1. Met steun van
Introduction by cEDM
Filip Ponsaerts
May 30, 2013
Sirris Workshop
“Voorkomen van faling door vibraties”

2. © imec 2013 | www.edmp.be
To support industry in the development of high
quality, reliable and cost-effective electronic modules
(PBA) by means of knowledge creation and sharing,
scientifically sound methodologies and
collaboration throughout the electronic supply chain.
Collective
• Awareness creation
• Design Guidelines
• PBA development tools
• Seminars - training
Bilateral
• Consultancy
• Knowledge transfer
• Implementation
•Training
Better electronics at reduced cost through
science based design & production methodologies.
cEDM Mission and Objectives
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cEDM Approach
1. Scientific basis
Quantitative physical modeling.
PBA X-factor = f(design, production)
2. Collaboration with representatives of the
different parts of the supply chain via the
cEDM partner group.
3. Helicopter view,
commercial independence
and scientific objectivity.
Product concept
OEM
Product design
OEM-ODM
Physical design
OEM-ODM-
designhouse
Manufacturing
OEM-ODM-EMS
Distribution
OEM-ODM-EMS
Customer
Qualification
OEM-ODM-Testlab
PCB
Components
Materials
Packaging
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cEDM industry partners and members
• Founding partner: Sirris (WTCM)
• 17 cEDM partners
– 28 cEDM members
– >50 Benelux companies represented
– Majority of PCB/EMS turn-over in Benelux
– >20000 employees – >€8 Billion turn-over
cEDM
Partners
cEDM
Leden
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cEDM’s CROSS-Disciplinary team
Multidisciplinary research and industrial background
Geert Willems – Team leader (1/7/2005)
• Dr. ir. Electronics Engineering - PhD
• 10 years research in micro-electronics: SOI, Integrated Ferro-electrics
• 10 years industrial experience: PBA technology, assembly, NPI
Alain Carton – PCB/PBA Design-for-X (15/1/2008)
• Ing. Electronics Engineering
• >15 years of industrial PCB/PBA design experience
• IPC certified: CID – IPC-A-600 & IPC-A-610 inspector
Wesley Van Meensel – PBA information engineering (26/4/2010)
• ir. Chemical Engineering
• >3 years experience in PBA industrialisation and related automation
• Our IT & software wizard
Filip Ponsaerts – EDM operations & business development (18/7/2011)
• Ing. Electronics Engineering – Computer Science
• Master in Multi-Media Technology and Virtual Reality
• 10 years experience in electronics design
• 10 years experience in design, R&D and Q management in large and small
enterprises.
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cEDM’s CROSS-Disciplinary team
Multidisciplinary research and industrial background
Boris Leekens – PCB/PBA DfX – Industrial projects (14/9/2011)
• Ing. Electronics engineering - MBA
• 20 years industrial experience in electronic assembly: Functional test engineering,
NPI project management and account management.
Steven Thijs – R&D project leader (1/11/2011)
• Dr. ir. Electronics Engineering – PhD
• >10 years of research experience in ESD of CMOS devices
Bart Vandevelde – R&D project leader (1/4/2013)
• Dr. ir. Mechanical Engineering – PhD
• >15 years Package and PBA reliability and thermo-mechanical research expertise
– 70 years of experience in the electronics industry
– 40 years of advanced research experience
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7. Met steun van
Introduction VIS-Prosperita
Steven Thijs – project leader Prosperita
May 30, 2013
Sirris Workshop
“Voorkomen van faling door vibraties”

8. © imec 2013 | www.edmp.be
VIS-PROSPERITA
PRoductverbetering dankzij Ontwerp– en Specificatie-
richtlijnen voor Elektronica Realisatie en InTegrAtie
gebaseerd op fysische modellering
(Product improvement through design and specification guidelines for
realization of electronics and integration, based on physical modeling)
Goal:
Design-for-X guidelines to design, manufacture and integrate cost
effective PBA’s with controlled quality and reliability, aiming for
competitive electronic based products and systems on the
international market in a cost effective manner and with a short
time-to-market
Duration:
January 2011 – December 2014
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Guidelines
Two groups:
1. Design-for-Manufacturing
• focus on cost effective manufacturing of PBA’s
• controlled quality
• basic aspects of reliability
• Specification of PCB, components, materials and PBA
2. Integration
• focus on the correct installation of the PBA in a system
• impact of the load conditions of the system onto the PBA(‘s)
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VIS-PROSPERITA
PBA realization: DfM-DfR-DfT
D1: PCB Specification
D2: Component Specification
D3: Assembly material
D4: Design-for-Assembly
D5: PCB density classes
D6: PCB Layout
D7: Design-for-Test PBA integration
I1: Mechanical interaction
I2: Thermal interaction
I3: EMC interaction
I4: integration
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Guideline status
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D1 - PCB specification
D2 - Component specification
D3 - Assembly material spec.
D4 - Design-for-Assembly
D5 - PCB classification
D6 - Layout rules
D7 - Design-for-Test
I1 - Mechanical interaction
I2 - Thermal interaction
I3 - EMC interaction
I4 - Integration
Status Prosperita guidelines
Started First draft Under review Released

