Brazilian Semiconductor Scenario and Opportunites

1. Brazilian
Semiconductor
Scenario
and
Opportuni3es
Jacobus
W.
Swart
Imec,
Leuven,
Belgium
and
UNICAMP,
Campinas,
Brazil

2. Outline
1. Introduc3on
2. Main
Actors
1. Universi3es,
Ins3tutes,
INCT’s
2. IC
Design
Houses
3. Semiconductor
Fabs
4. Value
Chain
Services
3. Government
Support
4. The
ASIC
Ecosystem
for
Innova3on
5. Imec
IC-­‐Link
6. Conclusions
2

3. 1.
Indroduc3on
• Brazil
-­‐
a
fast
adopter:
• R&D
at
ITA
and
USP
in
the
50’s
• First
plant
by
Philco
in
São
Paulo
for
diodes
and
transistors
in
the
60’s
• Many
back-­‐end
plants
for
discrete
devices
a]er
the
60’s
• Microelectronics
Labs:
• LME/USP
–
end
of
60’s
• In
the
70’s:
LED
and
LPD
at
UNICAMP
and
CPqD
• Industries
in
the
80’s:
• Discrete
devices:
Semikron,
Aegis,
Icotron
+
many
back-­‐end’s
• IC’s:
SID
Microeletrônica
(front-­‐end,
back-­‐end,
Design),
Itaucom
(back-­‐end,
Design),
Elebra
(Design)
3

4. ROM 2 k Bit, 1978, nMOS (LME, EPUSP)

5. 90’s
• Opening
of
boarders
for
import
• Deindustrializa3on
started
• Increasing
electronics
trade
deficit
• But
con3nuous
R&D
at
academy.
5

6. 2000’s
• New
industrial
policies
• New
lows
and
incen3ves
• Airac3on
of
new
industries:
front-­‐end
and
back-­‐
end
• IC
Brazil
program:
DH’s
and
training
6

7. 2.
Main
Actors
1. Universi3es,
Ins3tutes,
INCT’s
2. IC
Design
Houses
3. Semiconductor
Fabs
4. Value
Chain
Services
7

8. 2.
Main
Actors
–
Universi3es
&
Ins3tutes
• Fabrica3on:
Materials
and
Processes
– Silicon
based:
USP,
UNICAMP,
UFRGS,
UFPE
– III-­‐V
based:
USP,
UNICAMP,
PUC-­‐RJ,
UFMG
– Ins3tutes:
CBPF,
CETENE,
CTI,
INPE
and
LNNano
• IC
Design
and
EDA
tool:
– FEI,
ITA,
PUC-­‐RS,
UFAM,
UFCG,
UFMG,
UFPE,
UFPel,
UFPB,
UFPR,
UFRGN,
UFRGS,
UFRJ,
UFSC,
UFSM,
UnB,
UNESP,
UNICAMP,
UNIFEI,
UNIPampa,
Univali,
USP
• Photonic
IC
– ITA,
CTI,
UNICAMP,
USP
and
others
8

9. Centro
de
Componentes
Semicondutores
–
UNICAMP
(
www.ccs.unicamp.br)
Gap
120
nm
With
resonant
frequency
of
1.55
µm
Without
resonant
frequency

10. • control
separately
ion
energy
(RF
power)
and
ion
flux
(µW
power).
• operate
at
low
pressure
(1-­‐100
mTorr)
⇒
reduce
ion
surface
spuiering
• A
2.45GHz
µW
source
generates
the
plasma
at
high
power
• A
13.56
MHz
RF
power
source
biases
separately
the
sample
chuck.
ECR
(Electron
Cyclotron
Resonance)
ECR
System

11.
E-­‐beam
lithography
Electron
Lithography
within
10
nm
resolu3on;
Nano
photonics;
NanoFETs
Centro
de
Componentes
Semicondutores
–
UNICAMP
(
www.ccs.unicamp.br)

12. 2.1
Main
Actors
–
INCT
networks
• INCT
NAMITEC
– 124
researches,
23
ins3tu3ons
– Silicon
micro
and
nanoelectronics
systems
– Concluded
degrees
(6.5
years):
120
PhD,
300
MSc
– 600
papers
ISI
journals,
1500
papers
at
conferences
• INCT
DISSE
– 12
researchers,
8
ins3tu3ons
– III-­‐V
semiconductor
devices
• INCT
INEO
– 42
researchers,
26
ins3tu3ons
– Organic
electronics
&
optoelectronics
• FOTONICOM
12

