1. Product Engineering Services
for Communication Products

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Copyright Teleconnect GmbH – All rights reserved
FACTS AND FIGURES
• Founded: June 27, 1990
• Employees: 27
• Annual turnover: ~ 2,7 Mio EUR p.a.
• Management:
– Rüdiger Klein, Managing Director
– Philipp Rietzsch, Head of R&D
• Headquarter:
Am Lehmberg 54,
01157 Dresden
Germany
Phone: +49 351 4236-210
E-mail: info@teleconnect.de
Web: https://www.teleconnect.de
Dresden

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Copyright Teleconnect GmbH – All rights reserved
PRODUCT ENGINEERING SERVICES FOR COMMUNICATION PRODUCTS
Product Development from Idea over Concept to a complete System
Hard- and Software Development
Main Business Fields: Telecommunications, Optical High-Performance Networking , Data
Transmission Technologies, Industrial Automation, Test and Qualification of Transmission Systems
Experts in many wired communication technologies especially: ISDN, SHDSL, ADSL, ADSL2+, VDSL,
VDSL2, G.fast, G.hn, GiGAWiRE (G.now), Ethernet/SPE, … and more

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Copyright Teleconnect GmbH – All rights reserved
Services

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Copyright Teleconnect GmbH – All rights reserved
RANGE OF SERVICES
Pre- and Feasibility Studies
matching suitable
Communication
Technologies to
Applications
Hard- and Software
Specification and
Development
PCB Layout Mechanical Design Software Integration
Manufacturing Prototypes
in Cooperation with our
EMS Partners
Bring-up and Verification
Testing
Software Testing
(Unit, Integration and
System Test)
EMC Pre-testing during
Development
Environmental Testing
Optical Transceiver Testing
CE Certification in
Cooperation with
accredited Partners
Support for
•Industrialization
•Manufacturing Test
specification, software
development, and equipment
Change Management
during Product Life Cycle
Field Application Support

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Copyright Teleconnect GmbH – All rights reserved
SERVICES
HARDWARE DEVELOPMENT
• Engineering Services and Consulting for Hardware
Design and Development
• Turn-key Product and System Development taking a
Project to a working Prototype, Design Transfer to
Volume Manufacturing and Production Support
• Implementation of Circuit Design, Layout, and
Simulation
• Development on the Basis of leading Microcontrollers
and FPGAs
• Usage of Component Library owned by Teleconnect or
the Customer

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Copyright Teleconnect GmbH – All rights reserved
SERVICES
PCB LAYOUT
• Design of complex PCB Layouts
• Creation of Library Elements (Symbols, Geometries,
Mappings)
• Production of Schematics and Component Lists, Circuit
Board Design as well as the Generation of all Data required
for Production and Assembly
• Compliance with DFM, DFA, DFT, and the international IPC
standards
• Expert in all common Technologies: multilayer 4-36,
analogue / digital / high-frequency, HDI (high density)
Boards, Microvia / blind / buried via, production-
optimized, HiSpeed, hybrid, LTCC design, the use of BGAs
with more than 1,000 pins
• Impedance-controlled and EMC-conform Design
• Calculation of the layout geometries, single ended and
differential traces for the respective stackup using polar
• Results
– PCB Manufacturing: Gerber and NC Drill Files, ODB++
(optionally), IPC-D-356 File for electrical Test, Drill Drawing
PDF-File,
– Assembly Manufacturing: BOM, Stensil Apertures for Solder
Paste, Component Placement File, Assembly Diagram for top
and bottom Layers, Schematic Files
Development Tools
• Mentor/Siemens Xpedition Enterprise VX 8.2 (plus:
DxDesigner, Library Manager, Variant Manager)
• CADENCE Allegro Release 17
• Altium Designer 23.x
• CadSoft EAGLE
• SPECCTRA Autorouter

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Copyright Teleconnect GmbH – All rights reserved
SERVICES
EMBEDDED / FIRMWARE DEVELOPMENT
• Embedded and Firmware Development creating
intelligent Products & Devices for the
Telecommunications and Industrial Automation
Industries
• Software Architecture
• Software Coding
• Unit, Integration, and System Testing
• Software Porting
• Software Optimization Operating Systems: WindRiver VxWorks, pSOS+/pROBE,
Enea OSE, RTOS, Embedded Linux
I/O Technologies: USB, Serial drivers, CAN, VME/VPX,
PCI/PCIe/CPCI, I2C, SPI, SCSI, Ethernet
Processor Competencies: ARM, MIPS, Intel x86, PowerPC,
PICs from Microchip (MPlab), RABBIT 2000
Communication controller (e. g. HSCX, ESCC2, ESCC8,
RAC)

