Microcool General Liquid Cooling Presentation

Micro Deformation Technology
MicroCool® Liquid Cooling Overview Presentation
June 2015

Who is Wolverine?
 A Rich History, A Solid Foundation, A Bold Future
− Wolverine has 90+ years history with decades long customer partnerships
− In 1935, Wolverine invented the first high performance heat transfer tubes and
revolutionized the HVAC commercial chiller industry
− Wolverine is the premier heat transfer design partner for OEM’s
− Metal Joining, Brazing Products, Tubular Assembly
− Global core markets served: HVAC, Refrigeration & Appliance, Water Heater/Boiler,
Process & Chemical, Electronics Cooling
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Wolverine - MicroCool Confidential 2015

Global Customer Partnerships
3

Wolverine Operations
Global Locations
San Diego, CA
Bend, OR
Rapid City, SD
Decatur, AL
Shanghai, China
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MicroCool Division
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 WLV MicroCool division has taken the same deformation process used on
tubes and adapted it be used on flat plates.
 The flat plate surface enhancement range has been optimized to suit liquid
cooling of electronics.
 Leveraging Wolverine's core high temperature joining and fabricated
assembly technologies they can turn these enhanced surfaces into
complete cold plate assemblies.
 MicroCool is able to create custom, cost effective, high performance mezzo
and micro channel cold plates quickly and with a high degree of flexibility.
Enhanced Tube Enhanced Flat Surface

MDT – Micro Deformation Technology
•Patented tooling and process.
•Work piece is cut, deformed and stretched by up to 150%.
•No loss of material during the fining operation.
•Fining is done without the addition of heat and can be done
without lubrication if needed.
•Little tooling or setup required, similar to CNC machining.
6

MDT Flexibility
 Fins per inch: 650-8 (255-3 Fins/Centimeter)
 Fin thickness to fin gap ratio: 1:1 – 1:3
 Fin height to fin thickness ratio up to 15:1
 Max fin gap: 1.2mm +
 Pins can be formed in either an in-line or staggered pattern.
 Pin diameter and gap vary from 1mm to 0.5mm
 Pin height to diameter ratio up to 8:1
 Fins or pins can be applied over large surfaces up to 1X1 meter
 Fins or pins can be added in specific “island” locations or on across entire surface
 All of these options can be varied with little to no setup or tooling (a customer could
easily try multiples of different fin or pin geometries with one fixture)
150 fins per inch (60 f/cm)
1mm tall
12 fins per inch (5 f/cm)
5 mm tall
GapThk
Example
Pin array
7

MDT Geometry Options - Fins
4mm tall
50 fpi
.25mm thk
.25 mm gap
4mm tall
25 fpi
.5 mm thk
.5 mm gap
Common Fin Pitches
200 fpi = 0.0625mm thk
100 fpi = 0.125mm thk
50 fpi = 0.25mm thk
25 fpi = 0.5mm thk
12 fpi = 1.0mm thk
•Fins can be created in both copper and aluminum
•Fins can have knife edge or be flat (see above)
•Fins can be straight or slightly curved (see above)
•Back-wall minimum thickness 1mm
•Fin thickness to gap normally 1:1 but can vary
Design Flexibility
8

MDT Geometry Options – Pins
Staggered Pin
~1mm gap
In-line Pin
~1mm gap
•Pins can be staggered or in-line
•Pins can be created from 12 FPI to
200fpi, [20fpi (0.5mm) shown to the left)]
•Pins can be created on both aluminum
and copper.
•Pins can have pointed or flat tops (see
above)
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MDT Material Options
Copper
 C110
 C101
 Most copper
alloys
Aluminum
 1000 series
 3000 series
 5000 series
 6000 series*
 7000 series*
Other
 Clad Metals
 CuNi
 Steel*
 Titanium*
 Plastics
 Brass
 CTE
materials**
* More difficult **Limited success with current materials but open to R&D of new materials
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MicroCool’s standard liquid cooled IGBT coldplates are designed to fit most of the common IGBT
configurations used today. At the heart of each MicroCool® cold plate is our patented MDT in line pin fin
surfaces. CFD optimized for balanced flow for parallel cooling. The MicroCool 3000 Series has
unmatched performance and price. Visit our On-Line Store to purchase any of these standard.
MicroCool’s® parallel cooling and
flow balancing system provides
best in class performance and
uniform IGBT temperature
MicroCool’s® MDT™ geometry is
strategically placed under high heat flux
areas to maximize heat transfer
coefficient and minimized wasted flow.
MDT In-Line Pin Fin ™ offers the best
thermal performance per pressure
drop while maintaining a 1mm flow
gap on the market today
MicroCool 3000 Series Standard Coldplates
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MicroCool’s 3000 Series standard coldplates are built around a set of 4 standard extrusions. This
reduces cost and increases volume manufacturability.
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4 Different aluminum extrusion sizes to fit 90% of
the power modules on the market today.
Balanced parallel flow path
FSW plugs
Friction stir welded
construction

