SlideShare uma empresa Scribd logo
1 de 16
All Rights Reserved Copyright (c) Bee Technologies Inc. 2009
1
Device Modeling Report
Bee Technologies Inc.
COMPONENTS: MOSFET (Professional Model)
PART NUMBER: SSM6J409TU
MANUFACTURER: TOSHIBA
REMARK: Body Diode (Professional Model) /
ESD Protection Diode
All Rights Reserved Copyright (c) Bee Technologies Inc. 2009
2
MOSFET MODEL
PSpice model
parameter
Model description
LEVEL
L Channel Length
W Channel Width
KP Transconductance
RS Source Ohmic Resistance
RD Ohmic Drain Resistance
VTO Zero-bias Threshold Voltage
RDS Drain-Source Shunt Resistance
TOX Gate Oxide Thickness
CGSO Zero-bias Gate-Source Capacitance
CGDO Zero-bias Gate-Drain Capacitance
CBD Zero-bias Bulk-Drain Junction Capacitance
MJ Bulk Junction Grading Coefficient
PB Bulk Junction Potential
FC Bulk Junction Forward-bias Capacitance Coefficient
RG Gate Ohmic Resistance
IS Bulk Junction Saturation Current
N Bulk Junction Emission Coefficient
RB Bulk Series Resistance
PHI Surface Inversion Potential
GAMMA Body-effect Parameter
DELTA Width effect on Threshold Voltage
ETA Static Feedback on Threshold Voltage
THETA Mobility Modulation
KAPPA Saturation Field Factor
VMAX Maximum Drift Velocity of Carriers
XJ Metallurgical Junction Depth
UO Surface Mobility
All Rights Reserved Copyright (c) Bee Technologies Inc. 2009
3
0
10
20
30
40
50
0.0 5.0 10.0 15.0 20.0
gfs(S)
Drain Current ID (-A)
Measurement
Simulation
Transconductance Characteristic
Circuit Simulation Result
Comparison table
- Id(A)
gfs(S)
Error (%)
Measurement Simulation
0.2 6.400 6.118 -4.41
0.5 9.700 9.321 -3.91
1 13.000 12.663 -2.59
2 16.800 16.963 0.97
5 24.000 24.281 1.17
10 30.500 31.025 1.72
20 37.500 38.614 2.97
All Rights Reserved Copyright (c) Bee Technologies Inc. 2009
4
V_VGS
0V -0.5V -1.0V -1.5V -2.0V
I(VD_Sense)
0A
-2A
-4A
-6A
-8A
-10A
-12A
-14A
-16A
-18A
-20A
Vgs-Id Characteristic
Circuit Simulation result
Evaluation circuit
VDS
-3Vdc
VD_Sense
0Vdc
VGS
0
U1
SSM6J409TU
All Rights Reserved Copyright (c) Bee Technologies Inc. 2009
5
0.00
2.00
4.00
6.00
8.00
10.00
12.00
14.00
16.00
18.00
20.00
0.0 0.5 1.0 1.5 2.0
DrainCurrentID(-A)
Gate - Source Voltage VGS (-V)
Measurement
Simulation
Comparison Graph
Circuit Simulation Result
Simulation Result
-ID(A)
-VGS(V)
Error (%)
Measurement Simulation
0.2 0.840 0.880 4.80
0.5 0.890 0.919 3.26
1 0.950 0.964 1.51
2 1.040 1.032 -0.81
5 1.200 1.176 -2.02
10 1.370 1.356 -1.06
20 1.650 1.641 -0.56
All Rights Reserved Copyright (c) Bee Technologies Inc. 2009
6
U1
SSM6J409TU
VGS
-4.5Vdc
VD_Sense
0Vdc
VDS
-0Vdc
0
V_VDS
0V -20mV -40mV -60mV
I(VD_Sense)
0A
-1.0A
-2.0A
-3.0A
Rds(on) Characteristic
Circuit Simulation result
Evaluation circuit
Simulation Result
ID = -3A, VGS = -4.5V Measurement Simulation Error (%)
RDS (on) m 17.800 17.800 0.00
All Rights Reserved Copyright (c) Bee Technologies Inc. 2009
7
Time*-1mA
0 -5n -10n -15n -20n -25n -30n
V(W1:4)
0V
-1.0V
-2.0V
-3.0V
-4.0V
-5.0V
-6.0V
-7.0V
-8.0V
Gate Charge Characteristic
Circuit Simulation result
Evaluation circuit
Simulation Result
VDD=-10V, ID=-9.5A,
VGS=-4.5V
Measurement Simulation Error (%)
Qgs nC 2.000 2.016 0.80
Qgd nC 4.250 4.259 0.22
Qg nC 15.000 14.988 -0.08
I1
TD = 0
TF = 10n
PW = 600u
PER = 1000u
I1 = 0
I2 = 1m
TR = 10n
-
+
W1
ION = 0uA
IOFF = 0.1mA
W
0
I2
9.5Adc
D1
Dbreak
V1
-10Vds
V2
0Vdc
U1
SSM6J409TU
All Rights Reserved Copyright (c) Bee Technologies Inc. 2009
8
Capacitance Characteristic
Simulation Result
VSD (V)
Cbd (pF)
Error (%)
Measurement Simulation
0.1 340.000 347.750 2.28
0.2 305.000 319.950 4.90
0.5 255.000 263.200 3.22
1 210.000 210.500 0.24
2 160.000 158.400 -1.00
5 100.000 101.760 1.76
10 70.000 70.690 0.99
20 50.000 48.450 -3.10
Simulation
Measurement
All Rights Reserved Copyright (c) Bee Technologies Inc. 2009
9
Time
1.84us 1.92us 2.00us 2.08us 2.16us 2.24us
V(L1:2) V(L2:2)/4
0V
-0.5V
-1.0V
-1.5V
-2.0V
-2.5V
-3.0V
-3.5V
-4.0V
Switching Time Characteristic
Circuit Simulation result
Evaluation circuit
Simulation Result
ID=-2.0A, VDD=-10V
VGS=0/-2.5V
Measurement Simulation Error(%)
ton ns 40.000 39.998 -0.01
V2
TD = 2u
TF = 1n
PW = 10u
PER = 2000u
V1 = 0
TR = 1n
V2 = 5
V1
-10Vdc
L2
50nH
L1
30nH
R2
5
R1
4.7
U1
SSM6J409TU
0
RG
4.7
All Rights Reserved Copyright (c) Bee Technologies Inc. 2009
10
V_VDS
0V -0.2V -0.4V -0.6V -0.8V -1.0V
I(VD_Sense)
0A
-4A
-8A
-12A
-16A
-20A
Output Characteristic
Circuit Simulation result
Evaluation circuit
U1
SSM6J409TU
VGS
VD_Sense
0Vdc
VDS
-1Vdc
0
VGS=-4.5V
-1.5
-1.8-2.5
All Rights Reserved Copyright (c) Bee Technologies Inc. 2009
11
V_V1
0V 0.2V 0.4V 0.6V 0.8V 1.0V 1.2V
I(R1)
1.0mA
10mA
100mA
1.0A
10A
100A
Forward Current Characteristic
Circuit Simulation Result
Evaluation Circuit
V1
0Vdc
R1
0.01m
0
U1
SSM6J409TU
All Rights Reserved Copyright (c) Bee Technologies Inc. 2009
12
0.0
0.0
0.1
1.0
10.0
0 0.2 0.4 0.6 0.8 1 1.2
DrainreversecurrentIDR(A)
Source - Drain voltage VDS (V)
Measurement
Simulation
Comparison Graph
Circuit Simulation Result
Simulation Result
IDR(A)
VDS(V)
%Error
Measurement Simulation
0.001 0.345 0.345 0.00
0.01 0.420 0.421 0.27
0.1 0.500 0.501 0.29
0.2 0.525 0.529 0.84
0.5 0.570 0.574 0.65
1 0.615 0.615 0.03
2 0.660 0.663 0.50
5 0.740 0.738 -0.30
10 0.815 0.808 -0.83
20 0.900 0.904 0.42
All Rights Reserved Copyright (c) Bee Technologies Inc. 2009
13
Time
0.2us 0.6us 1.0us 1.4us 1.8us 2.2us
I(R1)
-400mA
-300mA
-200mA
-100mA
-0mA
100mA
200mA
300mA
400mA
0
V1
TD = 18n
TF = 5.7ns
PW = 1us
PER = 50us
V1 = -9.5V
TR = 10ns
V2 = 10.5V
R1
50 U1
DSSM64J409TU_P
Reverse Recovery Characteristics
Circuit Simulation Result
Evaluation Circuit
Compare Measurement vs. Simulation
Characteristics Unit Measurement Simulation Error (%)
trj ns 24.000 23.544 -1.90
trb ns 132.000 131.746 -0.19
trr ns 156.000 155.290 -0.46
All Rights Reserved Copyright (c) Bee Technologies Inc. 2009
14
Reverse Recovery Characteristic Reference
Trj=24.00(ns)
Trb=132.00(ns)
Conditions:Ifwd=lrev=0.2(A),Rl=50
Relation between trj and trb
Example
Measurement
All Rights Reserved Copyright (c) Bee Technologies Inc. 2009
15
V_V1
0V 5V 10V 15V 20V 25V 30V 35V 40V 45V 50V
I(R1)
0A
1mA
2mA
3mA
4mA
5mA
6mA
7mA
8mA
9mA
10mA
ESD PROTECTION DIODE SPICE MODEL
Zener Voltage Characteristic
Circuit Simulation Result
Evaluation Circuit
open
Ropen
100MEG
0
openopen
openopen
R1
0.01m
V1
0Vdc
0
U1
SSM6J409TU
All Rights Reserved Copyright (c) Bee Technologies Inc. 2009
16
Zener Voltage Characteristic Reference

