©2014IBM Corporation
zEnterprise EC12 & BC12 Hardware
Overview
Nome: Felipe Lanzillotta Grandolpho
Email: felipeg@br.ibm.c...
©2014IBM Corporation
Trademarks
The following are trademarks of the International Business Machines Corporation in the Uni...
©2014IBM Corporation
“The postings on this site / presentation are my own
and don’t necessarily represent IBM’s positions,...
©2014IBM Corporation
Agenda:
– Sistemas Operacionais e Processadores;
– System z Gerações;
– zEC12 Hardware;
– zBC12 Hard...
©2014IBM Corporation
Sistemas Operacionais
Tipos de Processadores
ICF
©2014IBM Corporation
IBM System z - Gerações
©2014IBM Corporation
N-4N-4
z990
•Anunciado em 5/2003
•1.2 GHz
•32 Cores caracterizáveis
•CP, IFL, ICF, zAAP
•Memória de 2...
©2014IBM Corporation
zEnterprise EC12
• zEC12 - Lançada em 28 de Agosto de 2012
– RAIM como design de memória
– Memória mí...
©2014IBM Corporation
For IBM and Business Partner Education Use Only prior to Announcement
Baterias
Internas
(opcional)
Fo...
©2014IBM Corporation
For IBM and Business Partner Education Use Only prior to Announcement
Baterias
Internas
(opcionais)
F...
©2014IBM Corporation
zEnterprise EC12 - Modelos
Memória
Memóri
a
MC
M
Frente
Conector de
resfriamento
3 x Fontes de
energi...
©2014IBM Corporation
zEnterprise EC12 – MCM (Multi Chip Module)
PU 0PU 2
SC
0
SC
1
PU 1
PU 5PU 3 PU 4
Cada PU chip possui ...
©2014IBM Corporation
zEnterprise BC12
 zBC12 - Lançada em 23 de Julho de 2013
– 13 Cores rodando a 4.2 GHz
– Até 512 GB p...
© 2014 IBM CorporationzBC12TLLB14
Bateria
interna
(opcionais)
Fontes
de
Energia
I/O Drawer
2 x CPC Drawers,
Memória & HCAs...
©2014IBM Corporation
zEnterprise BC12 - Modelos
Processor SCM
Processor
SCM
Storage Control
SCM
Slots for 5 DIMMs
Slots fo...
©2014IBM Corporation
zEnterprise BC12 – SCM (Single Chip Module)
 Cache
– Cache L1 e L2 compartilhado por core
– Cache L3...
© 2014 IBM CorporationzBC12TLLB17
 MCM
– MCM : 96mm x 96mm
– 6 PU chips por MCM
• 6 core chips com 4, 5 ou 6 cores ativos...
© 2014 IBM CorporationzBC12TLLB18
Uma HMC pode se comunicar com
todos as outras HMCs
– Controle de qualquer servidor em
q...
©2014IBM Corporation
Estrutura de I/O – PCIe I/O Drawer
Vista
Frontal
Vista
Traseira
©2014IBM Corporation
I/O features
Flash Express FICON Express8SCrypto Express 4S
 10km LX Feature
– 10km
– One slot in th...
©2014IBM Corporation
I/O features
IBM zEDC Express 10 GbE RoCE OSA- Express 5S
– Prover acelereção para
compressão e decom...
© 2013 IBM Corporation22
Desafio
Para suportar a crescente demanda, a Algar Telecom
precisava de uma infraestrutura forte ...
©2014IBM Corporation
Siglas
CP – Central Processor zEDC - zEnterprise Data Compression
zAAP - System z Application Assist ...
©2014IBM Corporation
Referências Bibliográficas
 IBM zEnterprise BC12 Technical Guide (
http://www.redbooks.ibm.com/abstr...
