1. Thin Wafers, Temporary Bonding Equipment & Materials
Market
Report Details:
Published:October 2012
No. of Pages:
Price: Single User License – US$5390
Memory, Logic, Power Devices & Image Sensors markets will drive the thin wafers market
and related handling technologies
WITH ALMOST ¾ OF THE TOTAL NUMBER OF WAFERS EXPECTED TO BE THINNED BY
2017, TEMPORARY BONDING MARKET WILL INCREASE IN THE COMING YEARS
This Yole Développement report describes why thinner wafers will be needed in the future,
especially for consumer applications. Indeed, consumer electronics is a big driver for smaller,
higher-performing, lower-cost device configurations for use in various applications, such as
memory and wireless devices. These new configurations, in turn, are pushing demand for thin (<
100 µm) and even ultra-thin semiconductor wafers (below 40µm) with the following benefits:
•Reduced thickness and thus thinner packages (in cell phones, packaged dies must be < 1.2mm
thick; this number shrinks to1mm for smart phones)
•Wafer thinning is the most efficient approach used for heat dissipation in thermal management
•For 3D integration, thin wafers bring higher through Si vias density, as pitch and dimensions are
becoming smaller
However, as wafer thickness decreases to 100µm and below, manufacturing challenges arise.
Ultra-thin wafers are less stable and more vulnerable to stress, and the die can be prone to
breaking and warping—not only during grinding but also during subsequent processing steps. Yole
Développement’s report describes why special thin wafer handling processes (i.e. temporary
bonding) are necessary, especially when wafers are dual-side processed or have high
topographies.
This report deals not only with the thin wafers market and applications, but also with related
processes, equipment, and materials for temporary bonding.
Thin wafer shipment forecasts are analyzed, as there is definitely a growing need for thin wafers
(below 100 µm) for numerous applications: 3D ICs, MEMS, CMOS Image Sensors, Power
Devices, LEDs, RF Devices, Memory & Logic, Interposers and Photovoltaic. The report shows
that, by 2017, the ratio of THIN wafers vs. TOTAL number of wafers (in 300 mm eq.) will be 74%,
corresponding to > 80M 12’’ eq. wafers.
Applications are also described in the report. The 2012 market drivers for thin wafers are 3D ICs,
and also Power Devices and CIS BSI for ultra-thin wafers. Indeed, the BSI application is the big

2. driver for ultra thin wafers; this application is currently booming. 2011 was a big year for 300 mm
wafer bonding tools, thanks to BSI. This application requires ultra thin layers (< 10µ) on 12’’.
Forecasts by wafer thickness are analyzed in the report. In 2017, most of the 12’’ wafers will be
200µm thick for logic application; also, most of the thinned wafers will be in the 10-99µ thickness
range. This includes memory, as well as interposers and power device applications.
CURRENTLY LOW IN VALUE, THE TEMPORARY BONDING EQUIPMENT MARKET WILL
REACH US$250M BY 2017
Thin wafer handling will enjoy increased importance in the coming years, but as chips get thinner
and wafer diameter increases, thinning/handling procedures are required. This implies
development in wafer thinning, wafer dicing and wafer temporary bonding.
Yole Développement’s report provides a temporary wafer bonding equipment forecast which
shows that 10% of the total thin wafer shipment will experience a temporary bonding step by 2017.
So, while temporary bonding equipment is still a small market today, it is expected to grow as the
need for thin wafer handling grows. In fact, we estimate the market for temporary bonding tools to
be more than $250M by 2017. Currently, shipped bonder/debonders are for Power and 3D ICs
applications. However, we believe 3D ICs will become the predominant application for temporary
bonders > 2015.
Temporary bonding implies know-how in process and chemistry, and an understanding of the final
application requirements. Temporary bonding is a complex technology, requiring an interface
material (sometimes called the “Magic” material) that is strong enough to withstand post-
processing but which can be easily removed afterwards. As the main concern for temporary
bonding materials (wax, tape or glue) is temperature stability, the material must be strong enough
to withstand processing steps (metallization, etching, grinding). Another issue is the choice of
carrier material. Carrier lifetime depends on its capability to withstand steps such as grinding, etc.,
and carrier lifetime should be at least tens of times, though this is not yet the case today.
WHAT’S NEW COMPARED TO THE 2011 REPORT?
Compared to the 2011 installment, this report now contains:
Updated thin wafers forecast 2011-2017
•By application
•By thickness
•By wafer size
Updated players
•New chapter on Power MOSFETs
•Why thin wafers for power
•Players
•Roadmap
New chapter on Photovoltaic
•Why thin wafers for PV
•Players
•Roadmap
New chapter on temporary bonding

