1. Wafer Scale Manufacturing
Processes In Optical
Technologies For Illumination
Reinhard Völkel
SUSS MicroOptics, Neuchâtel
www.suss.ch, info@suss.ch

2. Light Makes The Difference!
Egyptian God Ra with Madame Taperet , 1000 BC (Louvre, Paris)
R. Voelkel, SUSS MicroOptics, „Wafer Scale Manufacturing“, World of Photonics, Panel, LASER„09, Munich, June 17, 2009
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3. Light Makes The Difference!
Thomsas A. Edison (Patent 1880)
R. Voelkel, SUSS MicroOptics, „Wafer Scale Manufacturing“, World of Photonics, Panel, LASER„09, Munich, June 17, 2009
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4. Lighting Roadmap
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5. Lighting, Illumination: Optics Is Light Work!
Light Sources Devices, Systems
„Collect all photons and illuminate!“
Performance (brightness, contrast, color,
uniformity, efficiency)
Size (larger area, smaller device)
Costs (manufacturing, energy saving, lifetime)
R. Voelkel, SUSS MicroOptics, „Wafer Scale Manufacturing“, World of Photonics, Panel, LASER„09, Munich, June 17, 2009
5 Source: 3M Vikuiti, ASML, Coherent

6. Conservation of Etendue – Lagrange Invariant
 Etendue is a property of an optical system, which characterizes how
"spread out" the light is in area and angle.
 Lagrange invariant is a measure of the light propagating through an
optical system. For a given optical system, the Lagrange invariant is a
constant throughout all space, that is, it is invariant upon refraction and
transfer.
R. Voelkel, SUSS MicroOptics, „Wafer Scale Manufacturing“, World of Photonics, Panel, LASER„09, Munich, June 17, 2009
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7. Concepts for Illumination

8. Optical Design & Illumination
 Leonard Euler (1707 – 1783)
R. Voelkel, SUSS MicroOptics, „Wafer Scale Manufacturing“, World of Photonics, Panel, LASER„09, Munich, June 17, 2009
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9. Köhler Illumination, Köhler Integrator (Fly‘s Eye)
In 1893 August Köhler (1866–1948) from
Carl Zeiss in Jena, introduced a new and
revolutionary method for uniform illumination
of specimen in an optical microscope in his
doctoral thesis.
The Köhler method allows to adjust the size
and the numerical aperture of the object
illumination in a microscope independent
from each other.
August Köhler, Zeitschrift für wissenschaftliche
Mikroskopie, Band X, Seite 433-440 (1893)
R. Voelkel, SUSS MicroOptics, „Wafer Scale Manufacturing“, World of Photonics, Panel, LASER„09, Munich, June 17, 2009
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10. Köhler Illumination, Köhler Integrator (Fly‘s Eye)
In 1893 August Köhler (1866–1948) from Carl
Zeiss in Jena, introduced a new and revolutionary
method for uniform illumination of specimen in an
optical microscope in his doctoral thesis.
The Köhler method allows to adjust the size
and the numerical aperture of the object
illumination in a microscope independent
from each other.
August Köhler, Zeitschrift für wissenschaftliche
Mikroskopie, Band X, Seite 433-440 (1893)
R. Voelkel, SUSS MicroOptics, „Wafer Scale Manufacturing“, World of Photonics, Panel, LASER„09, Munich, June 17, 2009
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11. 1946: Microlens Array Homogenizer
R. Voelkel, SUSS MicroOptics, „Wafer Scale Manufacturing“, World of Photonics, Panel, LASER„09, Munich, June 17, 2009
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12. 2005: Nikon Corporation
R. Voelkel, SUSS MicroOptics, „Wafer Scale Manufacturing“, World of Photonics, Panel, LASER„09, Munich, June 17, 2009
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13. Light Sources Today: More Power – Less Energy!
 Uniformity
 Efficiency
 Costs
R. Voelkel, SUSS MicroOptics, „Wafer Scale Manufacturing“, World of Photonics, Panel, LASER„09, Munich, June 17, 2009
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14. Illumination Concepts For Displays
Source: 3M Vikuiti
R. Voelkel, SUSS MicroOptics, „Wafer Scale Manufacturing“, World of Photonics, Panel, LASER„09, Munich, June 17, 2009
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15. Richard Ulbricht Invented The Ulbricht Sphere
 Dr. Richard Ulbricht (1849 – 1923, Dresden)
 Invented the Ulbricht Sphere when he was trying to find the optimium
optics for electrical illumination of Dresden„s train stations (≈ 1891)
R. Voelkel, SUSS MicroOptics, „Wafer Scale Manufacturing“, World of Photonics, Panel, LASER„09, Munich, June 17, 2009
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16. Tasks for Micro-Optics
Intensity
LED Plastic, Glass
LED Homogenization
Reflector
Substrate
Beam Collimation Beam Shaping
R. Voelkel, SUSS MicroOptics, „Wafer Scale Manufacturing“, World of Photonics, Panel, LASER„09, Munich, June 17, 2009

