The document discusses the history and development of micro-optics manufacturing from the 19th century to present day. Key developments include the use of microlenses in color photography in the 1920s, the application of semiconductor manufacturing techniques to micro-optics starting in the 1960s, and the current trend toward wafer-level micro-optics processing and packaging. SUSS MicroOptics is highlighted as a leading supplier of high-quality micro-optics manufactured using 8-inch wafer technology.
1. Wafer-Level Micro-Optics:
Trends in Manufacturing,
Testing and Packaging
Reinhard Voelkel, Kenneth J. Weible, Martin Eisner
SUSS MicroOptics SA, Neuchâtel, Switzerland
voelkel@suss.ch, www.suss.ch
SPIE 8169-12
2. SUSS MicroOptics – We Set The Standards
World leading supplier of high-quality Micro-Optics
More than 200 active customers
Part of the SUSS MicroTec Group (www.suss.com)
Neuchâtel, Switzerland
SUSS MicroOptics is “Preferred Supplier” for Carl Zeiss SMT
DUV Laser Beam Shaping Solutions for ASML Litho Stepper
4. Microscopy and photography
were the technology drivers.
Cameras and binoculars were the
first optical consumer products.
Micro-Optics was not an issue.
5. Gabriel Lippmann (1845 – 1921)
1891 Interference Color Photography
Wavelength-selective volume holograms
1908 Integral photography
Auto-stereoscopic method to display 3D
images for observation with the naked eye
1908 Nobel Prize
Source: www.wikipedia.org, www.google.com/patents
6. Walter R. Hess: Stereoscope Images
1912 Parallax Panoramagrams
Array of cylindrical microlenses for 3D displays
Working as a doctor (Ophthalmologist)
Nobel prize for Physiology
Source: www.google.com/patents
7. Microlens Arrays for Color Photography
1925 “Gaffered film” Paul Fournier
Microlens arrays on film to separate the color
US Patent 1,746,584,
Source: www.google.com/patents
9. Many Innovative Ideas for Micro-Optical Systems
US Patent 1762932, Mihalyi, Fly‘s Eye Condensor for Projector, 1927
US Patent 2018592, Arnulf, 1932 US 2351034 Garbor „Superlens“, 1940
Source: www.wikipedia.org, www.google.com/patents
11. Maurice Bonnet (1907 – 1994)
ww2.cnam.fr
Maurice Bonnet and the lathe used to
engrave lenticular screens for integral
photography*
*Photo: Coll. Michèle Bonnet from Michel Frizot, “Lenticular screen systems and Maurice Bonnet’s process”, from catalog
of exhibition “Paris in 3D” at Musée Carnavalet, ISBN: 1861541627 (2000)
Source: www.wikipedia.org
12. Jean Hoerni (1924 – 1997): “Planar Process”
1959 Fairchild
Semiconductor
Jean Hoerni at Fairchild
1963 First Karl Süss
Mask Aligner
Source: www.wikipedia.org, www.google.com/patents
16. Wafer: SEMI Standards
3-inch (76 mm)
4-inch (100 mm)
150 mm (referred to as "6 inch")
200 mm (referred to as "8 inch")
8’’ Wafer-Technology
300 mm (referred to as "12 inch")
Mask Aligner Coater Plasma Etch Wafer Bonder
17. PHOTORESIST PROCESSING
A thick resist layer
Photolithography
Resist cylinders
Melting at 150°C.
18. REACTIVE ION ETCHING
Reactive Ion Etching (RIE)
Profile shaping by changing etch ratio
Aspherical profiles with high precision
20. Aspherical Microlenses in Fused Silica
Asphere, conic constant k = -1
Comparison of measured lens profile (blue line) to ideal lens profile (dotted line) for
a microlens of 1.08mm lens diameter and 93µm sag height etched in Fused Silica.
21. Aspherical Microlenses in Fused Silica
Deviation of measured lens profile, expressed by a 12th degree polynomial fit, versus
the ideal lens profile. A deviation of 154.8nm (rms) from ideal lens profile is obtained.
23. High-Quality Diffractive Optical Elements (DOE)
8‘‘ wafer scale
190nm to 10µm wavelength range
0.5 μm min feature size
< 50nm overlay accuracy
Binary, 8-level, 16-level
Upto 98% diffraction efficiency
24. Hybrid Micro-Optics on Wafer-Level
Refractive Microlens Arrays
Diffractive Optical Elements (DOE)
Trenches, posts, grooves, holes
Full wafer-level integration
25. Hybrid Micro-Optics for Fiber Communication
Micro-Optical Fiber Coupler for communication industry
(ROADM, WSS, Transceiver...)
High-quality Micro-Optics for most competitive prices due to
8’’ wafer manufacturing
26. Packaging concepts for systems!
Wafer-Level Packaging (WLP)
Wafer-Level Camera (WLC)
Scheme: Patent WO 2007 030226
Source: Fraunhofer IOF (Jena), www.wikipedia.org, www.google.com/patents
28. Micro-Camera for CMOS imagers
Wafer-Level Packaging (WLC)
NanEye WLC Camera (Awaiba)
for disponible endoscopes
German Research Project COMIKA (2008-2011)
Source: COMIKA, www.awaiba.com
29. Ultra-Flat Cluster Cameras
WALORI (2002 – 2005)
?
Jacques W. Duparre, Peter Schreiber, Peter Dannberg, Toralf Scharf, Petri Pelli, Reinhard Voelkel, Hans-Peter Herzig and
Andreas Braeuer, "Artificial compound eyes: different concepts and their application for ultraflat image acquisition sensors",
Proc. SPIE 5346, 89 (2004); doi:10.1117/12.530208
Source: Fraunhofer IOF (Jena), www.wikipedia.org
34. AMALITH: Half-Tone Lithography
SUSS Mask Aligner MA6 T. Harzendorf, L. Stuerzebecher, U. Vogler, U.D. Zeitner, R. Voelkel,
“Half-tone proximity lithography”, Photonics Europe, Conf. on Micro-
+ MO Exposure Optics optics Fabrication Technologies, 7716-34, April 12-16, 2010
+ Customized Illumination
+ Half-tone photomask*
+ Proximity Litho, Gap 10µm
*Half-tone photomask (dot-size 450nm), E-Beam written
35. AMALITH: Blazed Gratings on Wafer-Level
T. Harzendorf, L. Stuerzebecher, U. Vogler, U.D. Zeitner, R. Voelkel,
“Half-tone proximity lithography”, Photonics Europe, Conf. on Micro-
optics Fabrication Technologies, 7716-34, April 12-16, 2010
36. Solutions for
Semiconductor Technology
Industrial Optics & Vision
Healthcare & Life Science
Metrology
Laser & Material Processing
Optical Communication
37. High-Quality MicroOptics in Wafer-Technology
Refractive (ROE)
Key Enabling Equipment
Technology Semiconductor,
Microlens Arrays Photolithography,
Fiber Coupler Illumination Systems
Diffractive (DOE) Communication
Telecom, Datacom, Fiber
Beam-Shaping Elements Optics, Transceiver,
Mode Scrambler Switches, Camera, MEMS
Packaging Optics, Life Science
Optical Instruments,
8’’ Wafer Technology
Confocal Microscopy,
Wafer-Level Packaging Healthcare, Laser Systems,
Pin-Holes, Crosses, Marks Sensors, Metrology
38. SUSS.
Our Solutions
Set Standards
SUSS MicroOptics SA
Rue Jaquet-Droz 7
CH-2000 Neuchâtel
Switzerland
Tel +41-32-720-5104
Fax +41-32-720-5713
info@suss.ch