1. Company Presentation
the
the bright side of light

2. The first LED manufacturer with production center
entirely based in Europe!
 Octa Light Bulgaria was established in 2010 as
a research and manufacturing center for Light
Emitting Diodes (LED) located in Bulgaria.
 The company shareholders are Monbat AD -
51% and Octagon International EOOD - 49 %.
 Octa Light has a state-of-the-art production
site, including 4500 sq. m production area,
laboratories, clean rooms and lighting-fixtures
and retrofit lamps manufacturing areas.
 The company posseses own patents and know-
how, as a result of long year studies and
experimental activities, now successfully
applied in the manufacture of LEDs, lighting
fixtures and complete lighting systems.

3. Octa Light is completely vertically integrated
producer of:
 Light Emitting Diodes for today’s wide range of
lighting applications including: powerful high-
brightness LED, last generation of low-power &
high-power SMT LEDs, COB and LED modules;
 OEM & ODM supply of LEDs, modules and
components,
 LED luminaires for all types of lighting
applications – interior, exterior, industrial, street
lighting.
 LED retrofit lamps – bulbs and T8 tubes.
 Lighting design, measurement, audits,
comprehensive engineering solutions and
installation.
 The company offers Electronic s Manufacturing
Services through its most modern production
capacity for PCB Assembly.
Company Portfolio

4. Milestones – LED Production
High power High
brightness LEDS RND
activities
201520142013201220112010
Facility startup
- Die bonding,
- wire bonding,
- Encapsulation
modeling and
lifetime test
facilities
BULLSTAR LEDS
LM80 certification
1W and 3W BULLSTAR
LEDS full scale production
-BST LEDs
Start of RND
activities for SMD
LED products
Full product range
insertion start of SMD
LEDs and mass
production
-X1M
-X2M
-X3M
-X5M
-X7M
-MG
-MC
-TG
-T
Start of RND
activities on PLCC
products
Full product range
insertion of PLCC LEDs
-5730
-5630
-3528
-5050
-RGB PLCC series
Factory
production
capacity
expansion
RND on
specialized
Bullstar LEDs
SERIES
Full product range insertion of specialized Bullstar LEDs
-Ultra high efficiency BLV – 150 lm/W 3 W packages
- AC Series Bullstar LEDS – direct 110V AC 60Hz
- AC Series Bullstar – Direct 230 V AC 50Hz
- UVA/UVB/UVC Bullstar LEDs
- Infrared and Deep infrared Bullstar LED
R&D activities on >
200 lm/W LED
packages
R&D activities on <
0.0004 USD/LM
LEDs
SMD, PLCC and
COB products
LM80
certification
Start of RND
activities on COB
products
Implementation of innovative
encapsulation technologies
- Optic free LEDs
- Innovative SMD LED
substrates
- Innovative COB substrates
- Laser technology
implementation
Full product range
insertion of COB Products
and mass production
- C1F – 10W
- C1R – 6 W
- C2F – 25 W
- C2R – 12 W
- C3F – 50 W
- C5F - 100 W
- AC COBS

5. • Own production area, 4500 m2 main facility, 20 000 m2 total area
• 3 Shift continuous production backed-up facility installation:
• Own UPS system for all production area,
• Double compressed air capacity for production continuity even in case of maintenance
• 25 C +- 0.2 C controlled temperature environment for all production area
• In house Light measurement laboratory, Accelerated test equipment, electric measurement laboratory,
SMD production, LED micro-packaging production, Modules assembly
• On site team of electrical, mechanical, optical, process and technology set-up engineers
• On site R&D and supply chain department
Production Site

6. Company Structure
CEO
Commercial
Dep.
F&A Dep.
Lighting
Engineering Dep.
Factory Godech,
Plant Manager
LEDs Dep. R&D Dep.
LED Lamps and
Luminaires Dep.
Quality Manager
EMS /SMT/ Dep.
Field Service Dep.
(installments and
maintenance)
Manufacture of core lighting solution, Bullstar K2,
SMD, PLCC, COB and Specialized LEDs.
Street, interior, industrial, decorative, specialized
lighting products. OEM luminaire assembly services,
Retrofit and retail product activities`.
Cutting Edge SMD assembly facility, 2013 Equipment
grade, LED assembly activities, OEM electronic
manufacturing services.