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zEC12 e zBC12 Hardware Overview

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  • IFL (Integrated Facility for Linux) – Linux /// zIIP (z System Integrated Informaton Processor) – DB2 //// zAAP (z System Application Assist Processor) – Java //// CP (Central Processor) – z/OS ////// SAP (System Assistance Processor) – Runs the microcode ///// ICF ( Integrated Coupling Facility) – Enable IBM Mainframes to share data across systems //// Spare – Is used when another processor fails. zAAP on zIIP
  • zEC12 e zBC12 Hardware Overview

    1. 1. ©2014IBM Corporation zEnterprise EC12 & BC12 Hardware Overview Nome: Felipe Lanzillotta Grandolpho Email: felipeg@br.ibm.com IBM Brasil – System and Technology Group (STG) Trainee System zEnterprise
    2. 2. ©2014IBM Corporation Trademarks The following are trademarks of the International Business Machines Corporation in the United States and/or other countries. Notes: Performance is in Internal Throughput Rate (ITR) ratio based on measurements and projections using standard IBM benchmarks in a controlled environment. The actual throughput that any user will experience will vary depending upon considerations such as the amount of multiprogramming in the user's job stream, the I/O configuration, the storage configuration, and the workload processed. Therefore, no assurance can be given that an individual user will achieve throughput improvements equivalent to the performance ratios stated here. IBM hardware products are manufactured from new parts, or new and serviceable used parts. Regardless, our warranty terms apply. All customer examples cited or described in this presentation are presented as illustrations of the manner in which some customers have used IBM products and the results they may have achieved. Actual environmental costs and performance characteristics will vary depending on individual customer configurations and conditions. This publication was produced in the United States. IBM may not offer the products, services or features discussed in this document in other countries, and the information may be subject to change without notice. Consult your local IBM business contact for information on the product or services available in your area. All statements regarding IBM's future direction and intent are subject to change or withdrawal without notice, and represent goals and objectives only. Information about non-IBM products is obtained from the manufacturers of those products or their published announcements. IBM has not tested those products and cannot confirm the performance, compatibility, or any other claims related to non-IBM products. Questions on the capabilities of non-IBM products should be addressed to the suppliers of those products. Prices subject to change without notice. Contact your IBM representative or Business Partner for the most current pricing in your geography. This information provides only general descriptions of the types and portions of workloads that are eligible for execution on Specialty Engines (e.g., zIIPs, zAAPs, and IFLs) ("SEs"). IBM authorizes customers to use IBM SE only to execute the processing of Eligible Workloads of specific Programs expressly authorized by IBM as specified in the “Authorized Use Table for IBM Machines” provided at www.ibm.com/systems/support/machine_warranties/machine_code/aut.html (“AUT”). No other workload processing is authorized for execution on an SE. IBM offers SE at a lower price than General Processors/Central Processors because customers are authorized to use SEs only to process certain types and/or amounts of workloads as specified by IBM in the AUT. The following are trademarks or registered trademarks of other companies. * Other product and service names might be trademarks of IBM or other companies. * Registered trademarks of IBM Corporation Adobe, the Adobe logo, PostScript, and the PostScript logo are either registered trademarks or trademarks of Adobe Systems Incorporated in the United States, and/or other countries. Cell Broadband Engine is a trademark of Sony Computer Entertainment, Inc. in the United States, other countries, or both and is used under license therefrom. Intel, Intel logo, Intel Inside, Intel Inside logo, Intel Centrino, Intel Centrino logo, Celeron, Intel Xeon, Intel SpeedStep, Itanium, and Pentium are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. IT Infrastructure Library is a registered trademark of the Central Computer and Telecommunications Agency which is now part of the Office of Government Commerce. ITIL is a registered trademark, and a registered community trademark of the Office of Government Commerce, and is registered in the U.S. Patent and Trademark Office. Java and all Java based trademarks and logos are trademarks or registered trademarks of Oracle and/or its affiliates. Linear Tape-Open, LTO, the LTO Logo, Ultrium, and the Ultrium logo are trademarks of HP, IBM Corp. and Quantum in the U.S. and Linux is a registered trademark of Linus Torvalds in the United States, other countries, or both. Microsoft, Windows, Windows NT, and the Windows logo are trademarks of Microsoft Corporation in the United States, other countries, or both. OpenStack is a trademark of OpenStack LLC. The OpenStack trademark policy is available on the OpenStack website. TEALEAF is a registered trademark of Tealeaf, an IBM Company. Windows Server and the Windows logo are trademarks of the Microsoft group of countries. Worklight is a trademark or registered trademark of Worklight, an IBM Company. UNIX is a registered trademark of The Open Group in the United States and other countries. DirMaint ECKD HiperSockets IBM* IBM (logo)* OMEGAMON* Performance Toolkit for VM RACF* REXX System z* zEnterprise* z/VM*
    3. 3. ©2014IBM Corporation “The postings on this site / presentation are my own and don’t necessarily represent IBM’s positions, strategies or opinions.”