13. 2.2
Main
Actors
–
IC
Design
Houses
Ins2tu2on
Aprox
number
of
Designers
Loca2on
CEITEC
70
Porto
Alegre
CETENE
20
Recife
Chipus
25
Florianópolis
CIMATEC/Senai
Salvador
CPqD
30
Campinas
CTI
30
Campinas
DFChip
10
Brasília
Eldorado
50
Campinas
Idea!
12
Campinas
LSITec
40
São
Paulo
NXP
145
Campinas
SiliconReef
10
Recife
Unitec
60
Ribeirão
das
Neves
Von
Braun
20
Campinas
13

14. 2.2
Main
Actors
–
Training
Centers
• One
year
intense
training
program
–
based
on
Cadence
material
and
tools.
• One
year
on
the
job
training
• Support
by
MCTI
through
CNPq
and
FINEP
• Two
training
centers:
– CT1
at
UFRGS,
Porto
Alegre
– CT3
at
USP,
São
Paulo.
• Now
in
danger
due
to
lack
of
budget.
14

15. 2.3
Main
Actors
–
Semiconductor
Fabs
Company
Ac2vity
Loca2on
BrPhotonics
Photonic
IC’s
Campinas
CEITEC
SA
Front-­‐end
CMOS
+
Fabless
Porto
Alegre
HTMicron
Back-­‐end
memories
São
Leopoldo
Mul3laser
Back-­‐end
memories
Extrema
Semikron
Power
discrete
devices
Carapicuiba
Smart
Back-­‐end
memories
A3baia
SUNEW
OPV
Belo
Horizonte
Unitec
Front-­‐end
CMOS
Ribeirão
das
Neves
15

16. 2.4
Main
Actors
–
Value
Chain
Aggregators
• Imec
Representa3ve
Office
Brazil
–
access
to
foundries,
packaging,
tes3ng,
logis3cs,
consultancy,
training
• FastCompany
Brazil
–
represent
ARM
and
Synopsys.
• Other
providers
of
services:
– directly
abroad
16

17. 3.
Governmental
Support
• Incen3ves
lows:
– PADIS
– Informa3cs
Low
– Lei
do
Bem
– Portaria
950
• Project
funds,
loans
and
equi3es:
– BNDES,
BNDESPar
– FINEP
– FAPESP:
PIPE
and
PITE
programs
– FUNTELL
and
other
agencies.
– Embrapii
17

18. 4.
The
ASIC
Ecosystem
for
Innova3on
18

19. ASICs
–
Applica3on
Specific
IC’s
• ASICs
are
needed
in
many
applica3ons
:
– High
volumes
(consumer)
– Portability
(medical,
consumer,
...)
– Large
SoC
– Mixed
Signal
ICs
– Low
Power
(Baiery
applica3ons)
– Sensor
applica3ons
– IoT
– Confiden3ality
– ....
Those
applica3ons
where
unit
cost
is
not
an
issue
at
low
volumes,
ex.
High-­‐end
servers,
high
performance
computers,
space,
...
19

20. Use
of
FPGA
vs
ASIC
• Economical
only
for
few
thousands
of
units
• Technical
solu3on
only
if
power
and
size
is
no
concern.
20

21. Use
of
ASSP
vs
ASIC
• Semiconductor
market
numbers
2012
• Brazil:
product
development
mainly
with
ASSP
• Great
opportunity
and
importance
for
ASIC
for
similar
to
interna3onal
innova3on
level
21
Semiconductor
Market
2012
World
US$
Bi1
%
Brazil
US$
Bi2
Total
299,9
100
5,1
ASSP
83,7
28
~x
ASIC
21,3
7,1
~0,0x
ASIC/ASSP
ra3o
0,25
25
~
0
1
Gartner
2
ABINEE
+
MDIC

22. Up-­‐coming
revolu3on:
power
consump3on
dilemma!!!
• Mobile
products
• Dependence
on
power
harves3ng
sources
• Need
for
very
low
power
ASICs
(FPGA
are
not
viable
and
ASSP
are
not
op3mized
for
each
case)
• Need
for
large
quan3ty
of
skilled
IC
designers
• Educa3on,
training
programs
and
MPW
access
is
essen3al
to
par3cipate
and
be
successful.
22

