Amkor Portfolio

MEMS and Sensor Packaging
Leading the Industry in
Advanced MEMS Devices
The roadmaps for smart cars,
homes and consumer mobile/
tablet products require advanced
MEMS and sensors – Amkor
Technology is answering that call
with sensor fusion technology.
Enabling a Smarter World
Next Generation Packages for Sensor Fusion
MLF®
/QFN
ChipArray®
BGA
Cavity Package
Hybrid Cavity
Package
CONNECTING
amkor.com

Advanced SiP
Packed with performance
We pack more functionality into
a smaller space while increasing
system performance and lowering
system power consumption of
today’s mobile devices.
SiP Technology
Combining different package form factors
and interconnect technologies
■ Wirebond CSP
■ Flip Chip CSP
■ PBGA & FCBGA
■ Leadframe
■ Bumps, copper pillars, F2F
■ Cavity packages
■ Molded and unmolded packages
■ IPD, conformal shielding,
embedded technology
CONNECTING
amkor.com

Amkor Confidential 1
8,000,000+
Sq.Ft.ManufacturingSpace
16Sales & Customer
Support Centers
Assembly &
Test Facilities
22
Amkor Technology by the Numbers
2,464
Number Of Patents
Number of
Employees
26,700+ $3.70B
NET
SALES
$3.70B
SALES
Founded
1968
Founded
1968
48
26,700+
3,000+
Package Portfolio 10
Countries
FootprintIn
Assembly
Top Turnkey Services
3 Test Design

(Amkor + J-Devices)

Strategically L ocated Asia F actories
and Customer Support Centers
w w w .amkor.com
Asia
J apan
SALES OFFICE
Shanghai, C hina
B eij ing, C hina
Shenz hen, C hina
Tokyo, J apan
Seoul, K orea
Singapore
Z hubei C ity, Taiwan
ASSEMBLY AND TEST
Shanghai, C hina
I ncheon, K orea
G wangj u, K orea
Seoul, K orea
Selangor, Malaysia
B inan L aguna, P hilippines
Muntinlupa C ity, P hilippines
H ukou Township, Taiwan
L ungtan Township, Taiwan
J-DEVICES LOCATIONS
F ukui, J apan
F ukuoka, J apan
H akodate, J apan
K itsuki, J apan
K umamoto, J apan
Miyagi, J apan
U suki, J apan

Amkor Technology, Inc.
Audit Committee Conference Call
Q3 2015 10-Q
Date: Date
Time: 1:30pm Eastern
10:30am Arizona
Dial In Number: Numbers
Passcode: Numbers