Mais conteúdo relacionado

Mais procurados

SPICE MODEL of TPC8115 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPC8115 (Professional+BDP Model) in SPICE PARKSPICE MODEL of TPC8115 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPC8115 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of SSM3J132TU (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SSM3J132TU (Standard+BDS Model) in SPICE PARKSPICE MODEL of SSM3J132TU (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SSM3J132TU (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of SSM3K15SF (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM3K15SF (Professional+BDP Model) in SPICE PARKSPICE MODEL of SSM3K15SF (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM3K15SF (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of SSM3K15SF (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SSM3K15SF (Standard+BDS Model) in SPICE PARKSPICE MODEL of SSM3K15SF (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SSM3K15SF (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of 2SK3497 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of 2SK3497 (Professional+BDP Model) in SPICE PARKSPICE MODEL of 2SK3497 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of 2SK3497 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of SSM6J212FE (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM6J212FE (Professional+BDP Model) in SPICE PARKSPICE MODEL of SSM6J212FE (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM6J212FE (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of SSM4K27CT (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM4K27CT (Professional+BDP Model) in SPICE PARKSPICE MODEL of SSM4K27CT (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM4K27CT (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of TPC8014 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPC8014 (Standard+BDS Model) in SPICE PARKSPICE MODEL of TPC8014 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPC8014 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of SSM3J15FU (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SSM3J15FU (Standard+BDS Model) in SPICE PARKSPICE MODEL of SSM3J15FU (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SSM3J15FU (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of 2SK4017 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of 2SK4017 (Professional+BDP Model) in SPICE PARKSPICE MODEL of 2SK4017 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of 2SK4017 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of 2SK4017 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK4017 (Standard+BDS Model) in SPICE PARKSPICE MODEL of 2SK4017 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK4017 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of SSM3J132TU (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM3J132TU (Professional+BDP Model) in SPICE PARKSPICE MODEL of SSM3J132TU (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM3J132TU (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of TPC8119 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPC8119 (Professional+BDP Model) in SPICE PARKSPICE MODEL of TPC8119 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPC8119 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of 2SJ668 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of 2SJ668 (Professional+BDP Model) in SPICE PARKSPICE MODEL of 2SJ668 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of 2SJ668 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of 2SK3497 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK3497 (Standard+BDS Model) in SPICE PARKSPICE MODEL of 2SK3497 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK3497 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of SSM3J15FU (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM3J15FU (Professional+BDP Model) in SPICE PARKSPICE MODEL of SSM3J15FU (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM3J15FU (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of TPC8014 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPC8014 (Professional+BDP Model) in SPICE PARKSPICE MODEL of TPC8014 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPC8014 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of 2SJ618 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SJ618 (Standard+BDS Model) in SPICE PARKSPICE MODEL of 2SJ618 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SJ618 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of TPCA8105 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCA8105 (Professional+BDP Model) in SPICE PARKSPICE MODEL of TPCA8105 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCA8105 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of SSM3K320T (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM3K320T (Professional+BDP Model) in SPICE PARKSPICE MODEL of SSM3K320T (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM3K320T (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
 