23. 23
Consumer,
compu3ng,
telecom
and
mobile
have
driven
semiconductor
usage
In
terms
of
volume,
they
s3ll
do
today
Market
Evolu3on

24. 24
Innova3on
was
driven
mainly
by
large
companies
SMEs
in
suppor3ng
mode

25. 25
Security,
Medical
&
Wearables,
Smart
Home,
Smart
Car,
Vision,
Industrial,
and
….
IoT
The
new
growth
markets
Segmenta3on
and
differen3a3on

26. 26
Very
difficult
to
navigate
for
large
companies
Playground
for
many
SMEs

27. 27
“Innova.on
is
usually
with
people
who
are
small
and
gi9ed
with
a
good
idea.”
Chris
Neil,
Maxim
Senior
Vice
President,
Industrial
and
Medical
Solu.ons
Group
• Innova3on
in
this
new
and
segmented
market
is
diverse
• Change
occurs
through
collec3ve
interac3on
• SME’s
apply
collabora3ve
research,
and
find
crea3ve
funding
methods
• We
observe
a
strong
2011-­‐2015
increase
in
ASIC
demand
by
SMEs,
reversing
a
decade
long
decline
• Differen3a3on
and
IP
protec3on
provided
by
ASICs
are
main
incen3ves
• “Substream
Innova2on”
is
the
collec3ve
SME
innova3on
ac3vity

28. 28
Observing substream
flows
Radio
access
Automo2ve
Datacom
Connected
home
Imaging
&
Vision
Systems
Security
Innovation
Domains
Medical
&
Wearables
Industrial

29. 29
RF
design
complexity
BB
design
complexity
.6
11ac
11ah
-­‐MTC
2G
3G
11ad
11n
Playground for SME’s
Radio
access

30. Micro
projector
Drones
BSI
X
ray
Strong center of vision expertise around Leuven
Touchless
interac3on
Video
processor
unit
IP
camera
Hyperspectral
Imaging andVision
Systems

31. 31
Medical &
Wearables
… many of them
developed by
SME’s
From
“hearing aids”
to a myriad
of devices

32. ULP
radios,
and
ULP
design
technology
for
baiery
operated
wearables
32
Medical &
Wearables
(UK)
(F, HKG)
(NL)
(I)

33. 33
Industrial
Connected home
Source : Greenpeak, at GSA Munich 2014
Many
technologies
and
more
emerging
Technology
in
essence
“not
yet”
affordable
but….
25$ ultimate
IoT module

34. 34
Industrial
Industrial
Li-­‐Fi
Vehicle
M2M
Agricultural
surveillance
Shelf
tag
labels
Localiza3on
Livestock
Management
Smart
shopping
cart

35. 35
How can European SMEs
be succesful?
Suppliers
FOUNDRIES
EDA
ASSEMBLY
TEST
IP
PBA/PCB
Large
system
companies
Local
market
IDM
Plessey,
Philips,
Siemens,
Nokia,
...
300
SMEs

36. Government
support
• Financial
s3mula3on
to
innovate
• Support
training
of
good
engineers
at
academia,
R&D
centers,
design
houses,
SMEs
• Easy
and
affordable
access
to
CAD
tools
and
IC
prototyping
• Create
VC
friendly
climate
to
create
SMEs
36
How can European SMEs
be succesful?
300
SMEs
Suppliers
FOUNDRIES
EDA
ASSEMBLY
TEST
IP
PBA/PCB
Design
houses
&
IP
houses
Large
system
companies
Local
market
WORLD
MARKET

37. 5.
Imec
IC-­‐LINK
– ASIC
services
• MPW
and
assembly
services
to
universi3es
and
companies
(called
“Europrac3ce”)
• Access
to
TSMC
technologies
for
prototyping
and
volume
produc3on
through
VCA
partnership
with
TSMC
• Prototyping
and
volume
:
Assembly
and
Test
– Design
services
• RTL
or
netlist
to
GDS2
place
and
route
–
physical
design
– Over
500
IC
tape-­‐outs
per
year
– PBA
services,
failure
analysis
and
packaging
design
– Integrated
photonic
solu3ons
(wafers
&
packaging)
– First
ac3vi3es
in
1984
37

38. Imec
IC-­‐link
-­‐
The
team
• 80
(now
95)
people
team
of
business
developers,
logis3c
wizards
consultants
and
technical
support
experts
– 25
in
ASIC
prototyping
and
manufacturing
services
– 25
in
ASIC
design
services
– 12
in
assembly,
test
and
qualifica3on
– 10
in
business
development
and
technology
consultancy
– 8
in
PCB/PBA
services,
failure
analysis
and
advanced
packaging
design
38