    4. 4. ©2014IBM Corporation Agenda: – Sistemas Operacionais e Processadores; – System z Gerações; – zEC12 Hardware; – zBC12 Hardware; – Chips zEC12 x zBC12; – Gerenciamento de Hardware; – Features de I/O; – Referência de Cliente;
    5. 5. ©2014IBM Corporation Sistemas Operacionais Tipos de Processadores ICF
    6. 6. ©2014IBM Corporation IBM System z - Gerações
    7. 7. ©2014IBM Corporation N-4N-4 z990 •Anunciado em 5/2003 •1.2 GHz •32 Cores caracterizáveis •CP, IFL, ICF, zAAP •Memória de 256 GB z890 •Anunciado em 4/2004 •1.0 GHz •4 Cores caracterizáveis •CP, IFL, ICF, zAAP •Memória de32 GB Memory N-3N-3 z9 Enterprise Class •Anunciado em 7/2005 •1.7 GHz •54 Cores caracterizáveis •CP, IFL, ICF, zAAP, zIIP •Memória de 512 GB z9 Business Class •Anunciado em 4/2006 •1.4 GHz •7 Cores caracterizáveis •CP, IFL, ICF, zAAP, zIIP •Memória de 64 GB N-5N-5 z800 •Anunciado em 2/2002 •625 MHz •4 Cores caracterizáveis •CP, IFL, ICF •Memória de 32 GB z900 •Anunciado em 10/2000 •770 MHz •16 Cores caracterizáveis •CP, IFL, ICF •Memória de 64 GB N-2N-2 z10 Enterprise Class •Anunciado em 2/2008 •4.4 GHz •64 Cores caracterizáveis •CP, IFL, ICF, zAAP, zIIP •Memória de 1.5 TB z10 Business Class •Anunciado em 10/2008 •3.5 GHz •10 Cores caracterizáveis • 5 GCP •CP, IFL, ICF, zAAP, zIIP •Memória de 248 GB N-1N-1 zEnterprise 196 •Anunciado em 22/07/2010 •5.2 GHz •80 Cores caracterizáveis •CP, IFL, ICF, zAAP, zIIP •Memória de 3 TB zEnterprise 114 •Anunciado em 12/07/2011 •3.8 GHz •10 Cores caracterizáveis •5 GCP •CP, IFL, ICF, zAAP, zIIP •Memória de 256 GB IBM System z - Gerações
    8. 8. ©2014IBM Corporation zEnterprise EC12 • zEC12 - Lançada em 28 de Agosto de 2012 – RAIM como design de memória – Memória mínima de 32 GB – Até 768 GB por book – 101 Cores rodando a 5.5 GHz – Até 3 TB por sistema e até 1 TB por LPAR • 32 GB HSA gerenciado separadamente
    9. 9. ©2014IBM Corporation For IBM and Business Partner Education Use Only prior to Announcement Baterias Internas (opcional) Fontes de Energia 2 x Support Elements PCIe I/O drawers (Máximo de 5 por zEC12) Overhead Power (opcional) Processor Books com Flexible Support Processors (FSPs), PCIe and HCA I/O fanouts Radiador N +1 bombas, ventiladores e motores Cabos PCIe I / O de interconexão,cabos Ethernet e placas de controle do SFP cage Overhead I/O feature é um co- requisito para a opção de overhead power zEC12 com Resfriamento a ar baseada em radiador – (Model H89 ou HA1) Vista Frontal
    10. 10. ©2014IBM Corporation For IBM and Business Partner Education Use Only prior to Announcement Baterias Internas (opcionais) Fontes de energia I/O cage Carried Forward Unidades de Resfriamento a água N+1 Support Elements PCIe I/O drawer Processor Books com Flexible Support Processors (FSPs), PCIe and HCA I/O fanouts Cabos PCIe I / O de interconexão,cabos Ethernet e placas de controle do SFP cage zEC12 Resfriada a Água (Upgraded de uma z196) - (Model H89 ou HA1)
