With the recent development of improved 3D imaging, ARP’s terahertz scanner is now capable of “seeing” inside of wafers and image defects. Thus, in addition to quantifying the defect size, one is also able to visualize the defects on the nanometer scale.

1. Demonstration of sub-surface
3-D imaging capability
Applied Research & Photonics, Inc.
470 Friendship Road, Suite 10
Harrisburg, PA 17111, USA
http://arphotonics.net/
Phone: +1-717-220-1003
Email: info@arphotonics.net

2. Demonstration of sub-surface 3-D
imaging capability
With the recent development of improved 3D
imaging, ARP’s terahertz scanner is now
capable of “seeing” inside of wafers and other
opaque substrates. A scanning image is
generated pinpointing location and size of
particulate, void, and other defects. In
addition, defect size is quantified by to-the-
scale direct measurements. It can also
visualize the defects on the nanometer scale.

3. Snap shot of patterns on a wafer
Scanned surface image of a wafer. Total scan length is ~5 µm.

4. 360° inside view of the object
360° view of a wafer. Color contrast represents objects of different size and material.

5. Scanner details
• The terahertz sub-surface scanner from ARP
is a user friendly, easy to use machine.
• All operations are automated via included
software.
• The machine exhibits an unprecedented
resolution of a few nanometers in 3 axial
directions.
• Yet scanning is fast

6. Scanner details (contd.)
• Screen shot of measurement console
shown in the next slide.
• All parameters are entered by the front-
end interface.
• Measured data are accessible for further
manipulations.

7. Measurement Console
Screen shot of measurement console. All parameters are entered
via the front-end. Data are easily accessible.

8. Contact information
For more information, please contact:
Anis Rahman, PhD
email: info@arphotonics.net
Phone: 717-623-8201