Mais procurados (20)

SPICE MODEL of TPC8115 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPC8115 (Professional+BDP Model) in SPICE PARKSPICE MODEL of TPC8115 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPC8115 (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of SSM3J132TU (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SSM3J132TU (Standard+BDS Model) in SPICE PARKSPICE MODEL of SSM3J132TU (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SSM3J132TU (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of SSM3K15SF (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM3K15SF (Professional+BDP Model) in SPICE PARKSPICE MODEL of SSM3K15SF (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM3K15SF (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of SSM3K15SF (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SSM3K15SF (Standard+BDS Model) in SPICE PARKSPICE MODEL of SSM3K15SF (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SSM3K15SF (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of 2SK3497 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of 2SK3497 (Professional+BDP Model) in SPICE PARKSPICE MODEL of 2SK3497 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of 2SK3497 (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of SSM6J212FE (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM6J212FE (Professional+BDP Model) in SPICE PARKSPICE MODEL of SSM6J212FE (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM6J212FE (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of SSM4K27CT (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM4K27CT (Professional+BDP Model) in SPICE PARKSPICE MODEL of SSM4K27CT (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM4K27CT (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of TPC8014 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPC8014 (Standard+BDS Model) in SPICE PARKSPICE MODEL of TPC8014 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPC8014 (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of SSM3J15FU (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SSM3J15FU (Standard+BDS Model) in SPICE PARKSPICE MODEL of SSM3J15FU (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SSM3J15FU (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of 2SK4017 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of 2SK4017 (Professional+BDP Model) in SPICE PARKSPICE MODEL of 2SK4017 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of 2SK4017 (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of 2SK4017 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK4017 (Standard+BDS Model) in SPICE PARKSPICE MODEL of 2SK4017 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK4017 (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of SSM3J132TU (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM3J132TU (Professional+BDP Model) in SPICE PARKSPICE MODEL of SSM3J132TU (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM3J132TU (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of TPC8119 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPC8119 (Professional+BDP Model) in SPICE PARKSPICE MODEL of TPC8119 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPC8119 (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of 2SJ668 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of 2SJ668 (Professional+BDP Model) in SPICE PARKSPICE MODEL of 2SJ668 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of 2SJ668 (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of 2SK3497 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK3497 (Standard+BDS Model) in SPICE PARKSPICE MODEL of 2SK3497 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK3497 (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of SSM3J15FU (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM3J15FU (Professional+BDP Model) in SPICE PARKSPICE MODEL of SSM3J15FU (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM3J15FU (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of TPC8014 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPC8014 (Professional+BDP Model) in SPICE PARKSPICE MODEL of TPC8014 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPC8014 (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of 2SJ618 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SJ618 (Standard+BDS Model) in SPICE PARKSPICE MODEL of 2SJ618 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SJ618 (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of TPCA8105 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCA8105 (Professional+BDP Model) in SPICE PARKSPICE MODEL of TPCA8105 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCA8105 (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of SSM3K320T (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM3K320T (Professional+BDP Model) in SPICE PARKSPICE MODEL of SSM3K320T (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM3K320T (Professional+BDP Model) in SPICE PARK
 

Semelhante a SPICE MODEL of SSM6J409TU (Professional+BDP Model) in SPICE PARK

SPICE MODEL of 2SJ668 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SJ668 (Standard+BDS Model) in SPICE PARKSPICE MODEL of 2SJ668 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SJ668 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of 2SJ618 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of 2SJ618 (Professional+BDP Model) in SPICE PARKSPICE MODEL of 2SJ618 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of 2SJ618 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of TPCA8108 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCA8108 (Professional+BDP Model) in SPICE PARKSPICE MODEL of TPCA8108 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCA8108 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of TPCA8105 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPCA8105 (Standard+BDS Model) in SPICE PARKSPICE MODEL of TPCA8105 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPCA8105 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of TPC8109 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPC8109 (Professional+BDP Model) in SPICE PARKSPICE MODEL of TPC8109 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPC8109 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of TPC8115 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPC8115 (Standard+BDS Model) in SPICE PARKSPICE MODEL of TPC8115 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPC8115 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of SSM4K27CT (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SSM4K27CT (Standard+BDS Model) in SPICE PARKSPICE MODEL of SSM4K27CT (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SSM4K27CT (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of 2SK3934 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK3934 (Standard+BDS Model) in SPICE PARKSPICE MODEL of 2SK3934 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK3934 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of TPCA8108 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPCA8108 (Standard+BDS Model) in SPICE PARKSPICE MODEL of TPCA8108 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPCA8108 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of 2SK3934 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of 2SK3934 (Professional+BDP Model) in SPICE PARKSPICE MODEL of 2SK3934 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of 2SK3934 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of 2SK3658 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of 2SK3658 (Professional+BDP Model) in SPICE PARKSPICE MODEL of 2SK3658 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of 2SK3658 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
 
SPICE MODEL of TPC8109 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPC8109 (Standard+BDS Model) in SPICE PARKSPICE MODEL of TPC8109 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPC8109 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
 

Semelhante a SPICE MODEL of SSM6J409TU (Professional+BDP Model) in SPICE PARK (12)