MicroCool’s standard liquid cooled IGBT coldplates are designed to fit most of the common IGBT
configurations used today. At the heart of each MicroCool® cold plate is our patented MDT in line pin fin
surfaces. CFD optimized for balanced flow for parallel cooling. The MicroCool 2000 Series has
unmatched performance and design flexibility. Visit our On-Line Store to purchase any of these
standard.
MicroCool’s® parallel cooling and
flow balancing system provides
best in class performance and
uniform IGBT temperature
MicroCool’s® MDT™ geometry is
strategically placed under high heat flux
areas to maximize heat transfer
coefficient and minimized wasted flow.
MDT In-Line Pin Fin ™ offers the best
thermal performance per pressure
drop while maintaining a 1mm flow
gap on the market today
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MicroCool’s 2000 Series Standard Coldplate design is very similar to the 3000 Series.
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While the same fin plate is used a machined tub
is made versus an extrusion. While this design
is more expensive it allows for more flexibility in
use.

2000 Series Semi-Custom Coldplates
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0.00 0.50 1.00 1.50 2.00 2.50 3.00
-0.009
0.041
0.091
0.141
0.191
0.241
0
0.5
1
1.5
2
2.5
3
3.5
2 4 6 8 10
Flow Rate (gpm)
PressureDrop(bar)
PressureDrop(PSI)
Flow Rate (l/min)
MicroCool std
MicroCool xp
0.00 0.50 1.00 1.50 2.00 2.50
0.004
0.006
0.008
0.01
0.012
0.014
0.016
0.018
2 4 6 8 10
Flow Rate (gpm)
ThermalResistance(C/W)
Flow Rate (l/min)
MicroCool std
MicroCool xp
Performance Graphs
Coolant used: 50/50 EGW
Thermal Resistance is
calculated as the difference
from maximum coldplate
temperature to the inlet
temperature coldplate temp
divided by the total power on
the coldplate.
Pressure drop is calculated
from inlet to outlet and
includes a Parker 05TB-6-6
barbed fitting.
*Performance data based off
empirical testing of CP-1001.
MDT STD In-line pin fin:
• 4mm tall
• 12 fin per inch
• 1mm min gap
• Twisted in line pin
MDT XP In-line pin fin:
• 4mm tall
• 20 fin per inch
• 0.5mm min gap
• Twisted in line pin
Standard Coldplate Performance and
Specifications
Specifications
Material: 6061 (tub),
1100 (fin area)
Ports: 9/16-18 UNF-2B
SAE-J1926/1
Pressure: tested to 120
psi
Weight: 3.16lbs
Surface: 0.8um
Flatness: 0.25/25.4mm
Semi-Standard
Options
Fitting type and location
(NPT, BSPP)
Light weight options
(remove excess
material)
Double sided cooling
Copper options
Visit us on-line to see
our full list of Semi
Standard and custom
coldplate options
www.microcoolin
g.com
17

Custom Coldplates
Let MicroCool® develop a custom, micro-channel cold plate for your specific
application by providing you a design that becomes your unique solution. Our
engineers will build a custom cold plate cooling solution designed to achieve your
performance requirements by using our patented Micro Deformation Technology
(MDT), which is highly flexible and can create a wide variety of fin, pin and micro-
channel geometries.
18

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Custom Power Electronic
Applications

