data, we have a knack for knowing what’s important now
and what will be important next. That’s why the company is followed by venture capitalists, business
analysts, news pundits, tech journalists, and thought leaders who don’t want to miss out on the next
big thing.
In the US, Europe, and Asia, O’Reilly’s Conferences and Summits have forged new ties between
industry leaders, raised awareness of technology issues we think are important, and crystallized
the critical issues around emerging technologies.
We don’t say this to brag. We say it to make a point: we’re not easily hypnotized by hype. We’ve seen
the bubbles build and burst. We’ve been tapping into a deep network of alpha geeks and thought
leaders to recognize the truly disruptive technologies amidst the fluff for over three decades. So
when we invest in a conference, we’re not just following the hype, we’re committed to creating a
community around an issue we believe is transformative.
We believe the programmable world—by whatever name you want to call it—is hugely
transformative. That’s why we‘ve created Solid.
“The barriers
between software
and the physical
world are falling.”
JON BRUNER
SOLID CONFERENCE CO-CHAIR

5
SOLID CONFERENCE
MAY 21 – 22, 2014
SAN FRANCISCO, CA
FOR MORE INFORMATION
CONTACT MIKE HENDRICKSON
MIKEH@OREILLY.COM
617.499.7463
SOLIDCONF.COM
WHO WILL ATTEND SOLID?
■■ Business Leaders who want to harness the upcoming disruptive innovation, stay
competitive, and understand uncharted business models where things are also
services.
■■ Investors who want to stay ahead of this disruptive innovation—and prosper from it.
■■ Innovators and Start-ups in the new digital industrial economy actively seeking
the latest solutions to optimize efficiencies, increase productivity, attract funding,
and grow.
■■ Software Developers who create intelligent, cost-effective, and beautifully
designed things that join the digital world to the physical world.
■■ Hardware Engineers who want their elegantly engineered things to be well
designed, connected, intelligent, and adaptive.
■■ Product Managers and Marketing Execs looking for new ways to connect with
customers in an era of screen fatigue and fragmented attention.
■■ Academics carrying out the basic research in engineering and the sciences that
will enable the connected, sensor-enabled world.
■■ Government Policy Makers and Engineers who define and build connected
infrastructures like intelligent transportation, pollutant sensor-networks, and better
social-services delivery.
“We should be
looking at it as a
way to address
our needs as
human beings…
to connect people
to the Internet
more elegantly,
not just as a source
for more toys.”
KELSEY BRESEMAN
ENTREPRENEUR AT TECHNICAL MACHINE
AND SOLID CONFERENCE PRESENTER

6
SOLID CONFERENCE
MAY 21 – 22, 2014
SAN FRANCISCO, CA
FOR MORE INFORMATION
CONTACT MIKE HENDRICKSON
MIKEH@OREILLY.COM
617.499.7463
SOLIDCONF.COM
“Rather than
seeing industrial
device owners as
barriers to progress,
we should be
looking for ways
to help industrial
devices become
as connected as
appropriate.”
VARUN NAGARAJ
SVP OF INTERNET OF THINGS,
ECHELON
REGISTERED TITLES
5%
CTO
14%
DIRECTOR
9%
PRINCIPAL
4%
MANAGING DIRECTOR
4%
SOFTWARE ENGINEER
3%
SENIOR EDITOR
3%
CREATIVE DIRECTOR
3%
ENGINEER
4%
CO-FOUNDER
9%
VP
9%
SENIOR
MANAGER
2%
GRADUATE STUDENT
OWNER
PRODUCT MANAGER
STUDENT
SVP
14%
CEO
10%
FOUNDER