SPICE MODEL of 2SJ668 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SJ668 (Standard+BDS Model) in SPICE PARKSPICE MODEL of 2SJ668 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SJ668 (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of 2SJ618 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of 2SJ618 (Professional+BDP Model) in SPICE PARKSPICE MODEL of 2SJ618 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of 2SJ618 (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of TPCA8108 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCA8108 (Professional+BDP Model) in SPICE PARKSPICE MODEL of TPCA8108 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCA8108 (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of TPCA8105 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPCA8105 (Standard+BDS Model) in SPICE PARKSPICE MODEL of TPCA8105 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPCA8105 (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of TPC8109 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPC8109 (Professional+BDP Model) in SPICE PARKSPICE MODEL of TPC8109 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPC8109 (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of TPC8115 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPC8115 (Standard+BDS Model) in SPICE PARKSPICE MODEL of TPC8115 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPC8115 (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of SSM4K27CT (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SSM4K27CT (Standard+BDS Model) in SPICE PARKSPICE MODEL of SSM4K27CT (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SSM4K27CT (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of 2SK3934 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK3934 (Standard+BDS Model) in SPICE PARKSPICE MODEL of 2SK3934 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK3934 (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of TPCA8108 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPCA8108 (Standard+BDS Model) in SPICE PARKSPICE MODEL of TPCA8108 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPCA8108 (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of 2SK3934 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of 2SK3934 (Professional+BDP Model) in SPICE PARKSPICE MODEL of 2SK3934 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of 2SK3934 (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of 2SK3658 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of 2SK3658 (Professional+BDP Model) in SPICE PARKSPICE MODEL of 2SK3658 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of 2SK3658 (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of TPC8109 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPC8109 (Standard+BDS Model) in SPICE PARKSPICE MODEL of TPC8109 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPC8109 (Standard+BDS Model) in SPICE PARK
 

Mais de Tsuyoshi Horigome

Update 46 models(Solar Cell) in SPICE PARK(MAY2024)
Update 46 models(Solar Cell) in SPICE PARK(MAY2024)Update 46 models(Solar Cell) in SPICE PARK(MAY2024)
Update 46 models(Solar Cell) in SPICE PARK(MAY2024)Tsuyoshi Horigome
 
SPICE PARK APR2024 ( 6,793 SPICE Models )
SPICE PARK APR2024 ( 6,793 SPICE Models )SPICE PARK APR2024 ( 6,793 SPICE Models )
SPICE PARK APR2024 ( 6,793 SPICE Models )Tsuyoshi Horigome
 
Update 22 models(Schottky Rectifier ) in SPICE PARK(APR2024)
Update 22 models(Schottky Rectifier ) in SPICE PARK(APR2024)Update 22 models(Schottky Rectifier ) in SPICE PARK(APR2024)
Update 22 models(Schottky Rectifier ) in SPICE PARK(APR2024)Tsuyoshi Horigome
 
SPICE PARK APR2024 ( 6,747 SPICE Models )
SPICE PARK APR2024 ( 6,747 SPICE Models )SPICE PARK APR2024 ( 6,747 SPICE Models )
SPICE PARK APR2024 ( 6,747 SPICE Models )Tsuyoshi Horigome
 
Update 31 models(Diode/General ) in SPICE PARK(MAR2024)
Update 31 models(Diode/General ) in SPICE PARK(MAR2024)Update 31 models(Diode/General ) in SPICE PARK(MAR2024)
Update 31 models(Diode/General ) in SPICE PARK(MAR2024)Tsuyoshi Horigome
 
SPICE PARK MAR2024 ( 6,725 SPICE Models )
SPICE PARK MAR2024 ( 6,725 SPICE Models )SPICE PARK MAR2024 ( 6,725 SPICE Models )
SPICE PARK MAR2024 ( 6,725 SPICE Models )Tsuyoshi Horigome
 
Update 29 models(Solar cell) in SPICE PARK(FEB2024)
Update 29 models(Solar cell) in SPICE PARK(FEB2024)Update 29 models(Solar cell) in SPICE PARK(FEB2024)
Update 29 models(Solar cell) in SPICE PARK(FEB2024)Tsuyoshi Horigome
 
SPICE PARK FEB2024 ( 6,694 SPICE Models )
SPICE PARK FEB2024 ( 6,694 SPICE Models )SPICE PARK FEB2024 ( 6,694 SPICE Models )
SPICE PARK FEB2024 ( 6,694 SPICE Models )Tsuyoshi Horigome
 
Circuit simulation using LTspice(Case study)
Circuit simulation using LTspice(Case study)Circuit simulation using LTspice(Case study)
Circuit simulation using LTspice(Case study)Tsuyoshi Horigome
 
Mindmap of Semiconductor sales business(15FEB2024)
Mindmap of Semiconductor sales business(15FEB2024)Mindmap of Semiconductor sales business(15FEB2024)
Mindmap of Semiconductor sales business(15FEB2024)Tsuyoshi Horigome
 
2-STAGE COCKCROFT-WALTON [SCHEMATIC] using LTspice
2-STAGE COCKCROFT-WALTON [SCHEMATIC] using LTspice2-STAGE COCKCROFT-WALTON [SCHEMATIC] using LTspice
2-STAGE COCKCROFT-WALTON [SCHEMATIC] using LTspiceTsuyoshi Horigome
 
PSpice simulation of power supply for TI is Error
PSpice simulation of power supply  for TI is ErrorPSpice simulation of power supply  for TI is Error
PSpice simulation of power supply for TI is ErrorTsuyoshi Horigome
 
IGBT Simulation of Results from Rgext or Rgint
IGBT Simulation of Results from Rgext or RgintIGBT Simulation of Results from Rgext or Rgint
IGBT Simulation of Results from Rgext or RgintTsuyoshi Horigome
 
Electronic component sales method centered on alternative proposals
Electronic component sales method centered on alternative proposalsElectronic component sales method centered on alternative proposals
Electronic component sales method centered on alternative proposalsTsuyoshi Horigome
 
Electronic component sales method focused on new hires
Electronic component sales method focused on new hiresElectronic component sales method focused on new hires
Electronic component sales method focused on new hiresTsuyoshi Horigome
 
Mindmap(electronics parts sales visions)
Mindmap(electronics parts sales visions)Mindmap(electronics parts sales visions)
Mindmap(electronics parts sales visions)Tsuyoshi Horigome
 
Chat GPTによる伝達関数の導出
Chat GPTによる伝達関数の導出Chat GPTによる伝達関数の導出
Chat GPTによる伝達関数の導出Tsuyoshi Horigome
 
伝達関数の理解(Chatgpt)
伝達関数の理解(Chatgpt)伝達関数の理解(Chatgpt)
伝達関数の理解(Chatgpt)Tsuyoshi Horigome
 
DXセミナー(2024年1月17日開催)のメモ
DXセミナー(2024年1月17日開催)のメモDXセミナー(2024年1月17日開催)のメモ
DXセミナー(2024年1月17日開催)のメモTsuyoshi Horigome
 
