23. Solder Ball – refers to terminal. - it serves as a connection between the chip/die and the application board of the customer
24.
25.
26.
27.
28. 2. Deformed ball that reduces space between solder balls by more than 1/3 of its distance. 1/3
29. 3. Damaged ball that have crevices, cracks, or scratches exceeding 1/3 of the ball size.
30. 4. Damaged ball that have pressed area larger than half of the ball diameter.
31. Substrate - functions like a printed circuit board which has circuit patterns to form a connection with the chip/die
32. “ Bent tape greater than 0.2mm (0.008 inch) above or below the original position.”
33. Reject – Copper Traces Broken Accept – Copper Traces are in good condition
34. “ Broken tape exposing any pattern on the package bottom.”
35. Package – a container for die that provides external electrical and mechanical connection, heat removal, physical protection, environmental isolation, and distribution of power and signals
36. “ Package chips, gouges, and breaks that expose the pattern tape inside the package.”
37. “ Any package broken such that a part of the package can be moved or that allows an open path to the die, the wire or the circuit pattern area covered with the solder resist tape (substrate). Transverse cracks across the top surface of the package.”
38. “ Contaminated area greater than 10% (for BGA) or 5% (for FC) of the package surface.”
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