7
VP, Product IoT Accenture
VP, Platform Engineering Aeris Communications
Product Manager Aerofex
Director of Marketing Alaska Airlines
UX Designer Alaska Airlines
Mechanical Engineer ARM
Senior Technical PM Ars Electronica Futurelab
Senior User Experience Designer Autodesk
Enterprise Architect Cascade Engineering
CEO Cinco Capital GmbH
Product Manager Cisco
Senior Business Analyst Comcast Cable
Principal Engineer Comcast Silicon Valley Innovation Center
Director, Strategic Innovation Danaher Corporation
Head of Strategy Deloitte–Center for the Edge
Director of Research Eli Lilly and Company
Principal Systems Engineer Enphase Energy
Manager Innovation FedEx
VP, Business Innovation Fujitsu Labs of America
Senior Software Engineer General Dynamics
Technology Analyst General Motors
Innovation Design Director Google Creative Lab
Head of Technology Acquisition Hasbro
Principal Scientist HP
Principal Standards and iControl Networks
Ecosystem Evangelist
Interaction Designer IDEO
VP, Strategy Interana
VP, Engineering Interana
CEO Lellan LLC
Director, Software Engineering Marvel Semiconductor
Diretcor of Technology Maxus Global
Founder & President MINIMAL
Product Manager Moxa
Lead Software Engineer NAVTEQ
VP, Business Development Neo Innovation, Inc.
Chief Strategy Officer NGRAIN
VP, Advanced Engineering Nokia
Principal Designer Nokia/Here
Director Research & Development NTT Data
Technical Director Nurun
Reseach & Development
Technology Analyst Orange
Agile SoftwareEngineer Pivotal Labs
Senior Mechanical Engineer Purdue University
Senior Manager, Engineering Raven Standard LLC.
Director of Engineering Re/code
CEO ReZolt
Information Security Senior Analyst Samsung Mobile
UX Director Samsung Research
Diretor, Marketing Research SapientNitro
& Analytics
Manager, Corporate Shasta Ventures
Business Development
Systems Test Business Development ShopLocket
Wireless Business Devlopment Silicon Valley Robotics
VP, Corporate Development SK Planet
VP, and Chief Architect Smart Design
Chief Software Architecture SNUPI Technologies
CEO SNUPI Technologies
Design Technologist Sociometric Solutions
Senior Technical Director Spacehack.org
Creative Technology Consultant Stamen Design
Executive Vice President Stanford
Executive Vice President Superhuman Limited
Executive Vice President Symantec
Executive Vice President Synthetos
President T4G Limited
Senior Product Manager Telenav
Director, Wireless Business Teradyne
Development
Head of Corporate Development Teradyne
VP, Marketing and The Center for Bits and Atoms at MIT
Ecosystem Development
Agilist and Tinker The Kippworks
Art Director The Register
Head of Technology ThoughtWorks
Senior Software Developmer ThoughtWorks
Advisor to the CEO & CTO Tindie
VP, Corporate Strategy TinyPipes
Senior Director, Experience Design Twitter
Co-Founder Twitter
Technical Director USC Annenberg Innovation Lab
VP, Product Strategy VeriSign
Product Strategy Version One Ventures
UX Designer Watershed
SVP, Innovation West Cary Group
SAMPLE SNAPSHOT OF PRE-REGISTERED ATTENDEES

8
SOLID CONFERENCE
MAY 21 – 22, 2014
SAN FRANCISCO, CA
FOR MORE INFORMATION
CONTACT MIKE HENDRICKSON
MIKEH@OREILLY.COM
617.499.7463
SOLIDCONF.COM
Exclusive sponsorship of one of four main areas in the Solid Expo Hall, built for showcasing
demos of innovation and immersive experience:
■■ Solid Companies: Funding, product development, marketing; managing innovation
inside companies large and small; building sustainable businesses
■■ Solid Machines: Design, prototyping, manufacturing, implementation
■■ Solid Society: Cities, health, developing world, economics; finding ways to drive
democratization with technology
■■ Solid Foundations: Materials, synthetic biology, fundamental technologies;
new technologies from universities and research organizations
THOUGHT LEADERSHIP
■■ (2) Article sponsorships on a Solid-related topic*
■■ (3) Guest blogs posted on our sites (consultation and approval from an O’Reilly
editor required)*
■■ (1) 5-minute video, depicting your company’s innovative story (curated and produced
by O’Reilly), shown during Solid and distributed in all O’Reilly channels after the event
ACCESS
■■ (10) 2-day conference passes plus up to (6) booth staff passes
■■ Additional 2-day passes at a 25% discount
EXPOSURE
■■ Company logo, link, and description on event website and mobile app
■■ Opportunity to host a private event at Solid (F&B charges not included)
■■ Top-tier sponsorship designation on event website and in the Solid event app
■■ Main Stage branding: sponsor message shown in housekeeping slides
■■ Onsite signage: double-sided meter board placed in a high-traffic location
■■ (2) Emails to the Solid opt-in attendee list (via third-party mail house)
■■ Access to press list and press kit distribution
PRESENCE
■■ 20' x 20' exhibit space or turn-key demo area for one of the four main
showcasing areas
* Benefit is part of the sponsorship’s continual engagement, which can be delivered anytime during the
year of the conference
SPONSORSHIP LEVELS
CARBON FIBER
SPONSORSHIP
$100,000 (LIMIT 4)

9
SOLID CONFERENCE
MAY 21 – 22, 2014
SAN FRANCISCO, CA
FOR MORE INFORMATION
CONTACT MIKE HENDRICKSON
MIKEH@OREILLY.COM
617.499.7463
SOLIDCONF.COM
THOUGHT LEADERSHIP
■■ (1) Article sponsorship on a Solid-related topic*
■■ (2) Guest blogs posted on our sites (consultation and approval from an O’Reilly
editor required)*
■■ Exclusive sponsorship of (1) Solid newsletter (includes sponsor message, logo,
and link)*
ACCESS
■■ (6) 2-day conference passes plus up to (4) booth staff passes
■■ Additional 2-day passes at a 25% discount
EXPOSURE
■■ Company logo, link, and description on event website and mobile app
■■ Main Stage branding: sponsor message shown in housekeeping slides
■■ Content alignment sponsorship: Exclusive sponsorship of one Solid program track.
Includes signage onsite and three handouts of sponsor literature outside of related
sessions of sponsor’s choice
■■ (2) Emails to the Solid opt-in attendee list (via third-party mail house)
■■ Access to press list and press kit distribution
PRESENCE
■■ 10' x 20' space for demo at Solid
* Benefit is part of the sponsorship’s continual engagement, which can be delivered anytime during the
year of the conference
SPONSORSHIP LEVELS
THERMOPLASTIC
SPONSORSHIP
$50,000 (LIMIT 3)
Premier Area and Demo Space.
Deploy demo of innovation
and immersive experience to
showcase your system, tools,
equipment, lab, etc. Multiple
opportunities available per area.