17. RXI Collimator
RXI
Refraction Reflection Total Internal Refraction
• High efficiency LED out-coupling
• Etendue limited performance (88% max)
• Short (D / L ~ 3)
• Bezier curves description (8 surfaces)
• Direct optimization
R. Voelkel, SUSS MicroOptics, „Wafer Scale Manufacturing“, World of Photonics, Panel, LASER„09, Munich, June 17, 2009

18. Wafer-Scale Manufacturing Is Quite Sucessful!
 Wafer-based „SEMI“ technology changed our world dramatically in the
last 50 years!
 Manufacturing concepts from SEMI are adapted for other products.
 Computers, digital cameras, displays, LED, OLED, high-power switches,
wafer-level cameras, ...
 Wafer-based „SEMI“ technology for Optics is very successful.
 Question: Is it now possible to integrate Optics on the LED using
Wafer-Level Packaging?
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19. Wafer-Level Camera (WLC)
Microlens Imprint Lithography (SMILE)

20. Example: Mobile Phone Cameras
R. Voelkel, SUSS MicroOptics, „Wafer Scale Manufacturing“, World of Photonics, Panel, LASER„09, Munich, June 17, 2009
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21. Example: Mobile Phone Cameras
Wafer-Level Solutions
R. Voelkel, SUSS MicroOptics, „Wafer Scale Manufacturing“, World of Photonics, Panel, LASER„09, Munich, June 17, 2009
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22. Microlens Replication on Wafer Level
1. Lens Imprinting 2. Lens Transfer
Stamp Holder
PDMS Stamp
on glass baker
Loaded PDMS Stamp
UV epoxy
Wafer
Chuck with
glass inlay
Fabricated lens wafer with residual layer Fabricated lens wafer with transferred lenses
R. Voelkel, SUSS MicroOptics, „Wafer Scale Manufacturing“, World of Photonics, Panel, LASER„09, Munich, June 17, 2009
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23. Wafer-Level Packaging of Lens Wafer
Process equipment:
 Substrate holder with glass inlay to hold buffer and lens wafers
by vacuum Substrate holder
 Edge handling chuck or buffer plate avoids lens damages on
lens surfaces
 Assisted Alignment for highly precise alignment of Opto wafers
prior to UV bonding
 High intensity UV exposure for short process times
Substrate VAC 1
Holder VAC 2
Edge Handling
Chuck
Loaded buffer wafer with double sided lens wafer on
edge handling chuck
Edge handling chuck for lens stacking
with loaded buffer wafer
SUSS MA/BA8 Gen3
Opto wafer stack with UV bonded lens wafer
R. Voelkel, SUSS MicroOptics, „Wafer Scale Manufacturing“, World of Photonics, Panel, LASER„09, Munich, June 17, 2009
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24. BMBF-VDI COMIKA: Wafer Level Camera
UV Bond: Delo Katiobond AD VE18499
100µm
Schott B33, 8”
Basic concept of WLC sample
UV Bond: Delo PHOTOBOND 4302
MA/BA8 Gen3 Micro Lens replication on 200mm wafer
Material: Delo Katiobond 18499
R. Voelkel, SUSS MicroOptics, „Wafer Scale Manufacturing“, World of Photonics, Panel, LASER„09, Munich, June 17, 2009
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25. Micro-Optics on Wafer-Level
Unwrapped phase / lambda
Refractive Microlens Arrays (ROE) Binary Optics Diffractive Optical Elements (DOE)
Wafer-Level Camera for disposable endoscopes
(Photo: AWAIBA)
Random Diffusers, Homogenizer Wafer-Level Camera, Fiber Arrays, Sensors
R. Voelkel, SUSS MicroOptics, „Wafer Scale Manufacturing“, World of Photonics, Panel, LASER„09, Munich, June 17, 2009
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252.15 504.31 756.46 1008.62 1260.77