7. Production Capabilities – Preparation, Die Bonding and
Wire Bonding
DIEBONDING
WIREBONDINGSURFACEPREPARATION
• In house plasma cleaning and surface treatment.
• Bulk magazine cleaning, bettered Wire bond pull strengths and Die bond shear forces.
• Improved material adhesion strength, optimized encapsulation process.
• Standard process working capability of Leadframes – from 30x100 mm up to 60x154 mm for all
production sections
• Wafer handling capability – 4 inch, 6 inch, 8 inch
• Die handling capability – 6x6 mil up to 80 x 80 mil
• Automated wafer loading system for lower MTBA
• Production capacity by October 2014 – 10000 UPH (die
dependent)
• Production expansion from December 2014 – 30 000 UPH
• IQC standard die placement accuracy – 30 microns +/- 2
degree @ 3 sigma, average for > 10 000 000 produced units
• Full PR placement check up – wafer, pre-bond, post bond
• Magazine to magazine buffer lot organization
• Standard Au wire bonding capability – from 0.8 to 2 mil
• Leadframe handling capability – up to 60x154 mm
• Standard Square, Q, and Penta Loop wire bonding capability
• Standard bond to bond length capability – 8 mm
• Production capacity by October 2014 – 20 000 bonds per hour
• Production expansion from December 2014 – 40 000 bond per hour
• ASM IHAWK software bond handling programming setup
• Magazine to magazine buffer lot organization

8. CONFORMAL
COATING
MICROCOATING
Production Capabilities – Wavelength Conversion and
Encapsulation
• Highly dry-parts loaded compounds microjetting capability
• 0.6 % or +-0.01 µg weight dispensing precision in mass production, whichever
smaller
• Workable dispense volume from 30 µg to 15g standard working capability per dot
• Production capacity – 40 000 jets/hour (volume dependent)
• Improved Material adhesion strength, optimized encapsulation process
• Standard process working capability of Leadframes – from 30x100 mm up to 60x154
mm for all production sections
GLOB
ENCAPSULATION
• Proprietary technology for large area conformal
coating
• Unique production process applicable for flip chip
and top wire bonded Units on proprietary substrates
• Extreme easiness on phosphor placement, precise
binning control and low color shift on final products
• Process independent from luminophore particle
sizing and type
• Third generation precision glob top dispensing technology in hours,
shutter controlled dispensing methods for higher accuracy compared
to pure time-pressure dispensing method, permitting tight color bin
controlling
• +/-1.2 % dispense weight process repeatability in mass production
• Production capacity by October 2014 – 15 000 globs per hour, based
on 1 mg dispense volume
• Extensive experience in handling varied concentrations, varied
viscosity and varied refraction index silicone materials

9. Production Capabilities – Encapsulation Lens Molding
• Unique in house mold encapsulation process – Complex injection/transfer
molding technology , up to 80 Tons and 100 kg cm/2 injection pressure.
• Extensive experience in molding >1,4 and > 1.5 and > 1.55 Refraction index
silicones, both Methyl and Phenyl types.
• Automated dispense module, constant process and incoming material quality
• Temperature controlled material storage – constant temperature assuring
constant process parameters within a full production day.
• Extensive material application knowledge on varied products from main market
suppliers .
• Optimized molding process for high speed and low voids process.
• Yield rate (based on internal acceptance criteria) - > 99.98 %
• Molding cycle – from 1 to 8 minutes based on material setup and substrates
type.
• Active mold area (substrate capability) - 128 mm x 300 mm (tool depending)
• Lenses repeatability characteristics – 25 µm size error, 50 µm displacement
accuracy, 0.3 degree curvature error.
NEW R&D development (April 2014):
FREE FORM LENSES FORMATION BY
UNIQUE PROPRIETARY PROCESS OF LAYER
TO LAYER ADDITION.