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Copyright Teleconnect GmbH – All rights reserved
SERVICES
3RD-PARTY OPTICAL TRANSCEIVER TESTING & VERIFICATION
• Testing for Compliance and Compatibility to Equipment
Manufacturer Standards by a System Developing Company
• Full-range of Verification Tests:
– Transmitter Parameters
• Average Output Optical Power
• Optical Metrics:
– Optical Modulation Amplitude
– Extinction Ratio
• Various Quality Tests (Eye diagram, Eye Cross-Ratio (Crossing),
Jitter Time (RMS), Bias current, Wavelength, Optical Endface
Inspect)
– Receiver Parameters
• Receiver Sensitivity and Bit Error Test
• Path Penalty
• Minimum overload
– Ageing and environmental Tests
• Temperature : -20 bis 85°C
Extinction Ratio Measurement

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Copyright Teleconnect GmbH – All rights reserved
QUALITY AND PROJECT MANAGEMENT
• Product Development Projects are challenging in Terms of
technical Risks, complex Communication, and Supply Chain
Issues
• However, to complete these Projects in Time, within
Budget, and with the expected Results (Features and
Performance Characteristics) does not have to be a Miracle
• Teleconnect uses a Process-based Approach, where those
Tasks, which can be planned, are planned, and those, which
cannot be planned, are monitored closely
• Our Project Management System and Method is tailored to
ensure Priorities are properly cascaded to all Team
Members and the Plan is always up-to-date
• Our Customers benefit from frequent Project Updates and
complete Transparency
• Our Quality Management System is ISO 9001 certified with
a focus on Quality in repeatable, trainable Project Tasks

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Copyright Teleconnect GmbH – All rights reserved
RELIABLE PARTNER
• More than 30 years experience in wired communication technologies
• Long and close cooperation to large chip vendors like Intel or MaxLinear
• Early adopter for new communication technologies
• Participant in many standardization bodies and organizations related to
communication technologies:

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Copyright Teleconnect GmbH – All rights reserved
Product Overview

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Copyright Teleconnect GmbH – All rights reserved
PRODUCT SCHEME
G.hn
G.hn
SHDSL
SHDSL
VDSL2
VDSL2
Security, IIoT
Security, IIoT fastvpn switchbox, JUPITER
fastvpn switchbox, JUPITER
G.fast
G.fast
PCIE
PCIE
VDSL2.PCIE.220
VDSL2.PCIE.518
GFAST.PCIE.359
general
general
SHDSL.EVB.1CH
SHDSL.EVB.4CH
GHN.DIN
GHN.(EVB.)SOM
M.2
M.2
SHDSL.M2.1CH
SHDSL.M2.4CH
VDSL2.M2.220.A
VDSL2.M2.220.B
GHN.M2
SW
SW
SHDSL.SW.Px
VDSL2.SW
GFAST.SW
GHN.SW

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Copyright Teleconnect GmbH – All rights reserved
PRODUCT SCHEME
G.hn
G.hn
SHDSL
SHDSL
VDSL2
VDSL2
Security, IIoT
Security, IIoT fastvpn switchbox, JUPITER
fastvpn switchbox, JUPITER
G.fast
G.fast
PCIE
PCIE
VDSL2.PCIE.220
VDSL2.PCIE.518
GFAST.PCIE.359
general
general
SHDSL.EVB.1CH
SHDSL.EVB.4CH
GHN.DIN
GHN.(EVB.)SOM
M.2
M.2
SHDSL.M2.1CH
SHDSL.M2.4CH
VDSL2.M2.220.A
VDSL2.M2.220.B
GHN.M2
SW
SW
SHDSL.SW.Px
VDSL2.SW
GFAST.SW
GHN.SW
available available from our partner

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Copyright Teleconnect GmbH – All rights reserved
PRODUCTS
SHDSL
• SHDSL-EFM Modem
• Single or quad channel Intel® SHDSL
Chipset transceiver
• Selectable bitrate (including auto mode)
• Use as EFM Modem, SHDSL-EFM-Module
or Plug & Play Ethernet Extender
• M.2 connector (Key B+M) or Evaluation
board
• Intel® Ethernet Controller I211 Series
(M.2 version)
• Made for universal enterprise CPE / IAD
/Gateway / Router / PC / White Box CPE
0
2
4
6
8
10
12
14
16
18
0 1 2 3 4 5 6 7 8
Data
Rate
in
Mbps
Reach in km
Extended Data Rate
Rate/Reach Performance Measurement of Intel® SHDSL Chipset. Extended Data Rate, cross-talk-cancelled,
sequential startup, 4-pair bonding, standard twisted copper pair phone cables, no alien noise