POWER PRODUCTS
D ata Sheet
Q uestions? Contact us: marketing@ amkor.com
Visit Amkor Technology online for locations and
to view the most current product information.
D S612B
R ev D ate: 2/16
TSON8-FL
Process Highlights
• B are copper leadframe with no plating
• D ie attach: 5 5 um thin die pick up capability
• I nterconnect: C u clips technology for better electrical and thermal
performance. Also available on Al strap + wire option.
• P lating: 1 0 0 % matte Sn
• Marking: P en type laser
Standard Materials
• L eadframe: B are copper
• D ie attach: Solder paste*
• I nterconnect: 3 options,
– D ual C u clips
– Al strap + C u wire
– Multiple C u wires
• Mold compound: H alogen free
* Apply to option dual C u clips.
Reliability Qualification
Amkor devices are assembled with proven reliable semiconductor materials.
• All test include pre- condition of: Ta = 8 5 °
Ta = 2 6 5 °C , 2 X
• H igh Temperature Storage, Ta = 1 5 0 °C , 1 0 0 0 hrs
• P ressure C ooker, Ta = 1 2 1 °C /R h = 1 0 0 %/ P = 2 atm, 9 6 hrs
• Temperature C ycle, - 6 5 ~1 5 0 °C , 3 0 0 cycles
Test Service
Amkor offers full turnkey business for all power discrete products. W e have
the capability to test various type of power devices including MO SF ETs,
bipolar transistors, I G B Ts, diodes, regulator I C s/intelligent power devices, etc.
• Amkor power discrete test capability:
– Static test ( D C )
– D ynamic test ( AC , Switching/Trr, C apacitance/R g)
– D estruction test ( I nductive load/V SU S, I L atch, Surge, I solation/V I L )
–
• P rogram generation/conversion
• F ailure analysis
• Available test/handling technology
• I ntegrated marking, vision inspection and tape & reel services
Introduction
TSO N 8 - F L ( F lat L ead) is a smaller package ( 3 .3 x 3 .3 mm)
with thermally enhanced that gives a 6 4 % reduction in
footprint area compared with standard SO I C 8 ld package,
yet an eq uivalent max imum permissible power dissipation
capability.
This package may also be know as:
• TSO N - Adv
• P owerF L AT™ 3 .3 x 3 .3
• TSD SO N
• miniH V SO N
• P owerP AK ® 1 2 1 2 - 8
• J ED EC : MO 2 4 0 B A
Application
TSO N 8 - F L is suitable for medium- power applications,
designed for low on- resistance and high- speed- switching
MO SF ETs:
• B attery protection circuits
• N otebook P C s
• P ortable electronic devices
• D C - D C converters
F eatures
• Small and thermally enhanced package with the same
power dissipation but 6 4 % less footprint area than
SO I C 8 ld
• D ual C u C lip interconnect for better heat dissipation
• Al strap + wire option is also available
• Turnkey with test and packing services
• G reen materials: P b- free plating & halogen free mold
compound
New D evelopments
• D ual ex posed pad for better thermal performance
• Thin wafer dicing with narrow saw streets
• L arger/higher density leadframe strips
• Environmentally friendly P b- free solder paste

POWER PRODUCTS
D ata Sheet
With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. Amkor shall not
be responsible for any loss or damage of whatev er nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify Amkor’ s
warranty on any product beyond that set forth in its standard terms and conditions of sale. Amkor reserv es the right to make changes in its product and specifications at any time and without notice. The Amkor name
and logo are registered trademarks of Amkor Technology, Inc. All other trademarks mentioned are property of their respectiv e companies. © 2016, Amkor Technology Incorporated. All R ights R eserv ed.
D S612B
R ev D ate: 2/16
Shipping
• Tape and reel packing
– 3 0 0 0 pcs or 5 0 0 0 pcs per reel
– Tape width 1 2 mm
–
• B arcode packing label
• D rop ship
TSON8-FL
Package Outline D raw ing TSON8 - F L
Cross- section – Option 1 : D ual Cu Clip
Cross- section – Option 2 : Al Strap + W ire
Cross- section – Option 3 : Multiple Cu W ires

Electrical Characteriz ation
ServiceSolutions
SS03 H
R ev D ate: 11/15
Electrical Co- D esign and Modeling
Amkor’ s electrical team members are ex perienced in the latest
simulation tools and packaging technology. This allows our world class
electrical team to reduce design cycle times and provide ex pert advice
and services to customers.
Amkor plays a leading role in supporting customers in the
development of nex t generation packages and electronic technology
for ex isting and emerging products. O ur unparalleled level of electrical
design ex pertise provides the following “ best in class” electrical
services:
• H ighly trained and ex perienced staff members
• H igh q uality, reliable and accurate designs
• D esign for P erformance ( D F P ) , D esign for C ost ( D F C ) and D esign
for Manufacturing ( D F M)
• Ex cellent customer design collaboration to meet electrical, thermal
and mechanical req uirements
Going B eyond the B asics
W ith rapidly increasing data transfer rates, the need to optimiz e
package layout and electrical performance is ever more crucial.
D elivering an optimum package design req uires more than j ust a
robust layout and post- layout electrical simulation; it req uires close
interaction with customers and substantial engineering support during
the entire layout phase. Amkor’ s electrical engineering team works
closely with customers and package designers to make sure the
package layout meets the req uired signal integrity ( SI ) and power
integrity ( P I ) performance specifications. O ur electrical analysis tools
are tightly integrated with package layout tools and the assistance of
our design automation team. As a result, electrical constraints can be
passed to the design team during the design process, thus minimiz ing
electrical design rule violations. This allows for q uicker design
turnaround times while delivering a reliable and cost effective solution.
C omprehensive design optimiz ation is possible by using electrical,
thermal and mechanical characteriz ation. W ith Amkor’ s co- design
methodology, signal and power integrity issues can be predicted in a
timely manner and fix ed well before ex pensive prototypes are built.
Amkor’ s ex perts can also help identify and optimiz e cost- effective
thermal and mechanical solutions that satisfy our customers’ operating
conditions and reliability ex pectations.
D esign MechanicalElectrical Thermal
mechanical solutions that satisfy our customers’ operating conditions and reliability
expectations.
Signal and Pow er Integrity
With ev ery shrinking silicon node, faster I/O buffers and decreasing operating margins,
signal and power integrity is a critical element of package design. V oltage fluctuations in
the power distribution network due to IR drop, Ldi/dt noise, or LC resonance seriously
impact package performance. At Amkor, we hav e highly integrated signal and power
integrity analysis capabilities. Packages are characteriz ed with multiple simulations by
exercising v arious buss/signal channels with their respectiv e driv er/receiv er and
expectations.
expectations.
expectations.

