1. RAMKUMAR SAINAGASUBRAMANIAN
57 ADELFA ST, RANCHO MISSION VIEJO CA 92694 M: 818.280.7011 E: s.ramukumar@gmail.com
PROFILE
 Meticulous RFIC/ Mixed Signal Product Engineer with over 6+ years of experience, looking for a position as a Product
Engineer who has proven record of qualifying IC’s from NPI to High Volume Production.
 Have knowledge on Production Ramp, Quality Control and Supply Chain.
EDUCATION
M.S. Degree: Electrical Engineering December 2009
California State University, Northridge.
B.E. Degree: Electronics and Telecommunications May 2005
University of Pune, India.
PROFESSIONAL EXPERIENCES
MAXLINEAR INC., Irvine, CA October 2010 – Present
Working as a Product Engineer for SoC RFIC/ Mixed Signal devices and TIA in Operations group.
 Job Responsibilities:
 Support NPI activities – Testability Reviews, Participate in test coverage discussions with all teams and align with
datasheet and SRD spec.
 Work with cross-functional teams for developing test plans for characterization and qualification.
 Propose corner lots to qualify FAB process window.
 Complete PCM data analysis across POR and DOE wafers.
 Design HTOL and HAST boards for Product Qualifications.
 Qualify parts for ESD, Latch-Up, HTOL, HTSL, Package Qual (HAST, Temp Cycle).
 Complete correlation analysis and adjustment between production ATE and test bench used for product
verification & characterization.
 Methodical analysis of Radio & Digital Characterization and Qual results. Analyze Shmoo and PVT data.
 Highlight any issues in NPI and report root cause for subsequent rev of the device.
 Qualify test systems and boards through Gauge R&R and transfer it to production test houses oversees.
 Investigate/ Select production test house oversees for the new product (IC) with considerations over tester
performance, cost, thru-put, availability/accessibility, and flexibility/scalability for existing/NPI products.
 Work with oversees team for production ramp and supplies.
 Prepare Qual, Char, and PRA reports by the end of NPI cycle.
 Yield and Failure Analysis:
 Monitor yield and thru-put of products of Wafer Lots and Assembled parts on legacy devices.
 Have implemented necessary methodologies consistently to improve yield and Test time reduction.
 Have generated, reviewed and presented every analyzed data, reported bugs and errors, conclusions and
summary in MS PowerPoint for over million parts.
 Support Supply Chain Management team upon lots on hold.
 Failure Analysis on CRA’s and examine the root cause of the issue. Worked closely with RFIC design and
Applications team on major issues and fix test holes.
 Goals/ Achievements:
 Transfer High Speed Quad Channel 28GBPS TIA to mass production. First TIA of MaxLinear and set a benchmark.
 Handling up to 28nm Technology projects, NPI to Production.
 Data analysis skill using DataConductor, Galaxy and Excel.
 Basic working knowledge of Teredyne UFLEX, LTX tester.

2.  Train junior engineers.
PEREGRINE SEMICONDUCTOR CORPORATION, San Diego, CA December 2009 – June 2010
Product Development & Characterization Engineer for Mobile/ Wireless Switch group.
 Roles & Responsibilities:
 Product qualification – Electro Static Device testing - Human Body Model (HBM) and Machine Model (MM).
 Characterization of GSM switches which includes IMD2&3, Harmonics, Start up Time, Switching Time, Spurious,
S-Parameter for SP10T and SP8T switches.
 Set up Wafer level testing for Start-up time testing, Band Gap measurement.
 Successfully developed a Ruggedness Tester and worked on improvisation.
 Efficiently use MS Excel, JMP to verify data.
 Have generated, reviewed and presented every analyzed data, reported bugs and errors, conclusions and
summary in MS PowerPoint.
 Socket verification for the device, Gauge R & R on testers.
SKYWORKS SOLUTIONS INC., Newbury Park, CA January 2008 - September 2009
Internship experience as a RF Characterization/Test Engineer working on Mobile PAs and FEMs.
 Roles & Responsibilities:
 Test development for GSM parts and Characterize PA’s for EVM, Receive Band Noise Measurement, AM-PM,
Stability and Ruggedness, ACPR Measurements, IP3 Measurements, Harmonics, etc.
 Configuration, Design and Set-up of Receive Band Noise Tester comprising of filters, equipment alignments.
 Data Analysis using MS Excel and Pivot Tables for all tests per part.
 Strong understanding of Communication and RF fundamentals, design concepts, test equipment operation and
automation.
 Constantly supporting Product Engineers for my entire project/tests hence reducing their work load.
 Consistently recorded a quick turn-around time.
 Maintained good communication with designers and other teams, regarding data analysis.
 Improved teamwork skills, equipment handling skills, written and verbal skills.
MICRON TECHNOLOGIES, Pune, INDIA August 2004 to May 2006
Experience as an electronic circuit designer.
 Roles & Responsibilities:
 Design of Communication and Electronic Circuits which includes Wireless circuits, Microcontroller based
applications.
 Successfully performed Cross-compilation, Embedded C for Microcontrollers.
 Thrived in a teamwork setting.
SKILL SETS
Operating systems Windows, MAC
Software skills ADS, HFSS v11, Cadence PSpice, Optiwave, GUTS, Lotus Notes, Agilent VEE Pro
Language C, C++, VB, Assembly Language, Matlab 7.1
Data Analysis Tools DataConductor, Galaxy, JMP, Excel
Testers Working knowledge of Teredyne UFlex, LTX Fusion
Test Equipment’s ESD Test System, Spectrum Analyzer, Signal/Waveform Generators, Network Analyzer,
Oscilloscope, Power Meters, DMM.

3. PROJECTS
Design of Spiral Inductor on a Lossy Silicon Substrate
 To design a Spiral Inductor for a specified number of turns, inductance, space between conductors, etc., on a lossy
silicon substrate. Project simulated on Ansoft HFSS.
 The objective is to extract the equivalent lumped model for the spiral inductor and characterize it to check the
behavior of inductance with respect to the geometrical parameters.
 The design targets RF applications such as amplifiers, filters, etc.
Design of Low Noise Amplifier
 An individual project which focuses on the 2 Stage Low Noise Amplifiers was performed with the gain of 20dB.
 The project was simulated in PSPICE during the Spring Semester – 2007.
Design of a Tuner
 A FM tuner with a tuning range of 88 – 108 MHz and the output frequency response of 15 – 20 KHz was individually
performed.
 The project was successfully simulated in PSPICE during the Fall Semester – 2007.
Dispersion Management in Fiber Optic Cable
 Performed a project in Fiber Optic Communication using Optiwave software.
 The project deals with the dispersion caused while propagation of light (information) in a fiber optic cable due to
bending, impurities etc. A wavelet named Soliton, used to eradicate the problem was also discussed.
Data Communication Using RF Module (Sponsor: Micron Technologies)
 SCADA – Wireless control of parameters like temperature, pressure etc from a transmitter to a receiver, those are
in two different operating areas, was performed as my Graduate Project in B.E in 2005.
 Programmed Motorola - 89C51 Microcontroller for the project using Embedded C and Cross Compiler.