39. What
our
customers
typically
need
– Access
to
leading
edge
technology
at
affordable
cost
– Prototyping
with
MPW
and
MLM
– Advise
in
technology
selec3on
– Flexibility
in
business
model
:
from
COT
to
FTK
– Logis3cs
and
opera3on
support
– Assembly,
test
and
cer3fica3on
services
– Trusted
supply
chain
partner
– PCB/PBA
technology
and
design
know
how
– Access
to
leading
edge
IP
39

40. 40
IC-­‐link
as
service
provider
Funding associations

41. Foundries
and
IC
Technologies
IHP
(Germany)
IHP
SGB25V
0.25µ
SiGe:C
IHP
SGB25VGOD
0.25µ
SiGe:C
IHP
SG25H1
0.25µ
SiGe:C
IHP
SG25H3P
0.25µ
complementary
SiGe:C
IHP
SG25H3
0.25µ
SiGe:C
IHP
SG13B
SiGe:C
Bipolar/Analog
IHP
SG13S
SiGe:C
Bipolar/Analog/CMOS
IHP
SG13C
SiGe:C
CMOS
7M/MIM
ON
Semi
(Belgium
+
USA)
0.7µ
CMOS
A/D
2M
0.5µ
CMOS
A/D
3M
0.35µ
CMOS
A/D
5M
0.7µ
CMOS
A/D
I2T100
0.7µ
CMOS
A/D
I2T30
0.35µ
CMOS
A/D
I3T80/50/25
0.5µ
CMOS
C5
EEPROM
0.8µ
CMOS
A/D
0.6µ
CMOS
A/D
3M
0.35µ
CMOS
A/D
4M
0.8µ
CMOS
50V
0.35µ
SiGe
BiCMOS
4M
0.35µ
CMOS
50V
0.35µ
CMOS
OPTO
0.18µ
CMOS
+
HV
ams
(Austria)
TSMC
(Taiwan)
0.25µ
CMOS
L/MS/RF
0.18µ
CMOS
L/MS/RF
0.13µ
CMOS
L/MS/RF
90nm
CMOS
L/MS/RF
65nm
CMOS
L/MS/RF
40nm
CMOS
L/MS/RF
UMC
(Taiwan)
0.25µ
CMOS
L/MMC/RF
0.18µ
CMOS
L/MMC/RF
0.13µ
CMOS
L/MMC/RF
90nm
CMOS
L/MMC/RF
65nm
CMOS
L/MMC/RF
CIS
:
0.18µ
ARM/Ar3san
(USA)
Cell
libraries
and
design
kits
for
TSMC
and
UMC
technologies
Faraday
(Taiwan)
Cell
libraries
and
design
kits
for
UMC
0.25,
0.18,
0.13µ,
0.11µ,
90nm
&
65nm
CMOS
Selec3on
criteria
Well-­‐known
foundry
Partnership
Flexible
prototyping
Small
+
medium
volume

42. Silicon
photonics,
MEMS
Foundries
Si310-PH
PiezoMUMPs
MetalMUMPs
SOIMUMPs
PolyMUMPs
Si substrate
WaveGuide
SiO2
Si
FiberCoupler
PSV
ISIPP25G+
SG25_PIC

43. 43
High speed photonics

44. Low
volume
access
at
affordable
cost
Prototypingcost
Launch flexibility
1
~0.8
~0.1
~0.025
Full
Mask
Size : ~ 20x30 mm
Any time
MPW
Size : per sqmm
MPW schedule
mini
Size : per subblock
Selected runs from MPW schedule
MPW
MPW
MPW
MPW
MPW
mini
mini
MPW
Size : ~ 10x15 mm
Any time
MLM
MLM
Source :TSMC

45. Schema2c
Driven
Layout
Layout
Device
Models
GDS
Electrical
simula2on
EM
simula2on
Process
varia2on
simula2on
Electro-­‐Op2cal
simula2on
LVS
DRC
LFD
Op2cal
proximity
correc2on
Silicon
Thickness
(nm)
PROCESS
DESIGN
KIT:
PDK