Electrical Characteriz ation
Service
Solutions
With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. Amkor shall not
be responsible for any loss or damage of whatev er nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify Amkor’ s
warranty on any product beyond that set forth in its standard terms and conditions of sale. Amkor reserv es the right to make changes in its product and specifications at any time and without notice. The Amkor name
and logo are registered trademarks of Amkor Technology, Inc. All other trademarks mentioned are property of their respectiv e companies. © 2015 , Amkor Technology Incorporated. All R ights R eserv ed.
Simultaneous Switching Noise
3
2
1
0
0 2
4
Voltage(V)
4 6 8Time (ns)
Power Bounce
Switching Signal
Ground Bounce
I/O Supply
SS03 H
R ev D ate: 11/15
W ith every shrinking silicon node, faster I /O buffers and decreasing
operating margins, signal and power integrity is a critical element of
package design. V oltage fluctuations in the power distribution network
due to I R drop, L di/dt noise or L C resonance seriously impact package
performance. At Amkor, we have highly integrated signal and power
integrity analysis capabilities. P ackages are characteriz ed with
multiple simulations by ex ercising various bus/signal channels with
their respective driver/receiver and associated power/ground domains.
Amkor uses highly accurate, industry- standard 2 D , 3 D , q uasi- static
and full- wave field solvers.
Package L ayout, Electrical Modeling
and Simulation Tools
• C adence AP D and SiP
• C adence/Sigrity U P D
• Mentor x P edition
• AutoC AD
• Ansys Q 3 D
• Ansys H F SS
• Ansys SI wave
• Ansys D esigner
• Ansys Sentinel- N P E
• K eysight AD S
• K eysight Momentum
• C adence/Sigrity Tool Suite - P owerSI , B B Spice, Speed2 0 0 0 ,
P owerD C , X tractI M, 3 D - EM, T2 B , System SI
• Synopsys H SP I C E
Eye Diagram

System in Package ( SiP)
TechnologySolutions
Questions? Contact us: marketing@amkor.com
Semiconductor industry demands for
higher levels of integration and lower
costs coupled with a growing
awareness of complete system
configuration have continued to drive
the popularity of System in P ackage
( SiP ) solutions. Amkor' s SiP
technology is an ideal solution in
markets that demand smaller siz e with
increased functionality. B y assembling, testing and shipping more than
one million SiP devices per day, Amkor Technology has a proven track
record as the industry leader in SiP design, assembly and test.
C ontact us today and let us add you to our growing list of customers
who have been successful with System in P ackage technology.
What is System in Package?
System- in- P ackage technology is more than j ust an I C package
containing multiple die. A SiP is characteriz ed by any combination of
one or more I C s of different functionality, which may include passive
components and/or MEMS assembled into a single package that
performs as a system or sub- system. U sing wirebonding or flip chip
technology or a combination of both for the I C s, the SiP can contain
components that are traditionally found on a P C board.
Amkor' s emphasis is on functional integration and siz e reduction by
using different package form factors and interconnect technologies,
including:
TS101N
Rev Date: 11/15
• SiP Solutions ( side by side, P O SSU M™ , stacked die, package on
package ( P oP ) , package in package ( P iP ) , cavity, face- to- face ( F 2 F )
and others)
• Surface mount discrete passive ( any common format including
0 1 0 0 5 siz e)
• I ntegrated passive devices ( I P D ) , either glass or silicon ( Si) type
• P assives embedded inside or patterned on the substrate
• D ie embedded in the package substrate
• Surface acoustic wave ( SAW ) /bulk acoustic wave ( B AW ) filters,
crystals, oscillators, antennas
• Sputtering conformal shielding and compartmental conformal
shielding
• C ore and coreless substrate
• R ecessed and cavity substrate
• D oubled side mold
• D ouble- sided assembly ( P O SSU M™ )
• Strip grinding fine pitch ultra- thin package
• D ifferent I C s integrations ( Silicon, G aAs, SiG e)
• P re- packaged I C s
• C onnectors
• Mechanical parts
The power of SiP technology is the ability to bring together many I C
and package assembly and test techniq ues to create highly integrated
products with optimiz ed cost, siz e and performance.
SiP Module Design Options