10. Production Capabilities – Singulation Technologies
• Leadframe handling capability up to 70 mm width
• Three station punching technology for leaded type LEDs
• Unique custom module for leadframe-input to tube-output handling
• Production capacity – 1 cut per 2 seconds (leadframe based UPH)
• Easy tool interchange
• Orientation recognition system for refusal of bad oriented leadframes
AUTOMATIZEDSINGULATION
FORLEADEDTYPELEDS
ULTRA-FINELASER
CUTTECHNOLOGY
• In-house Ultra high power UVB micro precision laser
system
• CAD design to Product cutting in less than 10 minutes, no
tooling required
• 25 micrometer cutting width with 5 micrometer
displacement accuracy
• Able to cut through any material
• USED in standard production for varied of purposes and
applications
• Silicone micro structuring processes by Laser undergoing
under 2015 R&D projects

11. Optimized Production Organization and Handling
• Magazine to magazine line setup.
• Buffer production organization based on technological production steps.
• Large inventory of magazines for varied leadframe setups.
• Speed matched production – possibility of additional shifts in case of larger time.
• Requiring processes.
• Protected substrates handling, no risk of substrate bending and Faraday case effect
for chips ESD protection.
OPTIMIZEDHANDLINGAND
PRODUCTIONORGANIZATION
• Single flow production organization – from material input
to LEDs output
• Inline control points for production quality
• Production site control points for material qualification
• Low Humidity (<25%) and stabilized temperature
environment
• Clean room Class 10 000
• Over pressured environment for containment of eventual
contaminants and particles.

12. Production Capabilities – Testing Technologies
• Unique customized equipment for High mix/low volume testing
• FULL flux measurement on all test stations
• SMD, Leaded, PLCC Testing kits
• Three main test unit input methods:
- Bulk (PLCC/SMD)
- Tube in (Leaded type LEDS)
- WAFER pack (for Lens type SMD)
• Easy package interchange organization, less than 15 minutes kit
conversion
• Constant testing monitoring for high accuracy of mass test results –
proven < 3%
• Deviation of Lumen/W (Cumulative electrical and optical testing
deviation)
• Standard capability for optical testing of CCT, PWL, X, Y, Z, DWL, CCT,
FWHM, PURITY, U’, V’ CRI, Et, Ep, Iv, Fv, R1 – R9
• Standard capability for electrical testing :
• Kelvin, Open/Short, Polarity, Vf1, Vf2, Vr, Ir, Leackage current
• 100 % optical vision check of packaged ready units, including
• Dimensional tolerance check-up, Testing capabilities by October 2014:
- 5000 UPH for PLCC and Lens free SMD type
- 7000 UPH for Lens type SMD
- 4000 UPH for Leaded Type LEDs
• Capacity rise expected by December 2014: + 300 % for PLCC type LEDs.
• Accurate measurement capacities down to 0.1 nm and 0.1 µV
equipment.

13. Testing, Qualification, Measurement Laboratories
• Wide range of material testing capabilities:
- High humidity / High temperature (LEDs/Materials)
- High Temperature (LEDs)
- Low/High storage temperature
- Thermal cycling with powered DUT
- Thermal shock -40 to +150C
- Reflow cycling
Up to 0.5 % of standard mass production volume utilized for
destructive testing, including Die shear and Wire pull
• Full spectral / photometric measurement laboratory for calibration
and RND activities.
• Angular distribution, Spectral power distribution, CSVA measurement
for all production series.
• In-house equipped Black room for goniophotometer type A-ἀ and B-
β measurements.
AGINGAND
MATERIAL
QUALIFICATION
SPECTRO-
RADIOMETRIC
MEASUREMENTS

