From 200 to 300 MM Fabs
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Sub Fab design issues when going from 200 MM to 300 MM fab plant design.
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From 200 to 300 MM Fabs
- 1. Moving from 200mm to 300mm Microelectronics
- 3. Moore’s Law “ The amount of information storable on a given amount of silicon doubles every year.” Moore’s Law by Gordon Moore, 1964, founded Intel Technology since 1970 # of transistors per chip memory size Geometric features Technology since 1970 # of transistors per chip memory size Geometric features The Need for Speed increased exponentially decreased 1/2 every 18 months
- 9. In a clean environment People = Particles
- 10. AUTOMATED WAFER HANDLING Front Opening Unified Pod (FOUP)
- 12. INTRABAY WAFER TRANSPORTATION MAIN AISLE AGV PGV RGV
- 13. INTERBAY WAFER TRANSPORTATION MAIN AISLE OHT
- 14. AMHS Height Considerations CLEANROOM Stocker OHT AGV/ RGV/ PGV Interbay Transport Zone Overhead Intrabay Zone Process Tool Ceiling Raised Floor 6.83M 3.5M 3.5M <1.8M 0.9M 3.7M Stocker Tool Move-in ( 2.2m X 2.8m ) Operator I/O Operator I/O Optional Local Tool Buffer Optional Intrabay I/O FFU Truss 7.5M min 7.25M Waffle Slab
- 15. SubFab With the introduction of larger wafers, comes the problem of re-tooling . Larger and more sophisticated tools are required. More support equipment is needed. Larger tool and support equipment footprints that need more space . Does this mean; Bigger Fabs and sub-fabs? Impact: Tool Footprint
- 16. Space Management WAFFLE SLAB RAISED ACCESS FLOORING SINGLE SUB-FAB Impact: Utilities
- 17. Space Management DOUBLE SUB-FAB WAFFLE SLAB RAISED ACCESS FLOORING
- 18. SPACE MANAGEMENT BUILDING SECTION