12. © imec 2013 | www.edmp.be
EDM-D-001: PCB specification
• What laminates to select in order to:
– Avoid delamination during lead-free
soldering
– Avoid via cracking during lead-free
soldering
– Avoid via cracking before product’s
expected end-of-life
– How to select and specify?
• What solderable finish to be used?
• What to do regarding PCB and
moisture uptake?
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EDM-D-002: Component specification
• How to get a (lead-free) soldering compatible BOM?
– Moisture Sensitivity requirements: J-STD-20
– How to deal with temperature and other process sensitivities
of passive components: J-STD-075, PSL, what if no PSL?
– Predicting BOM dependent reflow temperature difference
across the PBA. Identifying reflow process critical designs
• How to select a BOM for high yield/quality assembly?
• How to deal with component related reliability aspects?
– Solder joint reliability critical component types
– Sn-whisker mitigation
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• What assembly materials are acceptable on professional
equipment?
– Solder, flux, wire, paste,...
– Adhesives
– Conformal coating
• How to specify?
• What are the quality risks?
• What about cleaning?
EDM-D-003: Assembly Materials
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EDM-D-004: Design-for-Assembly
• Basic DfA rules: fiducials, component free areas,...
• How to select PBA build-up: SS, DS, SMT, TH?
• How to align component placement to assembly flow?
• How to optimize for yield, cost, logistical risks,...?
• Solder process compatibility of component selection and
placement
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EDM-D-005: PCB Build-Up and Density Classification
PCB Build-Up:
• What determines PCB build-up: layer count,
use of through-, buried-, micro-, filled vias,
copper thickness, laminates,...?
• Basic PCB build-up rules for yield, cost, quality,
reliability optimization
Density Classification:
• How to align PCB routing needs
and PCB manufacturing capability?
• How to quantify interconnection density?
• How to optimize?
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EARExternal
via land
Viaplating
IARInternal
via land
Viaplating
EL IL

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EDM-D-006: Layout solutions
Provide layout solutions for commonly occurring cases:
• BGA fan-out
• QFN footprint
• Impedance controlled PCB build-up
• Thermal relief
• Selective soldering keep-out areas
• ...
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EDM-D-007 : Design-for-Test guideline
• How to set-up a test strategy?
• Basic Design-for-Test rules: providing test access
• How to quantify the impact of production tests on PBA
yield/Zero Hour Defect Rate
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EDM-I-001: Mechanical interaction
See this workshop
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EDM-I-002: Thermal interaction
How to obtain sufficient on-board cooling?
• PBA level thermal resistance models
• How to design the PBA?
– Embedded heat sink planes
– Thermal vias
– Heat sinks
– Component package selection
• Impact on PBA of system
level solutions
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EDM-I-003: EMC interaction
• How to design for signal integrity and EMC?
– Quantification of impact of PCB structures: track length,
vias, thermal relief, test pads,...
– Positioning of power integrity passives
– Elementary design rules
• How to deal with manufacturability and other DfX
conflicts?
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EDM-I-004: PBA system integration
• How to integrate PBA’s in systems?
– comply with mechanical demands
– comply with thermal demands
– comply with EMC demands
– while being cost-effective
– while retaining quality
– while retaining reliability
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Quantification: DfX supporting tools
Website tools available for EDM members and partners
• Via reliability calculator
• PCB delamination calculator
• PCB laminate overview (>200 laminates)
• PB Assembly checklist (PBA materials and processes)
• Failure risk assessment (DfR FMEA)
• BOM DfM Checklist (component properties to be known)
• NPI Questionnaire (industrialization support)
• IPC standards guide (where do I find it at IPC?)
www.edmp.be
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Quantification: DfX supporting tools
Website tools under development
• Mechanical response calculator
• Assembly production flow calculator
• DfM quality evaluator
• Solder joint lifetime calculator
• PCB production flow calculator
• Thermal resistance calculator
• Recyclability rating
• ...
Everything will be executable without special software tools
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Quantification: Pred-X
• Offline tool for PBA design evaluation
• Supports design from concept phase (first estimates) up to
production deployment (yield evaluation)
• No special software tools required
• Core version:
– PBA description
– DPMO error rate zero order model
– Test coverage zero order model
– Customization of models
– Yield-Test Coverage calculation
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Geert.Willems@imec.be
++32-498-919464
www.edmp.be
Questions?