Today flexible & printed electronics create a lot of hope. And a supply chain is being created to support an industrial infrastructure. In our report, we have identified and tracked the five main functionalities of flexible & printed electronics: displaying, sensing, lighting, energy generating and substrates.

1. RnRMarketResearch.com Offers “Flexible Applications Based on Printed Electronics
Technologies 2013 Report” Report US$7990 Single User License. The report got
published in May 2013 & Contain 200 Pages.
Combined flexible & printed electronic applications could reach US$1B in 2020. Multiple
applications are driving growth!
Technical Challenges Are Close To Being Overcome To Reach US $1B Market By 2020
Today flexible & printed electronics create a lot of hope. And a supply chain is being created to support
an industrial infrastructure. In our report, we have identified and tracked the five main functionalities of
flexible & printed electronics: displaying, sensing, lighting, energy generating and substrates. The
different degrees of freedom in flexibility that can be obtained can be divided into:
- Conformable substrate: the flexible substrate will be shaped in a definitive way after processing
- “Bendable” substrate: they can be rolled and bent many times (even if we consider it will not be a key
feature coming from customer needs)
- “Unused” flexibility: in the end, the flexibility is not an added value to the customer
We believe some applications will be more likely than other to be successful – for example, bendable
applications will undergo tough stress during use and technological challenges will be hard to overcome.
Our report shows the distinction between the functions (displaying lighting, energy conversion, sensing &
substrates) and the seek flexibility “degree of freedom”. We do not make the distinction in our report
between organic and inorganic substrates as semiconductors can also be used as flexible substrates.
Complete Report Copy @ http://www.rnrmarketresearch.com/flexible-applications-based-on-printed-
electronics-technologies-2013-report-market-report.html
Key Features Of The Report
- Flexible and printed electronics market forecast 2013 – 2020
- Application roadmaps & timelines
- Detailed manufacturing process flows
- Technical challenges
- Analyzed applications: displays, lighting, photovoltaics, sensing,substrates
- Polytronics & smart systems
However, we believe over the next several years, the number of applications using printing processes for
flexible electronics will grow.
We estimate the printed & flexible electronics market will grow from ~ $176M in 2013 to ~ $950M in 2020
with a 27% CAGR in market value. Printed OLED displays for large size (TVs) are likely to become the
largest market. For OLED lighting, we believe it will grow but remain a niche market for automotive and/
or office lighting. For PV, the market demand by 2020 will remain very low compared to the demand for
rigid PV, largely below 1% of the global market demand by 2020. Sensor, smart system & polytronic
applications will include sensors, touchless / touch screens, RFID applications.
A Wide, Exiciting Range Of New Application
Printed & flexible electronics is a new exiting technology with large potential market expectations. Indeed,

2. as semiconductors move to the very small with 22nm critical dimension, printed electronics moves to the
other end of the spectrum with its own material, equipment, process challenges and supply chain. Printed
electronics will not kill semiconductor electronics as it will not be a replacement for CMOS silicon.
However, it will create new industry segments and new classes of applications with unique features,
benefits and costs that cannot be addressed with conventional semiconductor electronics.
For example, we believe printing technologies will also allow additional properties such as flexibility.
Originally, the general vision for printed electronics was the possibility to print low cost electronic
components on any substrate. It was supposed to allow low cost, low efficiency, large volume electronics
manufacturing, and it was supposed to create a large multiplicity of applications. Flexible electronics
appeared quite soon after envisaging printability. Such devices were supposed to allow new applications
directly linked to flexibility.
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Moreover, the coming of polytronic technologies is a disruptive approach that could change the way
printed & flexible electronic devices will be manufactured. It can be considered a new alternative to the
“More Moore” approach where Si ICs, thin films, micro batteries, displays etc … will be embedded in a
flexible substrate. The global interest in polytronics is born from the difficulties faced by the flexible &
printed electronics industry. It is an alternate way to come to similar results while trying to avoid some of
the main challenges.
Manufacturing: Key Processing Choices Are Still To Be Made
We have identified strong technical challenges for the printed & fl exible electronics industry to overcome
if it is to be successful. Today it is still more technopush rather than market-pull. Printed and fl exible
electronics are still looking for high throughput, high resolution deposition techniques in order to become
suitable for other markets than just a few niche highend applications. For example, a big bottleneck is an
efficient barrier technology. Indeed, to be successful, the main technical challenge in the short term lies in
finding a good barrier technology: encapsulation materials are not so good on flexible substrates. Solution
printing process fl ow is composed of three main steps: ink/coating creation, deposition and curing. I nk c
hemistry i s a pplication d ependent, and various precursors can be used for the same application. The
nature of the ink / coating will define what kind of process can or cannot be used. For example, only inks
containing very thin particles can be used for inkjet printing (typically < 100nm particle for 1μm diameter
nozzles). In the same way, deposition methods induce specific requirements in terms of viscosity.
Deposition techniques vary, but most of them are not yet adapted to large volume, low cost printed
electronics. Thermal processing is required in order to crystallize the ink. Curing temperature and time are
critical factors for printed electronics manufacturing as organic materials are very sensitive to high
temperatures.
Companies Cited In The Report
3M, Add-Vision, AGC, AGFA, Air Products, Aixtron, Altadevices, Applied materials, Arjowiggins, Arkema,
Armor, Astron Flamm, Asys Solar, BASF, Beneq, Bosch, Boschmann, Cabot, Cambrios, Canatu, Canon,
Catrene, CEA LITEN, Central Standard Timing, Ceradrop, Ceres, Chimet, CIT, CNM, Creative Materials,
DEK, DisaSolar, DNP, DOW, Dupont, Dupont Teijin, Dyesol, Dynamic Organic Light, Eight 19, E-ink,
Elecon, EMPA, EnFuCell, enthone, Epson, EVG, evonik, Flisom, Fraunhofer, Fuji Film, G24i, GE,
GEM,Global Solar, Global Solar Energy Deutschland GmbH (GSED), Haiku Tech, HC Starck, Heliatek,
HelioVolt, Heraeus, HMI, Honeywell, IMEC, Inca Digital Printers, Infineon, Infinite Power solutions, Inkoa,
InkTec, ISET, ISORG, JRT, Konarka, Konica Minolta, Kovio, KUL, KWJ Engineering, LG, Liquavista,
LPKF, manroland, Markandy, MEMC, Merck, MiaSolé, Micro-tec, Mitsubishi Chemical, Monocrystal,
moserbaer, Nano ePrint, Nanoink, Nanomas, Nanosolar, NextInput, Novacentrix, NTC, Ntera, Nuon

3. Helianthos, Nuvosun, NVC, NXP, Odersun, Optomec, Optony, Ormecon, Ormet, Osram, Panasonic,
PEMCO, Pioneer, PixDro, Philips, Plastic Logic, Plextronics, Polymer Vision, Prelonic Technologies,
Prime View International, Rena, Rolith, SAES, Sakurai, Samsung, Schreiner, Showa Denko, Skiff,
Solarion, Solaronix, Sony, SouthWest Nanotechnologies, Sumitomo Chemical, Tianma, TNO, Toppan,
TU Delft, Unidym, UniSolar, Veeco, Verhaert, Vitex, Von Ardenne, Vorbeck Materials, VTT, Wageningen
University, Yotaphone
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