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Copyright Teleconnect GmbH – All rights reserved
PRODUCTS
SHDSL MODEMS AND EVALUATION BOARDS
SHDSL.EVB.1CH
SHDSL.EVB.4CH
SHDSL.M2.1CH
SHDSL.M2.4CH
Technology contribution from

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Copyright Teleconnect GmbH – All rights reserved
PRODUCTS
SHDSL SOFTWARE PACKAGES
Technology contribution from

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Copyright Teleconnect GmbH – All rights reserved
PRODUCTS
VDSL MODEM – VDSL2.M2.220
• VDSL2-EFM Modem
• Plug & Play VDSL2 module for M.2
• ADSL fallback (auto-detection)
• Intel‘s VRX220 transceiver
• Intel® Ethernet Controller I211 Series
• Available for oPOTS and oISDN regions
• M.2 connector (Key B or M)
• Fully transparent bridge for VDSL2 and ADSL (1
VC), to enable routing on host
• Made for universal enterprise CPE / IAD /Gateway
/ Router / PC / White Box CPE
0
50
100
150
200
250
0 1 2 3 4 5
Data
Rate
in
Mbps
Reach in km
ADSL2+
VDSL2+ 30a
VDSL2+ 17b
Technology contribution from
Rate/Reach Performance Measurement of Intel® VRX220, cross-talk-cancelled,
standard twisted copper pair phone cables, no alien noise

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Copyright Teleconnect GmbH – All rights reserved
PRODUCTS
G.FAST MODEM – GFAST.PCIE.359
• G.fast EFM Modem
• Plug & Play G.fast module for PCIe Low Profile or vCPE
• VDSL2 fallback (auto-detection)
• Intel‘s VRX619 transceiver
• Intel® Ethernet Controller I211 Series
• Available for oPOTS and oISDN regions
• PCIe Low Profile or vCPE connector
• Fully transparent bridge for G.fast and VDSL2, to enable routing on host
• Made for universal enterprise CPE / IAD /Gateway / Router / PC / White
Box CPE
Technology contribution from
prototype

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Copyright Teleconnect GmbH – All rights reserved
PRODUCTS
G.HN BRIDGE – GHN.M2
• G.hn/G.now Transparent Bridge
• G.hn/G.now phone line uplink port with a
maximum rate of 1.7 Gbps
• Best suited for industrial networking, more
reliable and faster than conventional wireless
networking
• Signal quality indication
• Status and statistics of Ethernet Interface
• Fully transparent bridge for G.hn/G.now, to
enable routing on host
• Made for universal enterprise CPE / IAD
/ Gateway / Router / PC / White Box CPE
Throughput/Distance of G.hn chipset from MaxLinear, standard
twisted copper pair phone cables (Source: M. C. Gomez, “EVALUATING
THE IMPACT OF 10G ON NEXT-GENERATION FTTDP NETWORKS,” 2017)

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Copyright Teleconnect GmbH – All rights reserved
PRODUCTS
G.HN / POWER LINE COMMUNICATION – GHN.SOM.PLC
• PLC-coupling without insulation on-module
• Single wire-range power-supply
• MIMO operation for maximum performance
• Best in-class connectivity and robustness
• Best interoperability to various G.hn-chipsets and devices,
guaranteed coexistence (G.9972)
• G.hn: ITU-T G.9960/9961/9962/9963/9964
• Ethernet: IEEE 802.1d transparent bridge,
802.3/802.1p/802.1q
• Management via Webinterface, custom config tool or
even TR-069
• Data-Interfaces: SGMII, RGMII, MII
• Enables connection of external Microcontroller or
Ethernet-PHY
• Flexible software with extensible features like control of
GPIOs or custom interfaces can be provided by
Teleconnect!
• Direct solder-on or versatile 2.0 mm pin-header interface
58 mm
30
mm
Dimension of cooling pads:
1 mm x 1 mm
10 mm
2 mm
5
mm
Application Reference
Board

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Copyright Teleconnect GmbH – All rights reserved
Thank you for your Attention