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Trade Show Pop-Up Banner Design

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Result: Increased number of leads. Increased general foot traffic. Got the attention of people from afar. Move prospects down the funnel.

Publicada em: Marketing
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Trade Show Pop-Up Banner Design

  1. 1. ADVANCED PACKAGING LITHOGRAPHY STEPPER • 0.8 µm L/S Resolution • ≤ 150 nm Overlay Accuracy • 52 x 34 mm Large Exposure Field • ≤ 500 nm Backside (bottom) Overlay Accuracy • Vacuum Assist System to Reduce Wafer Warpage • 0.15 – 0.24 Numerical Aperture
  2. 2. NEED HIGH DENSITY PATTERNING? 0.8 µm RESOLUTION FOR YOUR ADVANCED PACKAGING NEEDS • Sub-micron Resolution • High Overlay Accuracy • Large Exposure Field • Backside Wafer Alignment • Variety of Geometries

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