Processor module based on ADSP-BF609 - solution for video and audio data processing systems development and for the systems with specialized algorithms of the digital processing of signals
2. Full datasheet
Page 2 Full datasheet: Processor module based on Analog Devices BF609
1. General information
Processor module AX-SOM-BF60x – is high performance, high integrated, compact
and low power consumption module with lowest price.
This module - ideal solution for building such embedded devices as: medical
equipment, industrial equipment, industrial controllers (PLC), multimedia devices and
others, where a lot of peripheral modules is used and high performance requires.
For module ready next BSPs:
Embedded uClinux 3.x
eCOS 3.0
scmRTOS
FreeRTOS
3. Full datasheet
Page 3 Full datasheet: Processor module based on Analog Devices BF609
1.1. Short description
Analog Devices Blackfin DSP BF609:
o 2 cores Blackfin with 1 GHz total
o Now HD video processing module – PVP
o Pixel Compositor
Up to 2Gbit DDR2 RAM
Up to 32Mbit SPI ROM
LCD 24-bit interface
2 x UART
1 x Rotary counter
8 x Timer/Counter with PWM
2 x 3-phase PWM module
3 x SPORT
2 x SPI
1 x USB OTG
3 x PPI
1 x RSI (SD/MMC/eMMC)
1 x CAN
2 x TWI (I2C)
1 x ADC (ACM)
4 x Link port
2 x Ethernet MAC (IEEE 1588)
1 x SMC bus
GPIO
JTAG
Power supply ( 3,3V )
Dimensions 60 mm x 55 mm
Special board-to-board connectors with 1,27 mm step
4. Full datasheet
Page 4 Full datasheet: Processor module based on Analog Devices BF609
1.2. Functional description
Fig. 1: Functional diagram of the AX-SoM-BF60x processor module
BF609
@ 2x500MHz
DC/DCs
SPI
Flash
4 MB
2 x DDR2
64/128 MB
@ 500MHzConnectors
1xUSB, 2xEMAC, eMMC/RSI, 2xCAN,
2xUART, 2xPWM, 8xTIMER, 1xCNT,
4xLP, 2xTWI, 3xSPORT, 2xSPI ,
3xPPI*
DMC
SPI0
SYS
+3,3V
Boot mode
JTAG + UART0
Connector
Additional
power supply
connector
Temp
monitor
TWI0
SYS
microSD
up to 4GBRSI
5. Full datasheet
Page 5 Full datasheet: Processor module based on Analog Devices BF609
1.3. Description of the functional blocks
1.3.1. Analog Devices Blackfin BF609 processor
Used ADSP-BF609KBCZ-ENG as main processor.
1.3.2. DDR2 SDRAM memory
By default, is used DDR2 memory Samsung K4T1G164QF-BIE6, with 128 MBytes size
(Can be replaced with 256 MBytes).
Beginning of DDR2 RAM in BF60x (DMC) – 0x0000 0000.
1.3.3. SPI Flash memory
By default, is used SPI Flash memory STMicro M25PE80 with 1 MBytes size (Can be
replaced with: 128/256/512 KBytes).
SPI flash memory connected to SPI0 bus.
1.3.4. Power supply
CPU core voltage regulator - ADP2119ACPZ-R7 (1,25V @ 2,5A).
DDR2 SDRAM - NCP1529ASNT1G (1,8V @ 500mA).
1.3.5. Boot mode for Analog Devices BF60x
Boot from SPI Flash is installed by default (All boot mode pins are accessible on board-to-
board connector).
1.3.6. Other
For CPU reset is used Maxim MAX803SEXR supervisor.
ADM1032ARMZ is used for CPU temperature control (This monitor connected to TWI0
bus).
TI TPD4S012DRYR is used for USB lines ESD protection.
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1.4. Connector Description
To connect to the motherboard are used PLLD-1.27-80S and PLLD-1.27-40S
connectors with 1.27 mm step.
1.4.1. Физическое расположение разъёмов
Fig. 2: Locating connectors on the top of the module
BF609
DDR2
SPI
Flash
DC/DC
X2
DCпитание
X1
JTAG+UART0
DC/DC
Temp
monitor
microSD
DDR2
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Fig. 3: Locating connectors on the bottom of the module
1.4.2. Signal description on X1-X5 connectors
Please take care about supported I/O voltage when connecting to pins.
Pin type:
I/O - Digital input/output with supported voltage level +3,3V;
Power - Power line (+ 3,3V);
GND - Ground line;
- - Other.
