1. Thermal Management in Electronic Components –
Can Polymers Replace Metals or Ceramics?
Aravind Chander, Senior Research Analyst,
Technical Insights, Chennai,
June 3, 2008

2. Focus Points
• Introduction to Thermally Conductive Polymers (TCPs)
• Technology Challenges and Drivers
• Current Trends and Future Trends
• Material Technologies Analysis
• Technological Innovations in this Arena
• Key Industry Participants
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3. Introduction
• Electronic devices are getting smaller and thinner
• Conventional plastic components overheat often and develop
localized quot;hot spotsquot;
• Development of TCP’s has paved way to significant breakthrough
for thermal management applications as they carry the same
heat transfer capacity as metals or ceramics
• TCP’s have good chemical resistance and give up heat faster
during molding than conventional plastics
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4. Challenges – Thermally Conductive Polymers
There is a demand for newer compounds
that could compete with the existing
thermoplastic compositions. Concern for Passive
Component Manufacturers
Thermal high-temperature conditions
Manufacturing Fatigue and for a long period of time
Cost Heat can damage or change
Lack of New their organic properties.
Dissipation
Polymer
Compounds
Elevated
Temperature
Due to the polymer properties
such as High CTE and Low
High initial cost is the biggest Thermal Conductivities.
obstacle to wider acceptance of Demand for
thermally conductive compounds. More Power
The increase in activities of the
Note: Size of the ball is not related to components has led to demand for more power
importance or weight of the factor in order to maintain the existing performance.
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5. Drivers – Thermal Conductive Polymers
Compounds can be used as
Polymers can be more easily custom manufactured to a wider range
encapsulates in
of sizes and shapes when compared to conventional materials.
electronic component
This enables them to be deployed for a broader range of applications.
packaging making it suitable
for smaller and thinner without Easy material
compromising on process ability Polymers, particularly bio-based polymeric
mechanical properties. compounds are gaining importance which
can be effectively recycled with no harmful
effect on the environment.
Miniaturization
of electronic
components
Continued
focus on Recyclability
Weight Excellent
Reduction Mechanical
Properties
Weight reduction by means of
using plastics for manufacturing safer,
lighter and high performance devices. Thermally Conductive Polymers
possess higher flexural strength, tensile
Note: Size of the ball is not related to stiffness, and low-impact strengths.
importance or weight of the factor
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6. Current Trends
Thermally conductive adhesives
for lighting application
High viscosities make molding
Custom-molded heat over a large surface area
sinks on circuit boards difficult
Current
Trends
Carbon nanofibers and boron
nitride filler is gaining more Laser Diode Encapsulation is in
attraction the developmental phase
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7. Future Trends
Composites will target flip chips
and solder joint applications
New compounds from Tailorable CTEs with low
natural resources high manufacturing cost
temperature stability
Future
Trends
PCB itself can act as heat sink Elastomers is expected to get
more treatment
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8. Parameters for Technology Performance
CTE
Chemical resistance Mechanical Strength
Technology
Performance
Processing ease and Temperature range
Workability
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9. Parameters for Application Potential
Light Weighted ness
Miniaturization of
Thermal Stability components
Application
Potential
Design Cost
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10. Technology Performance Vs Application Potential
(Present Scenario)
Electronics Sector- Present Scenario
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Carbon Nanofibres
Silicone
Application Potential
Epoxies
Urethanes
Acrylics
5
0
0 5 10
Technology Performance
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11. Technology Performance Vs Application Potential
(7- 10 years from Now)
Electronics Sector-10 years from now
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Carbon Nanofibres
Application Potential
Epoxies Acrylics
Silicones
Urethanes
5
0
0 5 10
Technology Performance
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12. Noteworthy Innovations
Development of a polycarbonate compound (Nemcon- H) by Ovation
Polymers Inc.
National Starch and Chemical Company, NJ, USA have
demonstrated fusible particles can enhance thermal conductivity.
A broad range of Vectra liquid crystal polymer (LCP) grades using
several polymer systems with various fillers and reinforcements was
developed by Ticona Technical Polymers, KY, US
Development of a new thermally conductive line of compound by
Dow Corning Corporation, US.
Development of a series of boron nitride filler grades under the name
PolarTherm by Momentive Performance Materials GmbH.
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13. Key Industry Participants
Cool Polymers Inc Momentive
Ovation Polymers Performance Materials
Fujipoly American Kunze Folien GmbH
Corporation Shin-Etsu
CYTEC Inc Pronat
Cast-Coat Inc Industries Chemical
Timtronics Ltd. Co. Ltd
Diemat Inc.
Ticona Technical
Polymers
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Please inform us by taking our survey.
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15. For Additional Information
Steve Lee
Strategic Account Manager
Chemicals, Materials and Food, Asia Pacific
(65) 6890 0914
steve.lee@frost.com
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