0Ω抵抗を評価ボードで採用する理由は何ですか?
0Ω抵抗を評価ボードで採用する理由は何ですか?0Ω抵抗を評価ボードで採用する理由は何ですか?
0Ω抵抗を評価ボードで採用する理由は何ですか?Tsuyoshi Horigome
 

Mais de Tsuyoshi Horigome (20)

Update 46 models(Solar Cell) in SPICE PARK(MAY2024)
Update 46 models(Solar Cell) in SPICE PARK(MAY2024)Update 46 models(Solar Cell) in SPICE PARK(MAY2024)
Update 46 models(Solar Cell) in SPICE PARK(MAY2024)
 
SPICE PARK APR2024 ( 6,793 SPICE Models )
SPICE PARK APR2024 ( 6,793 SPICE Models )SPICE PARK APR2024 ( 6,793 SPICE Models )
SPICE PARK APR2024 ( 6,793 SPICE Models )
 
Update 22 models(Schottky Rectifier ) in SPICE PARK(APR2024)
Update 22 models(Schottky Rectifier ) in SPICE PARK(APR2024)Update 22 models(Schottky Rectifier ) in SPICE PARK(APR2024)
Update 22 models(Schottky Rectifier ) in SPICE PARK(APR2024)
 
SPICE PARK APR2024 ( 6,747 SPICE Models )
SPICE PARK APR2024 ( 6,747 SPICE Models )SPICE PARK APR2024 ( 6,747 SPICE Models )
SPICE PARK APR2024 ( 6,747 SPICE Models )
 
Update 31 models(Diode/General ) in SPICE PARK(MAR2024)
Update 31 models(Diode/General ) in SPICE PARK(MAR2024)Update 31 models(Diode/General ) in SPICE PARK(MAR2024)
Update 31 models(Diode/General ) in SPICE PARK(MAR2024)
 
SPICE PARK MAR2024 ( 6,725 SPICE Models )
SPICE PARK MAR2024 ( 6,725 SPICE Models )SPICE PARK MAR2024 ( 6,725 SPICE Models )
SPICE PARK MAR2024 ( 6,725 SPICE Models )
 
Update 29 models(Solar cell) in SPICE PARK(FEB2024)
Update 29 models(Solar cell) in SPICE PARK(FEB2024)Update 29 models(Solar cell) in SPICE PARK(FEB2024)
Update 29 models(Solar cell) in SPICE PARK(FEB2024)
 
SPICE PARK FEB2024 ( 6,694 SPICE Models )
SPICE PARK FEB2024 ( 6,694 SPICE Models )SPICE PARK FEB2024 ( 6,694 SPICE Models )
SPICE PARK FEB2024 ( 6,694 SPICE Models )
 
Circuit simulation using LTspice(Case study)
Circuit simulation using LTspice(Case study)Circuit simulation using LTspice(Case study)
Circuit simulation using LTspice(Case study)
 
Mindmap of Semiconductor sales business(15FEB2024)
Mindmap of Semiconductor sales business(15FEB2024)Mindmap of Semiconductor sales business(15FEB2024)
Mindmap of Semiconductor sales business(15FEB2024)
 
2-STAGE COCKCROFT-WALTON [SCHEMATIC] using LTspice
2-STAGE COCKCROFT-WALTON [SCHEMATIC] using LTspice2-STAGE COCKCROFT-WALTON [SCHEMATIC] using LTspice
2-STAGE COCKCROFT-WALTON [SCHEMATIC] using LTspice
 
PSpice simulation of power supply for TI is Error
PSpice simulation of power supply  for TI is ErrorPSpice simulation of power supply  for TI is Error
PSpice simulation of power supply for TI is Error
 
IGBT Simulation of Results from Rgext or Rgint
IGBT Simulation of Results from Rgext or RgintIGBT Simulation of Results from Rgext or Rgint
IGBT Simulation of Results from Rgext or Rgint
 
Electronic component sales method centered on alternative proposals
Electronic component sales method centered on alternative proposalsElectronic component sales method centered on alternative proposals
Electronic component sales method centered on alternative proposals
 
Electronic component sales method focused on new hires
Electronic component sales method focused on new hiresElectronic component sales method focused on new hires
Electronic component sales method focused on new hires
 
Mindmap(electronics parts sales visions)
Mindmap(electronics parts sales visions)Mindmap(electronics parts sales visions)
Mindmap(electronics parts sales visions)
 
Chat GPTによる伝達関数の導出
Chat GPTによる伝達関数の導出Chat GPTによる伝達関数の導出
Chat GPTによる伝達関数の導出
 
伝達関数の理解(Chatgpt)
伝達関数の理解(Chatgpt)伝達関数の理解(Chatgpt)
伝達関数の理解(Chatgpt)
 
DXセミナー(2024年1月17日開催)のメモ
DXセミナー(2024年1月17日開催)のメモDXセミナー(2024年1月17日開催)のメモ
DXセミナー(2024年1月17日開催)のメモ
 
0Ω抵抗を評価ボードで採用する理由は何ですか?
0Ω抵抗を評価ボードで採用する理由は何ですか?0Ω抵抗を評価ボードで採用する理由は何ですか?
0Ω抵抗を評価ボードで採用する理由は何ですか?
 

Último

Connect Wave/ connectwave Pitch Deck Presentation
Connect Wave/ connectwave Pitch Deck PresentationConnect Wave/ connectwave Pitch Deck Presentation
Connect Wave/ connectwave Pitch Deck PresentationSlibray Presentation
 
Dev Dives: Streamline document processing with UiPath Studio Web
Dev Dives: Streamline document processing with UiPath Studio WebDev Dives: Streamline document processing with UiPath Studio Web
Dev Dives: Streamline document processing with UiPath Studio WebUiPathCommunity
 
SIP trunking in Janus @ Kamailio World 2024
SIP trunking in Janus @ Kamailio World 2024SIP trunking in Janus @ Kamailio World 2024
SIP trunking in Janus @ Kamailio World 2024Lorenzo Miniero
 
"LLMs for Python Engineers: Advanced Data Analysis and Semantic Kernel",Oleks...
"LLMs for Python Engineers: Advanced Data Analysis and Semantic Kernel",Oleks..."LLMs for Python Engineers: Advanced Data Analysis and Semantic Kernel",Oleks...
"LLMs for Python Engineers: Advanced Data Analysis and Semantic Kernel",Oleks...Fwdays
 