26. Micro-Optics on Wafer-Level
Unwrapped phase / lambda
Refractive Microlens Arrays (ROE) Binary Optics Diffractive Optical Elements (DOE)
Random Diffusers, Homogenizer Wafer-Level Camera, Fiber Arrays, Sensors
R. Voelkel, SUSS MicroOptics, „Wafer Scale Manufacturing“, World of Photonics, Panel, LASER„09, Munich, June 17, 2009
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252.15 504.31 756.46 1008.62 1260.77

27. Wafer-Based Manufacturing
Technology For MicroOptics

28. SUSS MicroOptics – We Set The Standards
 World leading supplier of high-quality Micro-Optics
 8‟‟ Wafer Technology, Wafer-Level Packaging, SUSS Imprint Lithography
 More than 200 active customers, e.g. to SEMI equipment manufacturers, Laser
& Optics industry, Sensors & Metrology and Medical
 Part of the SUSS MicroTec Group (www.suss.com)
Neuchâtel, Swiss Watch Valley
SMO is “Preferred Supplier” for Carl Zeiss SMT AG:
DUV Laser Beam Shaping Solutions (ASML Steppers)
R. Voelkel, SUSS MicroOptics, „Wafer Scale Manufacturing“, World of Photonics, Panel, LASER„09, Munich, June 17, 2009
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29. SUSS MicroOptics – 8’’ Wafer Fab
Cleanroom facility (Class 1 – 1000) for the wafer-based
manufacturing of high-quality Micro-Optics
Fully established 8‘‘ technology based on SEMI processes
 200 mm wafer size (8‟‟)
 Fused silica, Borofloat, Silicon and CaF2
 Refractive Microlenses: Spheres, aspheres
 Diffractive Optical Elements (16-level)
 Random diffusers, hybride Micro-Optics
 Double sided arrays, stops, coatings
 Wafer-Level Packaging, Bonding
 Master Lens Arrays for Replication and
Imprint Lithography
29 R. Voelkel, SUSS MicroOptics, „Wafer Scale Manufacturing“, World of Photonics, Panel, LASER„09, Munich, June 17, 2009

30. Micro-Optics Solutions
SEMI
 Semiconductor Technology Technology
18%
Divers
 Industrial Optics & Vision Research
9%
7%
 Healthcare & Life Science Metrology
7%
 Metrology Laser &
Health Care
& Life
Material Science
 Laser & Material Processing Processing
9%
28%
Information
 Information Technology Techn.
8%
Unwrapped phase / lambda Industrial
1 2 60 .7 7
Mean -0.10
RMS 0.34 Optics,
 Research P-V 2.94 Vision
14%
1 0 08 .6 2
0.72
7 5 6.4 6
0.13
y / no rm. rad iu s
Ph ase / lamb d a
-0.46
5 0 4.3 1
-1.04
-1.63
2 5 2.1 5
-2.22
0 .0 0
0.00 252.15 504.31 756.46 1008.62 1260.77
x / norm. radius
R. Voelkel, SUSS MicroOptics, „Wafer Scale Manufacturing“, World of Photonics, Panel, LASER„09, Munich, June 17, 2009
10.02.2005 Zeiss Diffusor 6101 HH, 10-02-05 RV
14:49:32 SUSS MicroOptics

31. Wafer-Based Manufacturing of Microlens Arrays (ROE)
 SUSS MicroOptics uses standard manufacturing technologies from
Semiconductor Industry, like resist coating, lithography, resist melting,
reactive ion etching, deposition, sputtering and lift-off
 Excellence in quality, array uniformity, and lateral dimension accuracy
R. Voelkel, SUSS MicroOptics, „Wafer Scale Manufacturing“, World of Photonics, Panel, LASER„09, Munich, June 17, 2009
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32. High-Quality Diffractive Optical Elements
 8„„ wafer scale
 Binary, 8-level, 16-level
 SiO2, B33, Si, CaF2
 0.5 μm min feature size
 < 50nm overlay accuracy
 190nm to 5µm wavelength
R. Voelkel, SUSS MicroOptics, „Wafer Scale Manufacturing“, World of Photonics, Panel, LASER„09, Munich, June 17, 2009
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33. Laser Beam Shaping and Homogenizing