Power Electronic MicroCool® Product Evolution
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MicroCool®
Integrated base plate
MicroCool®
Advanced cold plate
MicroCool®-DBC™
Direct Cooled Chip

Automotive Baseplate - CFD fin and pin optimization
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•10 fins per inch
•Fin height: 5 mm
•Fin thickness: 1.27 mm
•Fin gap: 1.27 mm
•8 fins per in /w 90 ° x-cut
•Fin height: 5 mm - 6mm
•Fin thickness: 1 - 1.6 mm
•Fin gap: 1 - 1.6 mm
CFD analysis data comparing different fin structures to meet customer challenging requirements:
•Cool 92 W/cm2 with a 20°C temp rise from the coolant to the coldplate surface
•Thermal resistance less than 0.12 c/w
•Maintain a pressure drop of less than 1.5psi (0.103 bar)
•Maintain a gap between the fins greater than 1mm to prevent particulates from blocking the flow channels

Automotive Baseplate - Contour Plots: In-Line Pin Fin 6mm Tall - 5l/min
22
•6mm tall spiral pin fins, 8fpi
•Flush with cover
39.2
40.141.5
42.543.3
44.2
Thermal Resistance: .115 c/w

Aluminum Comparison of MicroCool® to Folded Fin
23
MicroCool Straight Fin
•8 FPI
•4mm tall
•1.5mm fin
•1.5mm gaps
MicroCool Staggered
Pin
•8 FPI
•4mm tall
•1.5mm fin
•1.5mm gaps
MicroCool In-Line Pin
•8 FPI
•4mm tall
•1.5mm fin
•1.5mm gaps
Brazed Folded Fin
•4mm tall
•Offset Folded Fin
•0.05mm fin thickness
•2mm min gap
Not Tested

24
0.010
0.020
0.030
0.040
0.050
0.060
0.5 1.0 1.5 2.0 2.5 3.0
ThermalResitance(C/W)
Pressure Drop (PSI)
Thermal Resistance per Pressure Drop
Aluminum Folded Fin
MicroCool™ Aluminum Straight Fin 12fpi
MicroCool™ Aluminum In-Line Pin Fin 8fpi
For the same amout of pressure drop the coldplates with
MicroCoolTM MDT surfaces have a much lower thermal
resistance.
For example: At 1psi pressure drop the folded fin coldplate
has a thermal resistence of about 0.049 C/W and for the
same pressure drop the MicroCool Straight Fin has about
0.026 C/W thermal resistance. This is over 1.8X better, at a

MicroCool-CAP™
integrated base plate with metal cover
25
Heatsink or coldplate
MicroCool®
Integrated base plate
MicroCool®
advanced cold plate

26
MicroCool® Cap for Maximum Power Density
• Size, Weight, Power
• Reduces thermal resistance by eliminating TIM and extra copper thickness
• No need for customer to purchase as cooling solution.
• Integrated baseplate with cover eliminates the need for customer to design a “tub” and
customer designed o-ring seal.
• Since its all copper construction it eliminates the corrosion issues between copper
baseplate and dissimilar metal covers.
• This design allows use of a hot fluid to solder die to the baseplate/coldplate.
• Bottom area of coldplate normally reserved as a cooling surface can now be used for
power or other connections.

Wolverine MicroCool Confidential 2011
27
Plastic IGBT Module Cover
IGBT/Diodes/Electronics
Liquid Cooled Copper MicroCool
Baseplate with Cover
Snap-in Plastic Bottom Cover
Concept Exploded View

28
3 Phase Inverter Example – Thermal Performance
30 to 50%
improvement in
thermal
performance

MicroCool®-CLAD™ integrated base plate with clad metal
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Aluminum fins with copper
backing – reliable bond
Creates a high power
copper IGBT module that
can be cooled in an
automotive style aluminum
die cast manifold/tub
Less weight and cost

Results Summary
MicroCool Cu Inline Pin MicroCool Al Inline Pin MicroCool Clad Inline Pin Forged Cu Round Pin
Temp CP Surface (°C) 32.80 38.53 36.12 36.23
Temp Junction (°C) 44.35 49.66 47.79 47.73
Temp Outlet Fluid (°C) 20.89 20.84 20.91 20.90
Pressure Drop (bar) 0.0131 0.0131 0.0131 0.0159
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6 l/min of 50/50EGW at 20°C with 300 watts
• As expected MicroCool Clad is performance is in between
that of pure aluminum and pure copper.
• When MicroCool Clad with inline pin fin offers the same
performance as the forged copper part but with 17% less
pressure drop.