Technology
Solutions
TS101N
Rev Date: 11/15
Total System in Package Solutions
I n a SiP approach, one must consider not only the traditional elements
of package assembly, but also design aspects relative to the overall
system functional req uirements and manufacturing process, as well as
supply chain management and test.
System design becomes paramount to the overall success of
developing an effective SiP product. Early in the overall system
design, the customer and Amkor discuss and agree upon all elements
of the system req uirements to ensure design success. W ith this in
mind, Amkor has significantly ex panded its design capability to
combine traditional layout ex pertise with digital and R F circuit design
and system modeling. Amkor can also translate a customer' s
reference designs for use in SiP development. W orking closely with
the customer, Amkor can model circuits electrically, mechanically and
thermally, which reduces design iterations and minimiz es time- to-
market.
Manufacturing Excellence
Amkor’ s “ C enter of Ex cellence” for substrate- based SiP technology is
located in our largest volume manufacturing facility in K 4 K wangj u,
South K orea. The large- scale manufacturing capabilities in this factory
can achieve significant volume production support with very short
cycle times. The manufacturing eq uipment is the latest advanced
technology that supports high speed, high accuracy chip and
component placement. Amkor’ s SiP design rules are the most
advanced in the industry and are available to customers through a
web portal access system. Amkor production lines have full
automation, in- line inspection, R F I D control and other process control
methods to ensure the highest yields and q uality while minimiz ing any
potential loss of bill of material ( B O M) components.
Amkor SiP factories are eq uipped with the latest generation surface
mount eq uipment to provide these attributes:
1 . U ltra- high- speed SMT placement machines which have leading-
edge component placement accuracy – best q uality and lowest
cost.
2 . F lex ible placement machines which are better suited for odd- form
component placement.
3 . C apable of placing any common component format available in
tape and reel format down to and including the smallest 0 1 0 0 5
siz e.
4 . C apable of mounting bumped die directly from wafer tape.
5 . Support for solder paste stencil printing, flux stencil printing, flux
j etting or flux dipping processes.
6 . Automated 1 0 0 % in- line optical inspection of solder paste to
reduce B O M component loss.
7 . Support for all common R oH S/G reen compliant solder alloys.
After modeling, Amkor supports Engineering B uild R eq uests ( EB R s)
on dedicated rapid- turn “ N ew P roduct I ntroduction” lines. These lines
are ex actly the same as the high volume manufacturing lines so
transfer to production is seamless and efficient. I n the R F market
sector, Amkor often needs to support a large number of rapid- turn
EB R s to facilitate R F tuning of the parts. F ast turn is critical to product
success and time- to- market, our ex perts work closely with our
customer’ s to facilitate this collaborative process.
Supply chain considerations play a maj or factor in the success of SiP
product realiz ation and impact both design and manufacturing. Amkor
has ex panded its traditional supply chain ex pertise into passive
components, and other parts not traditionally found in the package
assembly environment. Amkor can manage the supply chain to ensure
successful SiP development and production.
SiP Module Design Flow