SAP Build Work Zone - Overview L2-L3.pptx
SAP Build Work Zone - Overview L2-L3.pptxSAP Build Work Zone - Overview L2-L3.pptx
SAP Build Work Zone - Overview L2-L3.pptxNavinnSomaal
 
Integration and Automation in Practice: CI/CD in Mule Integration and Automat...
Integration and Automation in Practice: CI/CD in Mule Integration and Automat...Integration and Automation in Practice: CI/CD in Mule Integration and Automat...
Integration and Automation in Practice: CI/CD in Mule Integration and Automat...Patryk Bandurski
 
Training state-of-the-art general text embedding
Training state-of-the-art general text embeddingTraining state-of-the-art general text embedding
Training state-of-the-art general text embeddingZilliz
 
Bun (KitWorks Team Study 노별마루 발표 2024.4.22)
Bun (KitWorks Team Study 노별마루 발표 2024.4.22)Bun (KitWorks Team Study 노별마루 발표 2024.4.22)
Bun (KitWorks Team Study 노별마루 발표 2024.4.22)Wonjun Hwang
 
"ML in Production",Oleksandr Bagan
"ML in Production",Oleksandr Bagan"ML in Production",Oleksandr Bagan
"ML in Production",Oleksandr BaganFwdays
 
Ensuring Technical Readiness For Copilot in Microsoft 365
Ensuring Technical Readiness For Copilot in Microsoft 365Ensuring Technical Readiness For Copilot in Microsoft 365
Ensuring Technical Readiness For Copilot in Microsoft 3652toLead Limited
 
Leverage Zilliz Serverless - Up to 50X Saving for Your Vector Storage Cost
Leverage Zilliz Serverless - Up to 50X Saving for Your Vector Storage CostLeverage Zilliz Serverless - Up to 50X Saving for Your Vector Storage Cost
Leverage Zilliz Serverless - Up to 50X Saving for Your Vector Storage CostZilliz
 
Anypoint Exchange: It’s Not Just a Repo!
Anypoint Exchange: It’s Not Just a Repo!Anypoint Exchange: It’s Not Just a Repo!
Anypoint Exchange: It’s Not Just a Repo!Manik S Magar
 
Developer Data Modeling Mistakes: From Postgres to NoSQL
Developer Data Modeling Mistakes: From Postgres to NoSQLDeveloper Data Modeling Mistakes: From Postgres to NoSQL
Developer Data Modeling Mistakes: From Postgres to NoSQLScyllaDB
 
My Hashitalk Indonesia April 2024 Presentation
My Hashitalk Indonesia April 2024 PresentationMy Hashitalk Indonesia April 2024 Presentation
My Hashitalk Indonesia April 2024 PresentationRidwan Fadjar
 
DevEX - reference for building teams, processes, and platforms
DevEX - reference for building teams, processes, and platformsDevEX - reference for building teams, processes, and platforms
DevEX - reference for building teams, processes, and platformsSergiu Bodiu
 
What's New in Teams Calling, Meetings and Devices March 2024
What's New in Teams Calling, Meetings and Devices March 2024What's New in Teams Calling, Meetings and Devices March 2024
What's New in Teams Calling, Meetings and Devices March 2024Stephanie Beckett
 
Streamlining Python Development: A Guide to a Modern Project Setup
Streamlining Python Development: A Guide to a Modern Project SetupStreamlining Python Development: A Guide to a Modern Project Setup
Streamlining Python Development: A Guide to a Modern Project SetupFlorian Wilhelm
 
AI as an Interface for Commercial Buildings
AI as an Interface for Commercial BuildingsAI as an Interface for Commercial Buildings
AI as an Interface for Commercial BuildingsMemoori
 
Unraveling Multimodality with Large Language Models.pdf
Unraveling Multimodality with Large Language Models.pdfUnraveling Multimodality with Large Language Models.pdf
Unraveling Multimodality with Large Language Models.pdfAlex Barbosa Coqueiro
 
My INSURER PTE LTD - Insurtech Innovation Award 2024
My INSURER PTE LTD - Insurtech Innovation Award 2024My INSURER PTE LTD - Insurtech Innovation Award 2024
My INSURER PTE LTD - Insurtech Innovation Award 2024The Digital Insurer
 

Último (20)

Connect Wave/ connectwave Pitch Deck Presentation
Connect Wave/ connectwave Pitch Deck PresentationConnect Wave/ connectwave Pitch Deck Presentation
Connect Wave/ connectwave Pitch Deck Presentation
 
Dev Dives: Streamline document processing with UiPath Studio Web
Dev Dives: Streamline document processing with UiPath Studio WebDev Dives: Streamline document processing with UiPath Studio Web
Dev Dives: Streamline document processing with UiPath Studio Web
 
SIP trunking in Janus @ Kamailio World 2024
SIP trunking in Janus @ Kamailio World 2024SIP trunking in Janus @ Kamailio World 2024
SIP trunking in Janus @ Kamailio World 2024
 
"LLMs for Python Engineers: Advanced Data Analysis and Semantic Kernel",Oleks...
"LLMs for Python Engineers: Advanced Data Analysis and Semantic Kernel",Oleks..."LLMs for Python Engineers: Advanced Data Analysis and Semantic Kernel",Oleks...
"LLMs for Python Engineers: Advanced Data Analysis and Semantic Kernel",Oleks...
 
SAP Build Work Zone - Overview L2-L3.pptx
SAP Build Work Zone - Overview L2-L3.pptxSAP Build Work Zone - Overview L2-L3.pptx
SAP Build Work Zone - Overview L2-L3.pptx
 
Integration and Automation in Practice: CI/CD in Mule Integration and Automat...
Integration and Automation in Practice: CI/CD in Mule Integration and Automat...Integration and Automation in Practice: CI/CD in Mule Integration and Automat...
Integration and Automation in Practice: CI/CD in Mule Integration and Automat...
 