10
SOLID CONFERENCE
MAY 21 – 22, 2014
SAN FRANCISCO, CA
FOR MORE INFORMATION
CONTACT MIKE HENDRICKSON
MIKEH@OREILLY.COM
617.499.7463
SOLIDCONF.COM
THOUGHT LEADERSHIP
n (1) Guest blog posted on our sites (consultation and approval from an O’Reilly
editor required)*
n Exclusive sponsorship of (1) Solid newsletter (includes sponsor message, logo,
and link)*
ACCESS
n (1) 2-day conference pass plus up to (4) booth staff passes
n Additional 2-day passes at a 25% discount
EXPOSURE
n Company logo, link, and description on event website and mobile app
n Access to press list and press kit distribution
PRESENCE
n 10' x 10' space for demo at Solid
* Benefit is part of the sponsorship’s continual engagement, which can be delivered anytime during the
year of the conference
ACCESS
n (1) 2-day conference pass plus up to (4) booth staff passes
n Additional 2-day passes at a 25% discount
EXPOSURE
n Company logo, link, and description on event website and mobile app
n Access to press list and press kit distribution
PRESENCE
n 6' table-top space for demo, including electrical and internet
SPONSORSHIP LEVELS
ALUMINUM SPONSORSHIP
$25,000
Premier Area and Demo Space.
Showcase your company’s
innovations in the Solid space.
Multiple opportunities available.
EMERGENT INNOVATOR
$5,500
Unique Sponsor Demo. Provide
attendees with a state-of-the-art
demo showcasing your company’s
innovations in the Solid space.

11
SOLID CONFERENCE
MAY 21 – 22, 2014
SAN FRANCISCO, CA
FOR MORE INFORMATION
CONTACT MIKE HENDRICKSON
MIKEH@OREILLY.COM
617.499.7463
SOLIDCONF.COM
EXPECTED PRESS COVERAGE
“Very much a work
in progress, the
stack for IoT will
require rethinking
every layer of the
protocol stack.”
MATTHEW GAST
AEROHIVE NETWORKS

12
SOLID CONFERENCE
MAY 21 – 22, 2014
SAN FRANCISCO, CA
FOR MORE INFORMATION
CONTACT MIKE HENDRICKSON
MIKEH@OREILLY.COM
617.499.7463
SOLIDCONF.COM
PROGRAM COMMITTEE
Marko Ahtisaari
Chris Anderson, 3D Robotics
Paola Antonelli, Museum of Modern Art
Ayah Bdeir, littleBits
Matt Biddulph, Product Club
Mike Bove, MIT Media Lab
Kipp Bradford, Kippworks
Rodney Brooks, Rethink Robotics
Liam Casey, PCH International
Tom Coates, Product Club
Rob Coneybeer, Shasta Ventures
David Cranor, MIT Media Lab
Kenneth Cukier, The Economist
Michael Dewar, New York Times
Renee DiResta, O’Reilly AlphaTech Ventures
Ian Ferguson, Formlabs
Brady Forrest, Highway1
Limor Fried, Adafruit
José Gómez-Márquez, MIT Little Devices Lab
Horst Hoertner, Ars Electronica Futurelab
Henry Holtzman, MIT Media Lab
Rachel Kalmar, Misfit Wearables
Michael Korpi, Baylor University Film & Digital Media
Coco Krumme, MIT
Natan Linder, MIT Media Lab
Pranav Mistry, Samsung Think Tank Team
Joe Paradiso, MIT Media Lab
Amanda Parkes, Columbia University
Arthur Petron, MIT Media Lab
Amanda Peyton, Grand St.
Ivan Poupyrev, Walt Disney Research
Venkatesh Prasad, Ford Motor
Colin Raney, IDEO
Antonio Rodriguez, Matrix Partners
Andy Rubin, Google
Peter Semmelhack, Bug Labs
Yodit Stanton, opensensors.io
Gerfried Stocker, Ars Electronica Center
Linda Stone, Generalist
Phil Torrone, Adafruit
Bruce Upbin, Forbes
Trae Vassallo, Kleiner Perkins Caulfield & Byers
Ben Waber, Sociometric Solutions
Jenn Webb, O’Reilly Media
“The imbrication of
digital and analog
environments is
bringing us to
a revolutionary
information
crossroads.”
ANDY FITZGERALD
DELOITTE DIGITAL

13
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