We sell from Lab Research models to full production Batch systems and Clusters with sputter down or sideways.

1. ConfidentialNovember 2008 1
Nordiko Technical Services Limited
500/550 Nest Business Park
Martin Road
Havant
Hampshire PO9 5TL
United Kingdom
Corporate
Member

2. Confidential 1
Location 50° 51’ 54.67”, 0° 58’ 15.49”
Nordiko Technical Services
Limited
Nest Business Park
500 m2 (5,380 ft2)
70 m2 (750 ft2) cleanroom

3. Confidential 2
Introduction
Nordiko Limited
Founded in 1972.
Sputtering - magnetron and RF diode sputtering.
Ion Beam technology - introduced in 1989.
First commercially available RF ion source.
Ion Beam Deposition.
Ion Beam Milling.
Nordiko Limited
Acquired by Shimadzu Corporation 1998.
Shimadzu decided to close Nordiko in 2003.
•Nordiko Technical Services Limited - May 2003.
• Acquired by Anelva Corporation - June 2005.
• Anelva 100% owned subsidiary of NEC.
• NEC sold Anelva to Canon - October 2005.
• Bought out Canon - October 2011.

4. Sputtering At
It’s Best
A company I used to work for has 4 Nordiko Sputtering
Systems and they are 10 years old at this point and being
used daily for manufacturing.
Darwin King
3
Confidential

5. Confidential 4September 2013
N2000 - Magnetron Electrodes
Features
Up to four confocal.
Magnet module not
immersed in water.
Available for
magnetic targets.
RF diode avaialble.

6. Confidential 5September 2013
N2000 Module
Features
Four 150 mm cathodes.
Central 200 mm rotary table, 20 rpm.
100 mm vertical travel.
Source to substrate separation
variable from 100 to 200 mm.
Options
RF, DC.
Co-sputtering.
Cooling.
Heating.
Magnetic field projection.
RF bias.
Turbomolecular pump, 1400
l.s-1.
Cryogenic pump, 1200 l.s-1.
WaterPump, 20000 l.s-1 for
H2O.

7. SPUTTERING
SYSTEMS
N2000 – Up to 4- 150mm (6”)
targets
N2500 – Up to 4 -250mm (10”) or 6-
150mm (6”) targets
8000 and 8500, Up to 4- 250mm
(10”) targets or 6- 200 mm (8”)
targets
9000 and 9500, Up to 4- 330 mm
(13”) targets or 6- 250 mm (10”)
targets
Targets can be RF Diode, RF
magnetron, DC magnetron or even
an Ion etch beam for substrate
cleaning.
Sputtering at it’s best, Nordiko’s,
2000, 2550, 5000, 8000, 8550,
9000 and 9550 are reliable and
long production machines.
6Confidential

8. With Magnetic Orientation No magnetic Orientation
7
The First Magnetic
Orientated Machine was
shipped in 1987.
Confidential

9. 8Confidential
Top Plate from a 9000 sputtering system. Two
sputtering targets and ion source.

10. Confidential 9
A top Plate for a 9000 system, two Al2O3 targets
and an ion source.

11. Confidential
10
Side view of table for the an 8000 unit.

12. Confidential 11
Chase area for a 9000 system.

13. Nordiko’s
Cluster tool,
Single wafer,
Rotating magnetron
sputtering
With
Loadlock!
12Confidential

14. Magnetic Orientated
No Magnetic
Orientation

15. 13
Confidential

16. Confidential 14
Random access vacuum cassette load lock/s.
Standard 25 wafer cassette.
Optical sensors for slide out detection.
Optical sensors for cassette mapping.
700 l.s-1 turbomolecular pump.
30 m3.hr-1 dry mechanical pump.
Combined vacuum gauge covering he range from
atmosphere to 1E-08 Torr.
VAT series 02.
VAT series 62 pipeline isolation valve.
Vacuum Cassette Load Lock

17. Confidential 15
Static cassette load lock.
Static four (4) wafer cassette.
Vertical travel of the transfer arm (35 mm) is used to pick
from four wafer slots within a static cassette.
Common vacuum environment to the robot transfer chamber.
No isolation valve between the load lock and the transfer
chamber.
700 l.s-1 turbomolecular pump.
28 m3.hr-1 dry mechanical pump.
Combined vacuum gauge covering he range from
atmosphere to 1E-08 Torr.
VAT series 02.
VAT series 62 pipeline isolation valve.
Ideal for research applications where small batches are often
processed
Vacuum Load Lock - Static Cassette

18. Confidential 16
Transfer Chamber
Transfer chamber.
Six port or Eight port.
Six port; two load ports and four
process ports.
Eight port; two load ports and six
process ports.
Optical sensors for wafer
tracking.
700 l.s-1 turbomolecular pump.
30 m3.hr-1 dry mechanical pump.
Three axis robot.
SCARA style - single end
effector.
Rotary vacuum seal, magnet
fluid feedthrough.
Z-axis seal, edge welded
bellows.
Aligner.
Optical CCD aligner.
Operates in concert with the robot.
Wafer centre alignment ±0.25 mm.
Angular alignment ±0.1 degree.

19. Control Automation System
Features
System is not a PLC.
• Modular computer with industrial I/O.
• Intel micro-processor.
• OS is Windows CE.
• HMI on a separate PC.
Installations
Fourteen installations.
• Three new systems +.
• Eleven field retro-fits.
• Ten in USA.
• One in Japan.
⎬production tools.
Confidential 1719

20. Control Automation System
Confidential
18
Features
CPU - only Ethernet &
COM1 ports.
• No video, no keyboard,
no mouse.
• Networked PC for user
interface, HMI.
• Flash storage, no
rotating hard disc.
• Low power CMOS - no
fans.
• Serial, digital & analogue
I/O modules.
• No back-plane - I/O
modules build the bus.
• Intelligent
Instrumentation.