Training state-of-the-art general text embedding
Training state-of-the-art general text embeddingTraining state-of-the-art general text embedding
Training state-of-the-art general text embedding
 
Bun (KitWorks Team Study 노별마루 발표 2024.4.22)
Bun (KitWorks Team Study 노별마루 발표 2024.4.22)Bun (KitWorks Team Study 노별마루 발표 2024.4.22)
Bun (KitWorks Team Study 노별마루 발표 2024.4.22)
 
"ML in Production",Oleksandr Bagan
"ML in Production",Oleksandr Bagan"ML in Production",Oleksandr Bagan
"ML in Production",Oleksandr Bagan
 
Ensuring Technical Readiness For Copilot in Microsoft 365
Ensuring Technical Readiness For Copilot in Microsoft 365Ensuring Technical Readiness For Copilot in Microsoft 365
Ensuring Technical Readiness For Copilot in Microsoft 365
 
Leverage Zilliz Serverless - Up to 50X Saving for Your Vector Storage Cost
Leverage Zilliz Serverless - Up to 50X Saving for Your Vector Storage CostLeverage Zilliz Serverless - Up to 50X Saving for Your Vector Storage Cost
Leverage Zilliz Serverless - Up to 50X Saving for Your Vector Storage Cost
 
Anypoint Exchange: It’s Not Just a Repo!
Anypoint Exchange: It’s Not Just a Repo!Anypoint Exchange: It’s Not Just a Repo!
Anypoint Exchange: It’s Not Just a Repo!
 
Developer Data Modeling Mistakes: From Postgres to NoSQL
Developer Data Modeling Mistakes: From Postgres to NoSQLDeveloper Data Modeling Mistakes: From Postgres to NoSQL
Developer Data Modeling Mistakes: From Postgres to NoSQL
 
My Hashitalk Indonesia April 2024 Presentation
My Hashitalk Indonesia April 2024 PresentationMy Hashitalk Indonesia April 2024 Presentation
My Hashitalk Indonesia April 2024 Presentation
 
DevEX - reference for building teams, processes, and platforms
DevEX - reference for building teams, processes, and platformsDevEX - reference for building teams, processes, and platforms
DevEX - reference for building teams, processes, and platforms
 
What's New in Teams Calling, Meetings and Devices March 2024
What's New in Teams Calling, Meetings and Devices March 2024What's New in Teams Calling, Meetings and Devices March 2024
What's New in Teams Calling, Meetings and Devices March 2024
 
Streamlining Python Development: A Guide to a Modern Project Setup
Streamlining Python Development: A Guide to a Modern Project SetupStreamlining Python Development: A Guide to a Modern Project Setup
Streamlining Python Development: A Guide to a Modern Project Setup
 
AI as an Interface for Commercial Buildings
AI as an Interface for Commercial BuildingsAI as an Interface for Commercial Buildings
AI as an Interface for Commercial Buildings
 
Unraveling Multimodality with Large Language Models.pdf
Unraveling Multimodality with Large Language Models.pdfUnraveling Multimodality with Large Language Models.pdf
Unraveling Multimodality with Large Language Models.pdf
 
My INSURER PTE LTD - Insurtech Innovation Award 2024
My INSURER PTE LTD - Insurtech Innovation Award 2024My INSURER PTE LTD - Insurtech Innovation Award 2024
My INSURER PTE LTD - Insurtech Innovation Award 2024
 