14. PLCC LED Production Range
Wide Range of PLCC packages for large industrial application
sector:
- Retrofit products
- Industrial Lighting
- Commercial lighting
- T8 Tubes
- LED bulbs
- Stage lighting and color effects
Standard production range:
- 5730 and 5630 Packages
- 0.5 W White, up to 160 lm/W
- 0.5 W White high voltage 25 V 0.02 a
- 0.5 W Red
- 9.5 W Green
- 0.5 W Amber
- 0.5 Blue
- 3528 Packages
- 0.1 W white,
- 0.1 W Red,
- 0.1 W Green
- 0.1 W Amber
- FULL ANSI White binning and ITE color compliant binning
- 5050 packages
- 0.5 W 9 V white series
- 0.5 W 3 V white series
- 0.8 W Color series – common anode or open anode

15. SMD LED Production Range
Full application Range for SMD packages
- X3M Package
- Standard white Range 1 W , up to 160 lm/W
- Standard White range 3 W, up to 150 lm/W @ 700mA
- Ultra high efficiency range > 180 lm/W @ 350mA
- High voltage variants 50 V @ 20 mA
- FULL ANSI White binning
- High CRI up to 95
- Color Series Red, Green, White
- Variable light output distribution angle
- Unique Secondary optic free technology from 2015
- TG Series
- Compact range of up to 1W SMD LEDs
- Small footprint , wide distribution angle – 160 deg FWHM
- Standard 0.5 W power range for White
- Full ANSI white and ITE color binning
- Variable light output distribution – molded and flat variants
for wider distribution
- Unique optic free technology from 2015
- Standard Red, Green Blue colors available

16. BULLSTAR Production Range
Wide range of Robust K2 packages:
- BST – up to 3 W, white Series, up to 160 lm/W @ 350mA
- BLV – ultra high efficiency series, 2.8-2.85 Vf, up to 180 lm/W
series at 3 W power
- High Voltage Bullstar – BHV series – 50 V @ 20mA single
package LED, up to 3 W continuous operation
- AC Bullstar RANGE 120 V 60 Hz AC – power supply free
package intended for direct AC application, up to 3 W
continuous operation
- AC Bullstar range 230 V 50 Hz AC – power supply free package
intended for direct AC, up to 3 W continuous operation
- Bullstar Color – Full CIE 1931 Diagram coverage
- Green, from 510 to 540 nm peak
- Blue, from 440 to 470 nm peak
- Red, from 600 to 640 nm peak
- Cyean, pink, Yellow, Violet
- Bullstar UV and IR series
- Specialized packages for specific applications, available
for UVA, UVB, UVC and IR ranges 820 nm to 900 nm peaks

17. Industry Highest thermal conductivity COBs:
- Unique process technology for highest efficiency
- Pure copper substrate - > 400mW/mK conductivity, special silver coating
process and circuitry creation
- In-house interconnection freedom
- Wide range of applications
- Insertion, in 2015, of power supply Free pure Semiconductor COBs
- Insertion in 2015 of Secondary optics free COBs , including direct Fresnel
lensing capability
- C1F – 10 W, full white ANSI binning
- C2F – 25 W , full white ANSI binning, red, green and blue colors available
- C3F – 50 W, full white ANSI binning, red, green and blue colors available
- C5F – compact 100W (40x40 mm) full White color ANSI BINNING
- C1R – improved output , concentrated light 10 W LED, up to 150 lm/W @
85 C
- C2R – improved output, concentrated light 20 W LED, up to 150 lm/W @
85 C
- C3R – improved output, concentrated light 40 W LED, up to 150 lm/W
- C2F RGB Series – open cathode/anode series, 25 W multicolor package
(RGBW available also)
- C3F RGB series – open cathode/anode series, 50 W multicolor package
(RGBW available also)
- New products in 2015:
- Direct 230 V AC 25-100 W COBs
- 200 lm/W 25-50 W white COBs
- Secondary optic free COBs
- Special Spectrum COBs (for food and vegetable growth industry)
COB Production Range