Wolverine Tube acquires HFW
31
• Best in class friction stir welding for large and small aluminum designs
• Specializing in mixed aluminum joining AL6061, cast, extrusion, AL1100
• Precision machining capability for large and small parts.
• www.hfwebster.com

MicroCool Tool
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MicroCool Services
33
Design / Simulation / CFD / Testing

Microprocessor
Single Phase
Applications
• Single Phase Closed Loop (Stand alone)
• Single Phase Open Loop (Distributed pump)
• Single Phase Open Loop (Centralized pump)
34

CoolIT – Commercial Liquid Cooling Systems
35
Worlds leading manufacturer of active
liquid cooling systems for the enthusiast
consumer, high end server market
•Based in Calgary, Canada
•Manufactures in Shenzhen China
•Purchased Delphi’s liquid cooling div.
•Major Supplier to Corsair
•High volume of base plates per month
•100% supplied by MicroCool™ in China
•Fully Certified ISO 9001 Plant
•Potential blade server partner, data center
•Retail for $80.

CoolIT - MicroCool® Advantage
36
Design of the copper coldplate and manifold
was highly optimized to take advantage of a
very dense fin pitch but still provide low
pressure drop.
Thermal resistance of 0.05 c/w at a flow rate
of only 0.5 l/min

Example High Volume Customer
Leading manufacturer of liquid cooling systems for consumer & high performance server market
•Based in Calgary, Canada
•Assembly in Shenzhen, China
•MicroCool® As Supplier:
•High volume of base plates per month
•100% supplied by MicroCool® in China
•Fully Certified ISO 9001 Plant
•100% On Time Delivery for 3 years
• 21 DPPM in 2013
37

IBM – Aquasar with MicroCool® inside
38
IBM Committed to Zero
Emissions Data Center
•Wolverine designed the basic
cold plate design, 2008
•Integrated with EPFL and IBM
Zurich blade design, 2009
•Only cold plate to meet thermal
performance, 2008
•Lowest cost cold plate option
•First 100 cold plates still in test
at ETH, Zurich, 2010
•Wolverine awarded total cooling
loop for initial pilot application
and certification, 2009.
•Five systems installed in ETH
2010. Working well today.

39

Fujitsu Current Liquid Cooling Loop
40

Microprocessor
Two Phase
Applications
• Two Phase Closed Loop (Stand alone, air cooled)
41

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Thermosyphon Cooling Loop
• Requires no wicking material
• Requires no pump for fluid
• Can handle substantially higher heat
flux than single phase systems
• Closed loop system, no fittings to leak
• Refrigerant leaks are low risk to damaging electronics
Advantages
Wolverine’s MicroCool division
brings decades of experience
both engineering and
manufacturing enhanced boiling
surfaces. MicroCool’s MDT
technology fills the unique
application of both pool boiling or
flow boiling.

43
CPU Thermosyphon Cooling Loop
• 245fa Refrigerant
• 3003 and 1100 Aluminum
• Brazed Construction
• MicroChannel Evaporator
• Multiport tube/Folded Fin Condenser

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CPU Thermosyphon Cooling Loop
• Air Inlet Temp: 20C (+/- 1C)
• 10 CFM (1.5 m/s velocity)

45
Dual CPU Thermosyphon Cooling Loop
• 245fa Refrigerant
• Multiport tube/Folded Fin Condenser
Use Case:
• 350 CFM AirFlow
• 40 C inlet Air
• 500 W per processor (1,000W total)
• Max Coldpate temperature 75 C

46
Rack level thermosyphon evaporator
• 134a Refrigerant
• 18 independent heat sources (2Kw total)
• 1 to 18 heat sources running at a time
• TIM interface to heat source

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Rack level thermosyphon evaporator

Microcool General Liquid Cooling Presentation

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