Technology
Solutions
Thermal & Mechanical Solutions for SiP
I nevitably, higher levels of integration result in thermal challenges. As
part of our co- design service, we capture not only electrical but also
thermal constraints early on so that the package solution will meet all
customer performance criteria. Amkor has a menu of thermal
enhancement options to ensure that your die runs cool, including:
1 . Thermal vias
2 . Stacked C u- filled via structures
3 . D irect- to- metal die attach pad structures
4 . Enhanced thermal die attach compounds
5 . Enhanced thermal mold compounds
6 . D etailed mechanical test and simulations for mechanical SiP
integrity such as warpage improvement, solder j oint reliability, die
strength and stress, flip chip bump fatigue, substrate trace
cracking, temperature cycling, bend cycle, drop shock test, die
strength, electromigration.
As part of the co- design service, Amkor helps identify the optimum
and most cost- competitive thermal and mechanical enhancements
req uired by a device to satisfy the end customer’ s operating conditions
and field life ex pectations.
Markets for System in Package
Ex isting market uses for SiP include:
• R F and wireless devices
– P ower amplifiers, front end module, antenna switch, G P S/G N SS
modules, cellular handset and cellular infrastructure, B luetooth®
solutions
• Solid- state drives ( SSD s)
– Storage for tablets, net books and computing applications where
typical SSD s include controller ASI C , N AN D , D D R , logic and
power circuits
• Automotive applications
– U nder- hood electronic control unit ( EC U ) , sensory modules and
infotainment
• I oT for wearable and machine to machine ( M2 M) products
– C onnectivity, MEMS, sensors, microcontroller, power
management and other mix ed- signal devices
• P ower modules
– D C /D C converter, L D O , P MI C , battery management and others
System in P ackage technology allows multiple advanced packaging
technologies to be combined to create solutions customiz ed to each
end application.
Amkor is heavily involved in providing SiP solutions for R F , digital and
mix ed- signal applications. W e have R F and high- speed digital design
engineers on staff to assist customers in designing SiP s for their
applications. Amkor is able to meet all design, material and
manufacturing req uirements for R F and high- speed digital SiP s.
Sputtering Conformal Shielding Solution
Amkor developed an ex cellent sputtering shielding technology to solve
electromagnetic radiation effects among electronic components within
SiP components and surrounding environment. C onformal shielding is
used to replace bulky metal shielding. I t has z ero impact on package
siz e and weight, with ex cellent electrical and magnetic shielding
performance.
TS101N
Rev Date: 11/15
Unshielded SiP
SiP with Sputtering Conformal Shielding
Near Field Conformal Shielding Performance Measurements
From 100 MHz to 6 GHz