34. Laser Beam Shaping
Excimer Flat-Top
Flat-Top (2D Flat-Top (1D) Spot-Generator Line-Generator Ablation (borosilicate)
R. Voelkel, SUSS MicroOptics, „Wafer Scale Manufacturing“, World of Photonics, Panel, LASER„09, Munich, June 17, 2009

35. Diffuser for Köhler Integrator
No diffuser Diffuser (rotating)
Uniformity: > 10 % Uniformity: << 5 %
Experiment: Laser Diode, 670 nm, condenser lens ƒFL = 40 mm
R. Voelkel, SUSS MicroOptics, „Wafer Scale Manufacturing“, World of Photonics, Panel, LASER„09, Munich, June 17, 2009
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36. SEM – Images of Diffusers
Ground Glass 10° E Diffuser (SMO) HT Diffuser 1° (SMO)
R. Voelkel, SUSS MicroOptics, „Wafer Scale Manufacturing“, World of Photonics, Panel, LASER„09, Munich, June 17, 2009
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37. Shaping of Random Diffusers
Ground Glass Diffuser 1  300 m 1  160 m 1  500 m
 2  100 m  2  70 m  2  160 m
Shaped Random Diffuser (2D)
R. Voelkel, SUSS MicroOptics, „Wafer Scale Manufacturing“, World of Photonics, Panel, LASER„09, Munich, June 17, 2009
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38. Improved Diffuser Plates (Fused Silica)
Encircled Energy
 Gauss, Super-Gauss, IFlat-Top, … 1
Rotational
 No zero order, sharp cut-off, nosymmetric
loss in large angles
Gaussian like
intensity HWHM
shape
>1.34 2.52°
Encircled Energy
1.23° °
-5 -4 -3 -2 -1 0 1 2 3 4 5
R. Voelkel, SUSS MicroOptics, „Wafer Scale Manufacturing“, World of Photonics, Panel, LASER„09, Munich, June 17, 2009
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39. Static 1D Random Diffuser
R. Voelkel, SUSS MicroOptics, „Wafer Scale Manufacturing“, World of Photonics, Panel, LASER„09, Munich, June 17, 2009
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40. MO-Optics: Customized Illumination
for SUSS Mask Aligner

41. MO-Optics – YIELD IMPROVEMENT
MO-Optics
 Better uniformity (± 2%)
 More light (up to 25%)
 Flexible illumination settings
 Higher resolution for proximity, steeper sidewalls
 Optimized illumination for specific mask pattern
R. Voelkel, SUSS MicroOptics, „Wafer Scale Manufacturing“, World of Photonics, Panel, LASER„09, Munich, June 17, 2009

42. Example: 480 µm Proximity GAP
 Aligner: MA150 @SMO, Angle Defining Element: Small Ring
 Proximity Gap: 480µm
 Photoresist: AZ 1.3µm dick (Silizium-Wafer)
20µm Lines & Spaces (MO-Optics, Ring) 20µm Vias (MO-Optics, Ring)
R. Voelkel, SUSS MicroOptics, „Wafer Scale Manufacturing“, World of Photonics, Panel, LASER„09, Munich, June 17, 2009

43. MO-Optics: Gray-Level with Customized Illumination
(Proximity Lithography at Fraunhofer IOF, Jena)
#2588 Malteser 0°IFP LV1.0 #2589 Ring IFP LV0.5 #2590 Malteser 45°IPF LV1.0 #2591 ohne Blende
R. Voelkel, SUSS MicroOptics, „Wafer Scale Manufacturing“, World of Photonics, Panel, LASER„09, Munich, June 17, 2009

44. Substrate Conformal Imprint Lithography
(SCIL)
Marc A. Verschuuren, Robert van de Laar, Hans van Sprang
Philips Research

45. 45

46. 46

47. 47

48. R. Voelkel, SUSS MicroOptics, „Wafer Scale Manufacturing“, World of Photonics, Panel, LASER„09, Munich, June 17, 2009
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49. Future: Light Sources and Collimation Optics
on Wafer-Level?

50. SUSS.
Our Solutions
Set Standards
SUSS MicroOptics www.suss.ch
SUSS MicroTec www.suss.com
R. Voelkel, SUSS MicroOptics, „Wafer Scale Manufacturing“, World of Photonics, Panel, LASER„09, Munich, June 17, 2009