    11. 11. ©2014IBM Corporation zEnterprise EC12 - Modelos Memória Memóri a MC M Frente Conector de resfriamento 3 x Fontes de energia DCA n+1 (Distributed Converter Assemblies) 16 DIMMs ( 4 GB, 16 GB, ou 32 GB ) 14 DIMMs
    12. 12. ©2014IBM Corporation zEnterprise EC12 – MCM (Multi Chip Module) PU 0PU 2 SC 0 SC 1 PU 1 PU 5PU 3 PU 4 Cada PU chip possui 6 cores com Cache L1 e L2 internos, ainda dividindo 2 SC chips de Cache L3 48 MB. Cada MCM posui 2 SC chips de Cache L4 com 384 MB, que são divididos pelos PU Chips.
    13. 13. ©2014IBM Corporation zEnterprise BC12  zBC12 - Lançada em 23 de Julho de 2013 – 13 Cores rodando a 4.2 GHz – Até 512 GB por sistema • Sistema mínimo = 8 GB (Modelo H06), 16 GB (Modelo H13) • 16 GB HSA gerenciado separadamente • RAIM • Máximo para uso do cliente 496 GB (Modelo H13)
    14. 14. © 2014 IBM CorporationzBC12TLLB14 Bateria interna (opcionais) Fontes de Energia I/O Drawer 2 x CPC Drawers, Memória & HCAs PCIe I/O drawers Vista Traseira Vista Frontal 2 x Support Elements zBC12 Model H13
    15. 15. ©2014IBM Corporation zEnterprise BC12 - Modelos Processor SCM Processor SCM Storage Control SCM Slots for 5 DIMMs Slots for 5 DIMMs 2 x DCA n+1
    16. 16. ©2014IBM Corporation zEnterprise BC12 – SCM (Single Chip Module)  Cache – Cache L1 e L2 compartilhado por core – Cache L3 de 24MB compartilhado por chip – Cache L4 de 192MB compartilhado por CPC- drawer  Mais processadores no mesmo espaço de uma z114 – 6 cores por PU chip – Mesmo consumo de energia que a z114 – 4.2 GHz por core L3C0 L3C1 GX MCU Core0 Core1 Core2 Core3 Core4 Core5
    17. 17. © 2014 IBM CorporationzBC12TLLB17  MCM – MCM : 96mm x 96mm – 6 PU chips por MCM • 6 core chips com 4, 5 ou 6 cores ativos • PU Chip : 23.7 mm x 25.2 mm • 5.5GHz – 2 SC chips por MCM • 384 MB cache L4 per MCM (por book) • SC Chip : 26.72 mm x 19.67 mm – Até 4 MCMs por System zEC12 Multi Chip Module (MCM)  PU SCM – SCM : 50mm x 50mm – Hexa core chip com 4 ou 5 cores ativos – 2 PU SCMs para H06 e 4 PU SCMs para H13 – PU Chip: 23.7 mm x 25.2 mm – 4.2 GHz  SC SCM – 1 SC SCM para H06, 2 SC SCMs para H13 – 192 MB cache L4 por CPC Drawer – SC Chip : 26.72 mm x 19.67 mm zBC12 Single Chip Module (SCM) PU 0PU 2 SC 0 SC 1 PU 1 PU 5PU 3 PU 4 zBC12 SCM vs zEC12 MCM
    18. 18. © 2014 IBM CorporationzBC12TLLB18 Uma HMC pode se comunicar com todos as outras HMCs – Controle de qualquer servidor em qualquer site. – No caso de Ensemble existe a necessidade de um HMC secundário  O SE possui uma relação de backup ativo com o segundo SE – Controle dedicado a um único servidor HMC HMC HMC HMC HMCs e SEs
    19. 19. ©2014IBM Corporation Estrutura de I/O – PCIe I/O Drawer Vista Frontal Vista Traseira
    20. 20. ©2014IBM Corporation I/O features Flash Express FICON Express8SCrypto Express 4S  10km LX Feature – 10km – One slot in the PCIe I/O Drawer – 2Gbps,4Gbps e 8Gbps  SX Feature – 2Gbps até 500 metros – 4Gbps até 380 metros – 8Gbps até 150 metros – Disponível em pares de placas – Memória SSD de 1.4 TB por par – Máximo de 4 pares por máquina – RAID 10 – Acelerador para operações de criptografia usando SSL/TLS – Co-processador – De 1 até 16 features por máquina