46. IP
por|olio
• TSMC
IP
por|olio
– Std
cells,
IOs,
memory
compilers,
PLL,
PHY’s,
...
– Can
be
requested
in
TSMC
online
– Either
free
or
under
license
agreement
• Imec
IP
– State
of
the
art
IP
– Ranging
from
system
IP
to
advanced
building
blocks,
e.g.
• So]ware
Defined
Radio
IP
• Low
power
ADC
– Various
process
technologies
including
state
of
the
art
– Deliveries
and
business
models
tuned
to
your
need
• 3rd
party
IP
– Preferred
pricing
for
some
3rd
party
IP
providers
46

47. Assembly
services
– Access
to
best
in
class
packaging
houses
• Prototypes
• Produc3on
volumes
– Imec
team
of
assembly
specialists
• Selec3on,
customiza3on
of
package,
simula3ons,
...
– Wide
range
of
produc3on
and
prototype
packages
• Plas3c
and
ceramic
• Open
tool:
QFN,
aQFN
(Mul3
row),
QFP,
CQFP,
...
• Customized
packaged:
xxBGA,
WLCSP,
aWLP,
...
47

48. Test
and
qualifica3on
– Test
hardware
and
so]ware
development
– Debugging
and
characteriza3on
– Qualifica3on
&
Failure
analysis
– Produc3on
volume
tes3ng
– Yield
op3miza3on
– Near-­‐sourcing
for
efficient
test
program
development
and
small
volumes
produc3on
:
– Global
partners
for
high
volume
projects
:
– Qualifica3on
experience
mainly
in
Aerospace
[ESCC9000,
ESCC2269000],
Industrial
and
Medical
48

49. Test
facility
and
capabili3es
49
Hatina
Teradyne Microflex Quad Site
Teradyne I-flex Teradyne J750

50. 50
Broaden
your
mind
Strengthen
your
skills
discover
our
por|olio
@
www.imecacademy.be
CMOS
Process steps
Packaging & 3D
Memories
Microsystems & MEMS
Materials
Modeling
Characterization &
reliability
Photonics
Beyond CMOS
Digital design
Analog & RF
Electronics design &
manufacturing
Modeling of circuits &
systems
Energy
Biomedical systems
Vision systems
Wireless systems
Sensor systems
Large Area Electronics
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Electronics design &
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Modeling of circuits &
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Biomedical systems
Vision systems
Wireless systems
Sensor systems
Large Area Electronics

51. ▸ Established
in
1984
▸ Largest
independent
R&D
ins3tute
in
Europe
▸ Total
2015
revenue
of
415
M€
▸ >
2400
people
▸ published
998
prominent
scien3fic
papers
▸ filed
a
record
number
of
180
European
patents
IMEC
51

52. Office
USA
San
Francisco
Belgium
Leuven
The
Netherlands
Eindhoven
China
Shanghai
Office
Japan
Tokyo
Taiwan
Hsinchu
India
Bangalore
Worldwide
presence
Office
Brazil
Campinas
52

53. IMEC
ac3vi3es
53
MEMS, Sensors,
Photonics
HETEROGENEOUS
INTEGRATION
Lithography Devices Interconnects
CORE CMOS FLEXIBLE
ELECTRONICS
INTERNET OF
HEALTHYTHINGS
BAN
Life sciences
INTERNET OF
POWER
Photovoltaics
Power devices
INTERNET OF
THINGS
Sensing &
connectivity solutions
INDUSTRIALISATION
FOUNDRY ACCESS TO
>300 SMEs AND >700
ACADEMIA
TAPES-OUT MORE
THAN 500 IC DESIGNS
PERYEAR
Imec
IC-link

54. 6.
Conclusions
• A
considerable
semiconductor
ecosystem
has
developed
in
Brazil.
• Governmental
industrial
policies
and
incen3ves
are
of
paramount
importance
for
the
deployment
of
the
semiconductor
sector.
• The
new
uprising
markets
offer
great
opportunity
for
development
of
new
components
and
products
for
Brazilian
enterprises,
also
SME’s.
• Access
to
interna3onal
broad
range
of
technologies
and
services
are
needed
to
fulfill
the
needs
for
innova3ve
and
compe33ve
products.
54

55. • Contacts:
– jacobus.swart@imec.be,
– jacobus@fee.unicamp.br
• Sorry
for
possible
mistakes
and/or
omissions.
• Acknowledgment
to
Carl
Das
and
Paul
Malisse
from
IMEC
for
sharing
some
slides
55