X4 (I/O)
X3 (I/O)
X5
(Питание,SYS_CTRL,JTAG,TWI0,TWI1)
11. Full datasheet
Page 11 Full datasheet: Processor module based on Analog Devices BF609
77 BF_PG_15 PG_15 I/O AB20 ~UART1_TX
78 BF_PG_13 PG_13 I/O AA20 ~UART1_CTS
79 BF_PG_10 PG_10 I/O AB21 ~UART1_RTS
80 GND - GND -
1.4.2.5. X5 connector
Pin
number
Signal Name Type Note
1 VCC_3.3V Power
2 VCC_3.3V Power
3 GND GND
4 GND GND
5 VCC_3.3V Power
6 VCC_3.3V Power
7 GND GND
8 GND GND
9 ~TEMP_MON_ALERT I/O Connected to ADM1032ARMZ – ~ALERT, pin 6
10 ~TEMP_MON_TERM I/O Connected to ADM1032ARMZ – ~THERM, pin 4
11 GND GND
12 BF_JTAG_TDI I/O Connected to BF609 – JTG_TDI, ball D1
13 BF_JTAG_TDO I/O Connected to BF609 – JTG_TDO, ball D2
14 BF_JTAG_TMS I/O Connected to BF609 – JTG_TMS, ball E3
15 BF_JTAG_TCK I/O Connected to BF609 – JTG_TCK, ball D3
16 ~BF_JTAG_TRST I/O Connected to BF609 – JTG_TRST, ball E1
17 ~BF_JTAG_EMU I/O Connected to BF609 – JTG_EMU, ball E2
18 GND GND
19 BF_BMODE0 I/O Connected to BF609 – SYS_BMODE0, ball J3
20 BF_BMODE1 I/O Connected to BF609 – SYS_BMODE1, ball H3
21 BF_BMODE2 I/O Connected to BF609 – SYS_BMODE2, ball G3
22 GND GND
23 GND GND
24 BF_CLKIN_OUT I/O Buffered oscillator clock output – 25MHz
25
BF_CLKOUT_R
I/O Connected to BF609 – SYS_CLKOUT, ball N3, via 33 Ohm
resistor
26 GND GND
27 GND GND
28 BF_EXTWAKE I/O Connected to BF609 – SYS_EXTWAKE, ball K2
29 BF_FAULT I/O Connected to BF609 – SYS_FAULT, ball F2
30 ~BF_FAULT I/O Connected to BF609 – ~SYS_FAULT, ball F1
31 ~BF_NMI I/O Connected to BF609 – ~SYS_NMI ball F3
32 BF_PWRGD I/O Connected to BF609 – SYS_PWRGD, ball J2
33 ~BF_HWRST I/O Connected to BF609 – ~SYS_HWRST, ball G2
34 GND GND
35 BF_TWI0_SDA I/O Connected to BF609 – TWI0_SDA, ball D22
36 BF_TWI0_SCL I/O Connected to BF609 – TWI0_SCL, ball C22
37 GND GND
38 BF_TWI1_SDA I/O Connected to BF609 – TWI1_SDA, ball D21
39 BF_TWI1_SCL I/O Connected to BF609 – TWI1_SCL, ball C21
40 GND GND
12. Full datasheet
Page 12 Full datasheet: Processor module based on Analog Devices BF609
1.5. Mechanical Outline
Fig. 4: Mechanical outline (top view)
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Fig. 5: Mechanical outline and Bottom Connectors (bottom view)
14. Full datasheet
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1.6. Electrical Specifications
Parameter Min Normal Max Unit
Power supply,
VCC_3.3V
3.15 3.3 3.45 V
Power consumption TBD TBD TBD mA
High level output
voltage
2.4 TBD TBD V
Low level output
voltage
TBD TBD 0.4 V
1.7. Order code
AX-SoM-BF60x-Rx-Sx-I
BF60x – processor type [BF609];
Rx –DDR2 RAM size, [128 MBytes, 256 MBytes] – example: 256 MBytes DDR2 RAM – R256;
Sx –SPI Flash size, [128KBytes … 4MBytes] – example: 4 MBytes SPI Flash – S4096;
I – industrial temperature range.
Example:
AX-SoM-BF609-R256-S1024-I,
with this order code, on module will be installed next configuration: ADI BF609, 256 MBytes DDR2 RAM,
1 MByte SPI Flash. All components will be used in industrial temperature range.
By default, module shipped with U-boot loader. Also can be preprogrammed Embedded uClinux (if
enough size SPI Flash installed).
15. Full datasheet
Page 15 Full datasheet: Processor module based on Analog Devices BF609
1.8. Contacts
AXONIM Devices
220125 Gintovta str 1, Minsk, Republic of Belarus
Tel.: +375 17 336 40 81
Fax.: +375 17 336 40 84
E-mail: info@axonim.by
http://www.axonimdevices.com