W i th r es p ec t to th e i n f o r m ati o n i n th i s d o c u m en t, A m k o r m ak es n o g u ar an tee o r w ar r an ty o f i ts ac c u r ac y o r th at th e u s e o f s u c h i n f o r m ati o n w i l l n o t i n f r i n g e u p o n th e i n tel l ec tu al r i g h ts o f th i r d p ar ti es . A m k o r s h al l n o t
b e r es p o n s i b l e f o r an y l o s s o r d am ag e o f w h atever n atu r e r es u l ti n g f r o m th e u s e o f , o r r el i an c e u p o n i t an d n o p aten t o r o th er l i c en s e i s i m p l i ed h er eb y . Th i s d o c u m en t d o es n o t i n an y w ay ex ten d o r m o d i f y A m k o r ’ s
w ar r an ty o n an y p r o d u c t b ey o n d th at s et f o r th i n i ts s tan d ar d ter m s an d c o n d i ti o n s o f s al e. A m k o r r es er ves th e r i g h t to m ak e c h an g es i n i ts p r o d u c t an d s p ec i f i c ati o n s at an y ti m e an d w i th o u t n o ti c e. Th e A m k o r n am e
an d l o g o ar e r eg i s ter ed tr ad em ar k s o f A m k o r Tec h n o l o g y , I n c . A l l o th er tr ad em ar k s m en ti o n ed ar e p r o p er ty o f th ei r r es p ec ti ve c o m p an i es . © 2 015, A m k o r Tec h n o l o g y I n c o r p o r ated . A l l Ri g h ts Res er ved .
TechnologySolutions
TS101N
Rev Date: 11/15
SiP Testing
Amkor has developed ex pertise in R F and digital testing including test
system software/hardware development and manufacturing test. O ur
internally- developed, world- class test platform typically offers a 5 0 % to
8 0 % reduction in test time for common R F parts – P As, L N As and
combinations in integrated front ends ( I F Es) .
System in Package Benefits
Similar to a system on chip ( SoC ) approach, Amkor' s SiP technology
is an ideal solution in markets that demand smaller siz e with increased
functionality. H owever, SiP has the added benefit of compatibility with
die design changes and integration of various die technologies ( e.g.,
Si, G aAs, SiG e, SO I , MEMS) without the high cost and lead time
associated with SoC development and manufacturing.
Additional Benefits of System in Package Approach
• Smaller siz e solution than individually- packaged I C s
• H igher performance through shorter interconnect paths, better
dimensional tolerances and local shielding
• L ower overall cost of ownership
– Eliminate packaging ( multiple I C s now in one package)
– R educed system board space and complex ity and layer count by
moving to a SiP solution
– R educed overhead for the customer ( Amkor offers turnkey
solutions for assembly, test, supply chain management and
value- added services)
– K nown good modules
• R educed time- to- market
– Modules and main system assembly can be developed
concurrently
– C hanges can be made to the SiP without costly changes to the
system board
– D esign flex ibility and easy redesign versus complex SoC design
– SiP allows plug- and- play insertion into one or multiple systems
• W ith proper consideration to design, Amkor’ s SiP packages are able
to meet J ED EC L 3 /2 6 0 moisture resistance and are passing
Amkor’ s internal SQ L b.
System in P ackage is the modular design approach offering
unprecedented flex ibility in product development. The end user
benefits from a faster time- to- market, reduced cycle times for system
design, lower development risk compared to SoC I C development,
flex ibility, tuned functional performance, and, in the end, a lower
overall cost of ownership.
Site K4 Gwangju
Total L and: 1 ,4 9 0 K ft2
Mfg F loor: 1 ,1 1 9 K ft2

B E C S D D CC S D S C D
B E C S D D CC S D S C D
• Amkor supports optional test wafer and package socketing at strategic, interim assembly phases
Incoming Wafers
Active Dies
On Wafer
Front & Backside
Processing
Test Partially Assembled
Units (Various Formats)
Wafer Sort Know
Good Die (Optional)
Backside Wafer Probe
Good Interposer
(Optional)
Assemble Known
Good Die & Interposer
Interposer
Final Test
(Singulated)
Finished
Goods
System Level Test
Fully Assembled
Unit
QA – “x%”
Samples
Known
GoodParts
WSS Carrier
Probe Card
Wafer Probe During MEOL
MemoryProcesssor
MixedSignal
RFBaseband
KGD
?
Probe
at
Amkor
Yes
No
To
Assembly
Wafer and Package Test at Assembly
Assy. 1
Proc
1
Test
Assy. 2
Mem
2
Test
Assy. 3
BB
3
Test
Assy. 4
MS
4
Test
Assy. 5
RF
8
System
Test
Amkor TSV Test Platform
• Amkor supports optional test wafer and package socketing at strategic, interim assembly phases
Incoming Wafers
Active Dies
On Wafer
Front & Backside
Processing
Test Partially Assembled
Units (Various Formats)
Wafer Sort Know
Good Die (Optional)
Backside Wafer Probe
Good Interposer
(Optional)
Assemble Known
Good Die & Interposer
Interposer
Final Test
(Singulated)
Finished
Goods
System Level Test
Fully Assembled
Unit
QA – “x%”
Samples
Known
GoodParts
WSS Carrier
Probe Card
Wafer Probe During MEOL
MemoryProcesssor
MixedSignal
RFBaseband
KGD
?
Probe
at
Amkor
Yes
No
To
Assembly
Assy. 1
Proc
1
Test
Assy. 2
Mem
2
Test
Assy. 3
BB
3
Test
Assy. 4
MS
4
Test
Assy. 5
RF
8
System
Test

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