18. Electronic Manufacturing Services /EMS/
Department
 Advanced Manufacturing Engineering
 Test and System Development
 New Product Introduction Services
 Low volume and high mix manufacturing
 High Volume Manufacturing
 Inter-sectorial production, Hybrid Micro packaging and
SMD assembly technologies
 Advanced equipment with a strong team expertise
enabling to provide SMD solutions with different areas
of application:
 Lighting
 Consumer electronics
 Telecommunications
 Automotive industry
 Medical equipment, etc.

19. SMD Line Equipment
Lead and Lead Free SMD technology , enabled by cutting edge equipment from
leading and highly reliable companies like ASM, DEK, Famecs , Heller and Mirtec.
 Conveyorized line from Famecs Corporation, automatic width adjustments
from one single touch panel for all the line.
 Fully automated printer Horizon 03iX using Vector Guard stencil frame and
Magnatec printing accessories, highest possible accuracy in the range of 50x46
cm working frame
 ASM Siplace powered Assembly capacity, X2 equipment with two working
gantries (MultiStar and TwinHead) for maximum accuracy and flexibility.
 Workability of components varying from 01005 up to 200x200 mm and 3 kg
weight
 Cutting edge feeding technology, included tray holders for odd components
assembly
 11 Zones Reflow oven, powered by Heller 1809 MK III, nitrogen environment
operation.
 Quality control assured by Offline Automated vision inspection, powered by
Mirtec MV-8VH.

20. Flexibility an Technical Capability
Surface Mount Assembly
 Through the use of modern, well-maintained surface
mount (SMT) assembly equipment line we consistently
achieve high yields of quality final assembly SMT products.
 40 000 CPH SMD assembly Capacity, 01005 to 200x200
components assembly
 Offline programming station and statistical optimization of
placement powered by SIPLACE
 In-house wave solder Line for Through hole assembly,
powered by Vitronics
 Multiple measurement and quality assurance equipment
 Experienced processing of SMT applications such as:
 Single-sided component populated boards;
 Double-sided component populated boards - solder
paste and glue;
 Single layer rugged/heavy construction;
 Multi-Layer complex and handling sensitive boards;;
 SMT and through-hole assembly mixed component
assemblies.
 BGA Placement Capability

21. Main SMD Assembly Capabilities
 Solder paste and adhesive paste Stencil printing –
DEK Horizon 03iX
 Maximum print area : 508 by 508 mm
 Substrate handling size : from 50*40mm to
460*508
 Substrate thickness: from 0.2 to 6 mm
 Process alignment capability 2Cpk@±20um 6-
sigma
 Cycle time : 12 seconds
 Including software DEK instinctive V9
 The pick and place of anything - our Siplace
workhorse
 Placement speed by IPC value 40 000 cph
 Component spectrum from 01005 to 200x200mm
 Maximum width :600 mm
 Maximum lenght:540 mm
 Maximum thickness : 4.5 mm
 Placement accuracy ± 22um, ± 0.05° 3σ
 Lead Free Reflow fellow – our Heller 1809 MK III
Separated controllable 9 heating zones, with a total of 18
control modules (9 upper and 9 lower) + 2 cooling zones.
To support the welding rely on nitrogen.
 Max. width/length of board:460*500mm
 Max. temperature : 350° C
 12 separate zones control, with up to 150 C thermal
deviation zone-zone
 Controllable temperature ramp-up and down ranges
 Lead Free backed-up technology with ppm range
Oxygen free environment
 The problem finder – our Mirtec MV-8VH Automated inspection line
Robust machine equipped with Triple camera vision system (horizontal, vertical,
and axial) for recognition of soldering quality of any type of odd components
 Max. width of board : 600mm
 High repeatability and accuracy
 Full SMD quality inspection capability – from shorts, to lack of paste, to
component parameters / name look ups, resistor values, tolerances, color
identification, and both binary and gray scale check-ups