    21. 21. ©2014IBM Corporation I/O features IBM zEDC Express 10 GbE RoCE OSA- Express 5S – Prover acelereção para compressão e decompressão dados – De 1 até 5 features por sistema – Uma placa pode ser divida por até 15 LPARs – Exclusiva para z/OS – Reduzir o consumo de CPU por aplicações TCP/IP – De 1 até 16 placas por máquina – Cada placa deve ser dedicada a uma LPAR  10GbE LR Feature  10GbE SR Feature  GbE LX Feature  GbE SX Feature  1000BASE-T Feature
    22. 22. © 2013 IBM Corporation22 Desafio Para suportar a crescente demanda, a Algar Telecom precisava de uma infraestrutura forte e flexível, que entregasse alta disponibilidade e confiabilidade para os serviços de telecomunicações. Solução A Algar Telecom consolidou mais de 90 servidores distribuídos em servidores virtuais Linux, usando z/VM em uma única IBM zEnterprise 196, utilizando também uma IBM zEnterprise BladeCenter Extension. Benefícios Entregou uma plataforma confiável e flexível para os serviços de ponta, que :  Reduziram os custos do data center em 70%  Reduziu os esforços em manutenção em 65%  Impulsionou a eficiência operacional em 30% “Transformamos completamente nossa infraestrutura e a forma como a gerenciamos com o IBM zEnterprise System. Como consequência, estimamos que nossa eficiência operacional aumentou em pelo menos 30%.” Rogério Okada, Gerente de TI Algar Telecom Referência de cliente – Algar Telecom
    23. 23. ©2014IBM Corporation Siglas CP – Central Processor zEDC - zEnterprise Data Compression zAAP - System z Application Assist Processors OSA - Open System Adapter zIIP - System z Integrated Information Processor RoCE – Remote Direct Access over Converged ICF – Internal Coupling Facility Ethernet SAP – System assist processor CICS – Costumer Information Control System IFL – Integrated Facility for Linux IMS – Information Management System RAIM – Redundant Array of Independent Memory HSA – Hardware System Area PCIe - Peripheral Component Interconnect Express MCM – Multi Chip Module SCM – Single Chip Module DIMM - Dual Inline Memory Modules DCA – Distributed Convertor Assemblies PU – Processor Unit SC – Storage Control CPC – Central Processor Complex HMC – Hardware Management Console SE – Support Elements FICON – Fiber Channel Connection
    24. 24. ©2014IBM Corporation Referências Bibliográficas  IBM zEnterprise BC12 Technical Guide ( http://www.redbooks.ibm.com/abstracts/sg248138.html?Open )  IBM zEnterprise EC12 Technical Guide ( http://www.redbooks.ibm.com/abstracts/sg248049.html?Open )  Estudo de caso Algar Telecom ( http://www-01.ibm.com/common/ssi/cgi-bin/ssialias?subtype=AB&infotype=PM&appname=STGE_ZS_ZS_BRPT&htmlfid=ZSC0316 )

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