1. SMARC™
The new standard for Computer
On Modules (COM) based on
ARM architecture
Dov Shalev
Kontron Israel
1/5/13

2. May 1, 2013
- 2
COM Market 2011 - 2016
• COMs YoY growth is 20%-25%
• Expected YoY growth for ARM is 25%+
• Why?
• ARM CPU cost 2x-3x less than x86
• ARM processing capability has begun to catch up with x86 apps
• Mobility, longer battery life and lower profile
• IMS Research projects that 40% of COMs applications will be ARM based by 2016
Source:
IMS Research 2012
2011 2016

3. May 1, 2013
- 3
beyond x86
ARM Computer-on-Modules
Positioning
Positioning
February 2013

4. May 1, 2013
- 4
Parallel TFT display bus
MIPI display interface
Camera interfaces
Multiple SPI links
Multiple SDIO interfaces
Serial ports
Many USB (8 lanes)
Lots of PCI Express (6 lanes)
PCI Express graphics (16 lanes)
LPC (an x86 only bus)
…..and more
Key Feature DifferencesARM+
X86+
Designed for mobility
ARM COM Designs requires fewer pins and lower cost power circuitry

5. May 1, 2013
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• ARM processors are powerful enough to drive a graphical user
interface at very low power consumption, (Smartphone, Tablet)
• ARM delivers exceptional performance/watt ratio
– No bulky thermal solution
• Extreme low power consumption at operation (<2W)
– ARM better serves Ultra Low-Power market requirements
• Extended temperature selections available
• SOC performance with dual/quad core is comparable with ATOM range
– ARM will not replace Intel x86 technology. Rather, it reaches segments that are
currently underserved relative to ARM
• Longevity up to 15 years
ARM Positioning

6. May 1, 2013
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Market Trends for ARM based Module
• Technical trends:
– PCIe
– GbE
– Multicore
• Make Vs. Buy trends:
– Declining of OEM resources
– TTM is getting short
– Increasing Silicon “Complexity”

7. May 1, 2013
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SGETSMARC™
standardized through SGET
SGET
February 2013

8. May 1, 2013
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Standardization Group for Embedded
Technologies (SGET)
• Manufacturer-independent institution (no Intel, AMD, Tyco etc.)
• A new COMs standard incorporating ARM technology
– Form factor
– Optimized pinout
– Alternative solution to x86 based COM apps
• Ecosystem support
• Layers of support to enable complete solution

9. May 1, 2013
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SGET Founding Members - May 2012
Kontron, ADLINK, Advantech, B-plus, Congatec, Data Module, EEPD,
F&S, Fortec, Hectronic, Heitec, IES, Iwavesystems, Micro Consult, MSC,
next System, publish-industry, Seco, speicherguide.de, TQ Group,
www.sget.org

10. May 1, 2013
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• Mobile / Portable application requirements
– Enclosure constraints
– Thermal limits
– Power / battery life
• Features not typically found on COM Express
– MIPI I/F
– Camera I/F
– Multiple SPI and SDIO
• COM Express is optimized for x86 features
– Many USB
– Multiple PCI Express
– PEG graphics support
Why a New Form Factor?
SMARC compared with COM Express
SMARC Requires fewer pins and lower cost power circuitry

11. May 1, 2013
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5.7 mm
1.5 mm
Why a New Form Factor?
• Ultra Low-Power-COM meets application needs
– Enclosure constraints
• Limited x, y & z dimensions
– Small surface area 41 cm2
– Height < 6mm – top and bottom
– Well matched with SOC silicon
– Connector style enables low profile insertion
– Thermal limits
• < 5W TDP - eliminate need for thermal solution
– Shock & Vibration
• Connector is approved for Automotive
MXM3.0 connector

12. May 1, 2013
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New COM Standard: SMARC
Scalability via two form factors

13. May 1, 2013
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New COM Standard
Low Power Embedded Architecture Platform
• MXM 3.0 gold-finger-card-edge connector
– 314 total pins available
– Low profile options available
– Used in high end laptops
– Allows durable, slim designs
– Shock-/vibration proof option for automotive applications

14. May 1, 2013
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Kontron SMARC™ Architecture -
Supported Interfaces
February 2013

15. May 1, 2013
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User Requirement
GUI / User Interface
Application
Operating System
Driver (own/3rd party)
Interfacerequirements
Productrequirements
sizeLCD
USB
ETN
COMMs
Voltage
shape
color
certifications
regulatory
Firmware (Bootloader/BIOS)
Hardware
The product - Layer Model

16. May 1, 2013
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Embedded Operating System support

17. May 1, 2013
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• SMARC-sAT30
– nVidia Tegra 3 Quad Core 1.2 GHz ARM Cortex A9
– 1GB memory down
– HD encode/decode MPEG2, dual GPU
– < 3,5 W TDP, Commercial temp 0°C to 60°C
– Medical, Energy, Infotainment , Transportation
• SMARC-sA3874i
– Ti AM3874 Single Core ARM Cortex-A8 processor 800MHz/1GHz
– 1GB memory down, PCIe2 w/ integrated PHY
– 2 W TDP, Industrial Temp -40°C to +85°C
– Low cost when Graphics is needed. Harsh environments
• SMARC-sAMX6i
– Freescale i.MX6 Single – Dual - Quad Core ARM Cortex-A9 processor
– Full HD 1080P encode/decode, single and dual display support
– On chip LAN and PCIe to connect to external modem, WiFi
– Industrial Temp -40°C to +85°C
– Communications, Military, Industrial, Graphic application
SMARC™ Product examples

18. www.kontron.com
Munich/Eching Kaufbeuren Deggendorf San Diego Columbia Fremont Montreal Beijing Penang Sydney
Bangalore Moscow Warsaw Kiev Tel Aviv Liberec/Pilsen Chichester Copenhagen Brussels Toulon Solothurn
Thank you
for your attention