22. OCTALED Retail Portfolio
 Octa Light produces own portfolio of LED lamps
for the retail market under the brand name
OCTALED:
 T8 LED tubes in 600mm, 1200mm and
1500mm length for replacement of
fluorescent tubes.
 E27 LED bulb in Basic and Pro series for
direct replacement of 40W, 60W and 75W
conventional bulbs.
 E14 LED candle bulb for direct replacement
of 25W and 40W conventional bulbs.
 F01 LED series specially designed for
refrigerators and coolers.
 OCTALED products are highly efficient and can
achieve between 50% to 85% reduction of energy
consumption in comparison to conventional
lamps.
 OCTALED E27 are among the few LED lamps in the
world with A++ Energy Efficiency Class, at market
competitive prices.

23. LED Luminaires Portfolio
 Octa Light produces own range of LED luminaries that
cover wide variety of lighting application:
 Office and interior lighting
 Retail outlets and shopping areas lighting
 Accent lighting
 Industrial lighting
 Petrol stations
 Street lighting
 Architectural and landscape lighting
 Highly efficient design for achieving maximum light
output and long lifespan.
 Focused on energy efficiency.
 Most luminaires are suitable for direct replacement
of widely spread conventional lighting fixtures

24. Engineered Solutions
 As a vertically integrated producer we fully control our design and production starting with the LED
chip to the final product. Our complete LED lighting solutions provide optimal light distribution,
uniformity of illuminance and long lifetime, achieving the highest industry standards for energy
savings
 Selecting the right LED source – system-engineered solution takes into consideration LED type
color temperature (K), viewing angle and CRI (Color Rendering Index), as well as area of
application – spot vs. area illumination.
 Excellent thermal management for longer lifetime – by choosing the right mechanical
construction of the product.
 Selecting the best optical performance – LEDs are directional light sources. The use of reflectors,
lenses and diffusers allows light to be directed according to the lighting application objective.

25. Lighting Projects
 Argun, Chechnya – Exterior LED lighting of the biggest mosque in
Europe. Innovative RGB LED modules.
Completed: 2014
 DOMO hypermarket in in Vulcan Value Center shopping mall in
Bucharest, Romania – Interior LED lighting. Completed: 2014
 Tezze Municipality, Italy – Street lighting
Completed: 2013

26. Project Business – Key Projects
 Bulgarian Telecommunication Company /VIVACOM/ – all new
retail stores from 2014 – Interior retail LED lighting.
VIVACOM National Control Center, Sofia – Interior office LED
lighting
Completed: 2014
 KFC restaurants
Lavov Most restaurant – Interior retail LED lighting
Boyana Ring Road restaurant – Interior and exterior LED
lighting
Completed: 2014
 Retail Chain Zora, Ring Road Sofia – Complete interior LED
lighting replacing conventional lighting equipment.
Completed: 2013

27. Project Business – Key Projects
 Vimi Fasteners Spa, Italy – industrial LED lighting.
Completed: 2014
 Mall City Center Sofia – LED lighting of covered parking area,
Interior LED lighting
Completed: 2013
 Petrol AD, Company head office building, Sofia – Interior office
LED lighting
Completed: 2012

28. Quality Management
 ISO 9001, ISO 14001, OHSAS 18001 certified by INTERTEK.
 All LED products completely comply to EU Regulations (Low Voltage Directive, Electromagnetic Compatibility
Directive, Restriction of Hazardous Substances Directive - RoHS) and respective product standards.
 Product certificates from EU accredited laboratory
 Fully equipped company laboratory for photometric tests and electrical and electromagnetic measurements.
 Specially dedicated quality management and R&D teams.

29. THANK YOU FOR YOUR ATTENTION!