The document provides information about an upcoming summer school on optical interconnects to be held in Thessaloniki, Greece from June 3-6, 2014. It will be co-organized by the Aristotle University of Thessaloniki and the Centre for Research and Technology Hellas. The summer school will focus on high-performance, low-energy, and low-cost optical interconnects for data centers and high-performance computing systems. It will feature speakers from leading academia and industry and cover various topics including on-board, on-chip, and data center interconnects.

1. Organized by
Organizing Comittee
About Thessaloniki
Thessaloniki, is the second largest city in
Greece and a modern metropolis that
bears the marks of its stormy history and
itscosmopolitancharacter.
It was named after the half-sister
of Alexander the Great, which according
to the myth, she became a mermaid after
Alexander’sdeath.
Thessaloniki is connected directly to many national and international
destinationsvia its international airport “Macedonia” (IATA: SKG).
Website
Email
It is located in the northern part of
Greece at the coast of Thermaikos.
Thessaloniki hosts the largest Greek
university, which has been named
after the Greek philosopher Aristotle
who was the teacher of Alexander the
Great.
Chairs:
Prof. Nikos Pleros (AUTH/CERTH)
and
Dr. Dimitris. Tsiokos (CERTH)
Technical Comittee
Dr. Dimitris Apostolopoulos
(ICCS/ NTUA)
Dr. Paraskevas Bakopoulos
(ICCS/ NTUA)
Prof. Hercules Avramopoulos
(ICCS/ NTUA)
Dr. Tolga Tekin (Fraunhofer, IZM)
Local Comittee
Ms. Stavroula Maglavera (CERTH)
Ms. Theoni Alexoudi (AUTH/CERTH)
Ms. Stella Markou (AUTH/CERTH)
Supported by
http://www.oi-summerschool.eu/
Optical
3-6 June 2014
Interconnects
in Thessaloniki, Greece
Co-organized by the Greek national research institute namely
Centre for Research and Technology Hellas (CERTH) and the
National Technical University of Athens (NTUA) in the frame of
European ICT Project PhoxTroT, the summer school focuses on
high-performance, low-energy and low-cost optical interconnects across
the different hierarchy levels in data center and high-performance
computing systems.
Summer School on
IBM Zurich (B. J. Offrein)
Xyratex (R. Pitwon)
UC Berkley (V. Stojanovich)
IMEC ( )G. van Steeberge
Speakers from
leading academia ...
TE CONNECTIVITY( )J. Duis
COMPASS EOS
( )H. Hasharoni
TTM ( )M. Immonen
AMS ( )J. Kraft
University of Keio
(T. Ishigura)
University of Twente
(S. G. Blanco)
VTT ( )M. Cherchi
University of Paris-Sud
( )L. Vivien
Phoenix
( )A. Bakker - R. Broeke
University of Burgundy
(A. Dereux )
CNRS ( )F. Raineri
and industry
Mellanox ( )E.Mentovich
University of Patra (E. Varvarigos)
TU München (R. Meyer)
AMO ( )T. Wahlbrink
Fraunhofer, IZM
(D. Manessis - L. Brusbeg)
UPVLC (A. Brimonte)
oi-summerschool@iti.gr
IEEE COMMUNICATIONS
SOCIETY - Greek Chapter
IEEE COMPONENTS, PACKAGING
AND MANUFACTURING
TECHNOLOGY SOCIETY - German Chapter
TU Eidhoven (K. Lawniczuk)

2. RegistrationFees
Registration includes:
üSummer School sessions
üStudent poster presentation,
üUSB stick with the proceedings
üLunch & Coffee breaks every day,
üSocial event/Dinner
Venue: A.U.T.H
Research Committee
3rd September Str.
University Campus
Full time Registration Fee (before 30 April 2014)
200 €
Full time Registration Fee (after 30 April 2014)
€250
Aristotle University of Thessaloniki /CERTH
- 1 Day Delegate Fee
30 €
Aristotle University of Thessaloniki /CERTH
- Full-Time Delegate Fee
80 €
Online Registration Opens 15 February 2014
Applications:
Data Center Architectures and Topologies, E. Varvarigos
Active Optical Cables and Advanced Multiplexing
Techniques, P. Bakopoulos
Topics and Lectures
On-board interconnects:
Design and Fabrication of MM polymer PCBs ,T. Ishigura
Single-Mode glass-based PCBs, D. Manessis and L. Brusberg
Optoelectronic Assembly and Packaging, G. van Steeberge
On-chip Interconnects and CMPs:
Optical interconnects for Chip Multiprocessors, N. Pleros
and K. Vyrsokinos
Photonic Network-on-Chips , M. Stojanovic
On-chip interconnects
and Photonic Integration Technologies:
nm-scale Silicon Photonics Building Blocks, T. Wahlbrink
Plasmonics integration technology and building blocks,
A.Dereux
Actives on SiGe integration platform, L.Vivien
Silicon Photonic Modulators & switches, A. Brimont
Lasers, switches and memories using III-V on SOI, F. Raineri
μm-scale Silicon photonics technology, M. Cherchi
Designing Photonic chips, A. Bakker and R. Broeke
Integrated Optical Amplifier technologies, S. Garcia-Blanco
The Industrial Perspective:
Optical Interconnects in Data Storage Systems, R. Pitwon
Optical Interconnects for Energy Efficient Data Centers, B. Jan Offrein
The Oceanos Cloud Computing Platform, N. Kozyris
Data Centers for Cloud Applications, G. Nolis
Active Optical Cable technologies, J. Duis
Mid-Board Optical Modules, E. Mentovich
Router Optochips and Interfaces, K. Hasharoni
Optical PCBs: the new "motherboard"?, M. Immonen
Optical waveguide and PCB design rules, R. Pitwon
Optochips and 3D System-in-Package integration, J. Kraft
Packaging and Assembly for 3D SiPoptochips, T. Tekin
VCSEL transmitter technologies, R. Meyer
InP-based Photonic Integrated Components
and Circuits ,K. Lawniczuk
Opening Talk: D. Tsiokos & N. Pleros
Setting the scene: Why Optical Interconnects? B. Offrein ,
and D Tsiokos