3. •Players
•Technologies
•Applications
•Challenges
Equipment forecast 2011-2017
•In units
•In US$
•By application
Temporary chemistry forecast 2011-2017
OBJECTIVES OF THE REPORT
Provide an understanding of the thin wafers application:
•Overview of thin wafers applications: MEMS, CMOS Image Sensors, Memory, Power Devices,
RF Devices, LEDs, Interposers, Photovoltaics
•Thin wafers roadmap
Present market forecasts for thin wafers:
•2011-2017 Market Forecast in units and US$ for thin wafers
•Detailed forecasts by application, wafer size and thickness
Analyze wafer thinning trends, with a focus on temporary bonding
Market Forecasts for temporary bonding in US$ value and number of equipment:
•By application
•By wafer size
Market Forecast for temporary bonding chemistry
Overview of the different temporary bonding approaches, i.e.:
•Without carrier:
•TAIKO
•DoubleCheck Semiconductors
•With Carrier:
•UV laser released
•Electrostatic
•Thermal release
•Mechanical release
•Chemical release
•Temporary bonding trends
•Thinning trends
•Dicing trends
•Description of the applications for temporary wafer bonding, including main characteristics and
challenges
COMPANY INDEX
1366 Technologies, 3M, AAC, ABB, Accretech, ADI, AGC, ALSI, Altera, AMAT, AMD, Amkor,
Ampulse, ANJI, Aptina / Micron, ASE, AstroWatt, Avago, Brewer Science, Cabot, Canon, Corning,

4. Cree, Crystal Solar, Dalsa, Danfoss, Discera, Disco, Dongjin, DoubleCheck Semiconductors,
Dupont, Dynatex, Ebara, EM Marin, Epistar, Epoxy Technologies, ERS, ESI, EVG, Fairchild,
Fraunhofer IZM, Freescale, GCL Solar, Hamamatsu, Hitachi Chemical, Hynix, IBM, Imec, Infineon,
Intel, International Rectifier, Invensense, Ipdia, LDK, Leti, LG Innotek, Lintec, Lumileds, MEMC,
Micron, Misui Chemical, Mitsubishi Electric, Nichia, Nitronex, Nitta Corp., Nitto Denko, Okamoto,
Omnivision, ON Semi, Osram, Panasonic, PlanOptik, Protec, Qualcomm, REC, Renesas,
ReneSola, RFMD, Robert Bosch, Roockwood, S’Tile, Samsung, SanRex, Schott, Sensonor, Seoul
Semiconductor, Shinko, Sigen, Silex, Skyworks, Solarforce, SPIL, STMicroelectronics,
Strasbaugh, STATSChipPAC, Sumitomo Chemical, SUSS MicroTEC, Synova, Taiko, Tekcore,
TEL, TMAT, TOK, Toyoda Gosei, Triquint, Twincreeks, VisEra, WLCSP, Xilinx, Xintec, Yushin.
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Major points covered in Table of Contents of this report include
Table of Contents
Table of contents 3
Why this report 4
What is new compared to 2011 report 6
List of companies mentioned in the report 7
Executive summary 8
THIN WAFERS 22
2011-2017 thin wafer market forecasts 24
Thinned wafers vs. TOT number of shipped wafers 26
Thin wafers shipment in 300 mm eq. 27
2011-2017 thin wafer shipment forecast by application in units 28
In US$ 30
2011-2017 thin wafer shipment forecast by wafer diameter in units 32
In US$ 33
2011-2017 thin wafer shipment forecast by wafer thickness in units 34
In US$ 35
2011 Thickness Breakdown 36
2017 Thickness Breakdown 37
Description of applications 39
TOP Thin wafers processors 40
Thin wafers processors production ranking 41
Thin wafers processors by application 42
Thin wafer processing geographical breakdown 43
Grinding players 44
MEMS 48
CMOS Image Sensors 60

5. Memory & Logic 70
Power Devices 74
RF Devices (GaAs) 91
LEDs 98
Advanced Packaging 104
Photovoltaic 116
THIN WAFERS HANDLING 141
Temporary bonders/Carriers/Materials forecast 143
Temporary bonded wafers forecast 144
Temporary bonders forecast in $M/units 146
Temporary bonders forecast by wafer size 147
Temporary bonding materials forecast 148
Est 2011 temporary bonding players market share 149
Thin wafer handling: the different solutions 150
Wafer handling with carrier: temporary bonding . 155
The different temporary bonding techniques 170
Thermal plastic release 171
Mechanical release 174
ZoneBOND 177
YAG laser release 180
Excimer laser release 183
Chemical release 185
Temporary bonding materials 193
The “Magic” material 195
Carriers 207
Wafer handling with carrier: electrostatic carrier . 212
Wafer handling without carrier 215
Wafer handling with ring technology 220
Wafer thinning 226
Wafer dicing 238
Final conclusions 264
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