1. © John Glenning 2015© John Glenning 2015
Fluid Head TechnologyFluid Head Technology
John Glenning & Jim VeasawJohn Glenning & Jim Veasaw
Technology DevelopmentTechnology Development
Developed 1987Developed 1987

2. © John Glenning 2015© John Glenning 2015
Fluid Head Rinsing Technology wasFluid Head Rinsing Technology was
Developed at IBM by Jim Veasaw andDeveloped at IBM by Jim Veasaw and
John GlenningJohn Glenning
US Patent 5063951: Fluid treatmentUS Patent 5063951: Fluid treatment
Device May 1990Device May 1990
Idea Developed March 1987Idea Developed March 1987
Fluid Head Technology Development

3. © John Glenning 2015© John Glenning 2015
Electronic circuit production employs:
1. Coating a photoresist on the metal
surface
2. Exposing the photoresist with light of the
proper wavelength for the correct time
3. Developing the image
4. Etching the metal pattern
5. Stripping the photoresist
Fluid Head Technology Development

4. © John Glenning 2015© John Glenning 2015
Electronic Circuit Production:
1. The traditional process produced waste
and scrap caused by "drag-out" of
chemicals from one tank to the next
2. Large volumes of evaporative waste were
also produced from the open tank design
used for, etching, rinsing and drying the
circuit components.
Fluid Head Technology Development

5. © John Glenning 2015© John Glenning 2015
Electronic Circuit Production:
3. This more efficient and less polluting
process supplanted the older
technology for many of IBM's
circuited products.
Fluid Head Technology Development

6. © John Glenning 2015© John Glenning 2015
Environmental Benefits
1. Completely enclosed process
2. Smaller chemical tanks
3. Less rinse water usage
4. Reduced levels of drag-out
5. Reduced rinse water requirements
6. Reduced evaporative losses.
Fluid Head Technology Development

7. © John Glenning 2015© John Glenning 2015
Environmental Benefits
7. Rinse waters reduced by 75 percent
or 30,000 tons per year
8. Use of "fluid head" consumes only
one-half gallon per minute versus the
3 to 5 gallon per minute consumption
Fluid Head Technology Development

8. © John Glenning 2015© John Glenning 2015
Benefits
9. Plating bath efficiency improved by
20 percent, primarily as a result of
eliminating vertical racks and
associate rack stripping steps. The
result is less drag out and reduced
plating on fixtures.
Fluid Head Technology Development

9. © John Glenning 2015© John Glenning 2015
Environmental Benefits
10. Efficiency is gained across each
chemical process including cleaners
microetch, sulfuric acid predip,
activator baths, reducer bath,
electroless copper bath, acid dip,
and acid copper baths.
Fluid Head Technology Development

10. © John Glenning 2015© John Glenning 2015
Environmental Benefits
10. The total waste reduction was
estimated to be 60 tons per year.
11. Plating bath efficiency improved by
20 percent
Fluid Head Technology Development

11. © John Glenning 2015© John Glenning 2015
Environmental Benefits
12. Reuse of spent micro etch bath for
maintenance reduced waste by 55
tons per year.
13. The spent persulfate solution from
the microetch station is saved for
reuse
Fluid Head Technology Development

12. © John Glenning 2015© John Glenning 2015
Environmental Benefits
14. Toxicity reductions achieved by
converting a hazardous/corrosive
activator bath to a neutral activator
chemistry by electrifying a plating
allowing use of lower concentrations
of chemicals
Fluid Head Technology Development

13. © John Glenning 2015© John Glenning 2015
Environmental Benefits
15. Energy savings of more than
500,000
kilowatt hours were realized as a
result of conveyer efficiency
compared to the old hoist system and
reduced process ventilation for the
enclosed process design
Fluid Head Technology Development

14. © John Glenning 2015© John Glenning 2015
Environmental Benefits
16. Overall process efficiency was
improved by using chemical totes
instead of 55-gallon drums, realizing
a savings of more than $20,000
annually
Fluid Head Technology Development

15. © John Glenning 2015© John Glenning 2015
Summary
1. As Electronic circuitry density
increases, DI Water Rinsing needs to
increase by 2 orders of magnitude to
meet product reliability requirements.
Fluid Head Technology Development

16. © John Glenning 2015© John Glenning 2015
Summary
2. Developed DI water rinsing head
(fluid head) which improved rinsing
quality by one order of magnitude and
reduced DI water consumption by two
orders of magnitude resulting in a US
Patent.
Fluid Head Technology Development

17. © John Glenning 2015© John Glenning 2015
Summary
3. This was a brain-storm by myself, Jim
Veasaw and an operator. We
changed the rinsing from spraying to
cross-product.
4. This significantly improved rinsing
and product reliability.
Fluid Head Technology Development

18. © John Glenning 2015© John Glenning 2015
Summary
5. This resulted in a US Patent (US
Patent 5063951)
Fluid Head Technology Development

19. © John Glenning 2015© John Glenning 2015
Fluid Technology Development
http://www.dec.ny.gov/public/21702.html

20. © John Glenning 2008© John Glenning 2008
Process Development-ManufacturingProcess Development-Manufacturing
StrategyStrategy
End of Presentation