SPICE MODEL of SSM6J409TU (Professional+BDP Model) in SPICE PARK

  • 1. All Rights Reserved Copyright (c) Bee Technologies Inc. 2009 1 Device Modeling Report Bee Technologies Inc. COMPONENTS: MOSFET (Professional Model) PART NUMBER: SSM6J409TU MANUFACTURER: TOSHIBA REMARK: Body Diode (Professional Model) / ESD Protection Diode
  • 2. All Rights Reserved Copyright (c) Bee Technologies Inc. 2009 2 MOSFET MODEL PSpice model parameter Model description LEVEL L Channel Length W Channel Width KP Transconductance RS Source Ohmic Resistance RD Ohmic Drain Resistance VTO Zero-bias Threshold Voltage RDS Drain-Source Shunt Resistance TOX Gate Oxide Thickness CGSO Zero-bias Gate-Source Capacitance CGDO Zero-bias Gate-Drain Capacitance CBD Zero-bias Bulk-Drain Junction Capacitance MJ Bulk Junction Grading Coefficient PB Bulk Junction Potential FC Bulk Junction Forward-bias Capacitance Coefficient RG Gate Ohmic Resistance IS Bulk Junction Saturation Current N Bulk Junction Emission Coefficient RB Bulk Series Resistance PHI Surface Inversion Potential GAMMA Body-effect Parameter DELTA Width effect on Threshold Voltage ETA Static Feedback on Threshold Voltage THETA Mobility Modulation KAPPA Saturation Field Factor VMAX Maximum Drift Velocity of Carriers XJ Metallurgical Junction Depth UO Surface Mobility
  • 3. All Rights Reserved Copyright (c) Bee Technologies Inc. 2009 3 0 10 20 30 40 50 0.0 5.0 10.0 15.0 20.0 gfs(S) Drain Current ID (-A) Measurement Simulation Transconductance Characteristic Circuit Simulation Result Comparison table - Id(A) gfs(S) Error (%) Measurement Simulation 0.2 6.400 6.118 -4.41 0.5 9.700 9.321 -3.91 1 13.000 12.663 -2.59 2 16.800 16.963 0.97 5 24.000 24.281 1.17 10 30.500 31.025 1.72 20 37.500 38.614 2.97
  • 4. All Rights Reserved Copyright (c) Bee Technologies Inc. 2009 4 V_VGS 0V -0.5V -1.0V -1.5V -2.0V I(VD_Sense) 0A -2A -4A -6A -8A -10A -12A -14A -16A -18A -20A Vgs-Id Characteristic Circuit Simulation result Evaluation circuit VDS -3Vdc VD_Sense 0Vdc VGS 0 U1 SSM6J409TU
  • 5. All Rights Reserved Copyright (c) Bee Technologies Inc. 2009 5 0.00 2.00 4.00 6.00 8.00 10.00 12.00 14.00 16.00 18.00 20.00 0.0 0.5 1.0 1.5 2.0 DrainCurrentID(-A) Gate - Source Voltage VGS (-V) Measurement Simulation Comparison Graph Circuit Simulation Result Simulation Result -ID(A) -VGS(V) Error (%) Measurement Simulation 0.2 0.840 0.880 4.80 0.5 0.890 0.919 3.26 1 0.950 0.964 1.51 2 1.040 1.032 -0.81 5 1.200 1.176 -2.02 10 1.370 1.356 -1.06 20 1.650 1.641 -0.56
  • 6. All Rights Reserved Copyright (c) Bee Technologies Inc. 2009 6 U1 SSM6J409TU VGS -4.5Vdc VD_Sense 0Vdc VDS -0Vdc 0 V_VDS 0V -20mV -40mV -60mV I(VD_Sense) 0A -1.0A -2.0A -3.0A Rds(on) Characteristic Circuit Simulation result Evaluation circuit Simulation Result ID = -3A, VGS = -4.5V Measurement Simulation Error (%) RDS (on) m 17.800 17.800 0.00
  • 7. All Rights Reserved Copyright (c) Bee Technologies Inc. 2009 7 Time*-1mA 0 -5n -10n -15n -20n -25n -30n V(W1:4) 0V -1.0V -2.0V -3.0V -4.0V -5.0V -6.0V -7.0V -8.0V Gate Charge Characteristic Circuit Simulation result Evaluation circuit Simulation Result VDD=-10V, ID=-9.5A, VGS=-4.5V Measurement Simulation Error (%) Qgs nC 2.000 2.016 0.80 Qgd nC 4.250 4.259 0.22 Qg nC 15.000 14.988 -0.08 I1 TD = 0 TF = 10n PW = 600u PER = 1000u I1 = 0 I2 = 1m TR = 10n - + W1 ION = 0uA IOFF = 0.1mA W 0 I2 9.5Adc D1 Dbreak V1 -10Vds V2 0Vdc U1 SSM6J409TU
  • 8. All Rights Reserved Copyright (c) Bee Technologies Inc. 2009 8 Capacitance Characteristic Simulation Result VSD (V) Cbd (pF) Error (%) Measurement Simulation 0.1 340.000 347.750 2.28 0.2 305.000 319.950 4.90 0.5 255.000 263.200 3.22 1 210.000 210.500 0.24 2 160.000 158.400 -1.00 5 100.000 101.760 1.76 10 70.000 70.690 0.99 20 50.000 48.450 -3.10 Simulation Measurement
  • 9. All Rights Reserved Copyright (c) Bee Technologies Inc. 2009 9 Time 1.84us 1.92us 2.00us 2.08us 2.16us 2.24us V(L1:2) V(L2:2)/4 0V -0.5V -1.0V -1.5V -2.0V -2.5V -3.0V -3.5V -4.0V Switching Time Characteristic Circuit Simulation result Evaluation circuit Simulation Result ID=-2.0A, VDD=-10V VGS=0/-2.5V Measurement Simulation Error(%) ton ns 40.000 39.998 -0.01 V2 TD = 2u TF = 1n PW = 10u PER = 2000u V1 = 0 TR = 1n V2 = 5 V1 -10Vdc L2 50nH L1 30nH R2 5 R1 4.7 U1 SSM6J409TU 0 RG 4.7
  • 10. All Rights Reserved Copyright (c) Bee Technologies Inc. 2009 10 V_VDS 0V -0.2V -0.4V -0.6V -0.8V -1.0V I(VD_Sense) 0A -4A -8A -12A -16A -20A Output Characteristic Circuit Simulation result Evaluation circuit U1 SSM6J409TU VGS VD_Sense 0Vdc VDS -1Vdc 0 VGS=-4.5V -1.5 -1.8-2.5
  • 11. All Rights Reserved Copyright (c) Bee Technologies Inc. 2009 11 V_V1 0V 0.2V 0.4V 0.6V 0.8V 1.0V 1.2V I(R1) 1.0mA 10mA 100mA 1.0A 10A 100A Forward Current Characteristic Circuit Simulation Result Evaluation Circuit V1 0Vdc R1 0.01m 0 U1 SSM6J409TU
  • 12. All Rights Reserved Copyright (c) Bee Technologies Inc. 2009 12 0.0 0.0 0.1 1.0 10.0 0 0.2 0.4 0.6 0.8 1 1.2 DrainreversecurrentIDR(A) Source - Drain voltage VDS (V) Measurement Simulation Comparison Graph Circuit Simulation Result Simulation Result IDR(A) VDS(V) %Error Measurement Simulation 0.001 0.345 0.345 0.00 0.01 0.420 0.421 0.27 0.1 0.500 0.501 0.29 0.2 0.525 0.529 0.84 0.5 0.570 0.574 0.65 1 0.615 0.615 0.03 2 0.660 0.663 0.50 5 0.740 0.738 -0.30 10 0.815 0.808 -0.83 20 0.900 0.904 0.42
  • 13. All Rights Reserved Copyright (c) Bee Technologies Inc. 2009 13 Time 0.2us 0.6us 1.0us 1.4us 1.8us 2.2us I(R1) -400mA -300mA -200mA -100mA -0mA 100mA 200mA 300mA 400mA 0 V1 TD = 18n TF = 5.7ns PW = 1us PER = 50us V1 = -9.5V TR = 10ns V2 = 10.5V R1 50 U1 DSSM64J409TU_P Reverse Recovery Characteristics Circuit Simulation Result Evaluation Circuit Compare Measurement vs. Simulation Characteristics Unit Measurement Simulation Error (%) trj ns 24.000 23.544 -1.90 trb ns 132.000 131.746 -0.19 trr ns 156.000 155.290 -0.46
  • 14. All Rights Reserved Copyright (c) Bee Technologies Inc. 2009 14 Reverse Recovery Characteristic Reference Trj=24.00(ns) Trb=132.00(ns) Conditions:Ifwd=lrev=0.2(A),Rl=50 Relation between trj and trb Example Measurement
  • 15. All Rights Reserved Copyright (c) Bee Technologies Inc. 2009 15 V_V1 0V 5V 10V 15V 20V 25V 30V 35V 40V 45V 50V I(R1) 0A 1mA 2mA 3mA 4mA 5mA 6mA 7mA 8mA 9mA 10mA ESD PROTECTION DIODE SPICE MODEL Zener Voltage Characteristic Circuit Simulation Result Evaluation Circuit open Ropen 100MEG 0 openopen openopen R1 0.01m V1 0Vdc 0 U1 SSM6J409TU
  • 16. All Rights Reserved Copyright (c) Bee Technologies Inc. 2009 16 Zener Voltage Characteristic Reference