Presentazione offerta embedded Freescale/EBV e carrellata di soluzioni della famiglia Freescale iMX (Arm9/CortexA8/A9) per la gestione delle soluzioni grafiche embedded con Qt.
15. i.MX 6D/Q
Cortex A9
i.MX512 i.MX537
i.MX513
Cortex A8 i.MX515 • Extended Temperature
•
•
LP/LV-DDR2, DDR3 533MHz
SATA 3Gbps
Coverage • USB2.0 + 2xPHY,
• Ethernet, DDR2, USB Phy
• Ethernet, DDR2 • WUXGA LCD (1920x1200,
• Extended Temperature 2134x1200)
• USB Phy x 2, CAN x 2
Coverage • PCIe 2.0 (1x)
• PATA, SATA
• 0.8mm pitch • 1Gbps Ethernet +1588
i.MX353 • 0.8mm pitch
• WXGA LCD • 0.8mm pitch
ARM11 i.MX357 • 3.3V IO • Extended temperature coverage
• WSXGA LCD
• Extended Temperature
Coverage
• Ethernet, DDR2
• USB Phy x 2, CAN x 2
• 0.8mm pitch i.MX 6S
• 3.3V IO
• WVGA LCD
i.MX283
ARM9 i.MX253 i.MX286
i.MX233 i.MX287
i.MX257
• Extended • Extended Temperature Coverage
temperature
• Extended Temperature Coverage • Dual Ethernet, DDR2
coverage
• Ethernet, DDR2 • USB Phy x 2, CAN x 2
• 0.8mm pitch
• USB Phy x 2, CAN x 2 • 3.3V IO Support
• 0.8mm pitch
• 0.8mm pitch • VGA LCD • 3.3V IO
• 3.3V IO • WVGA resolution
• VGA Support
2009 2010 2011 2012
In Concept
TM
16. • Key Features and Advantages
− 454MHz ARM926EJ-S core,16KB/32KB Cache
Connectivity Advanced Connectivity Ext Memory I/F
− PMU with high efficiency on-chip DC/DC, supports Li-Ion NAND
I2 C x 2 10/100 Ethernet L2 Switch
batteries including battery charging IEEE 1588 x2
SPI x 4 BCH 20-bit
− Dual 10/100 Ethernet with RMII support and L2 Switch
UART x 6 CAN x 2 HS USB Phy x 2 DDR2
− Dual CAN interfaces
GPIO mDDR
− LCD Controller with Touchscreen
MMC+/SD x4 i.MX28
− NAND support – SLC/MLC and eMMC 4.4 managed LV-DDR2
ARM926EJ-S
− Hardware BCH (up to 20-bit correction) Analog
454MHz Internal Memory
12-bit ADC x 8
− 200 MHz 16-bit DDR2, LV-DDR2, mDDR external
memory support 2Msps ADC x 1 16K I 32K D 128KB SRAM
− Dual High Speed USB with embedded PHY Thermal
Cache Cache 128KB ROM
Protection
− Up to 8 General purpose 12-bit ADC channels and single
Security User I/F
2 Msps ADC channel Power
HAB4 OTP AES Key
− Temperature sensor for thermal protection Management LCD Controller
DC/DC - 4.2V 128-bit AES SHA-2 Hashing
− Multiple connectivity ports Touchscreen
(UARTs, SSP, SDIO, SPI, I2C, I2S) LDO x4
Standard System Scaling
Battery
− Family of products supporting various feature sets Timer x 4 PWM x 6
Charger Alpha Blending
Watch Dog DMA Rotation
Audio
• Package and Temperature
I2 S x 2 System Debug Color Space
− 289 BGA 14x14mm 0.8mm Conversion
S/PDIF Tx ETM JTAG
− -40C to +85C (Industrial, Automotive)
− -20C to +70C (Consumer)
Common IP with New or enhanced Not available
i.MX233 from i.MX233 on all variants
• Availability:
− Samples September 2010 TM
16
− Production: October2010
17. ► Specifications System/DMA Connectivity
• CPU: ARM Cortex A8 800 MHz Secure JTAG
i.MX 50x UART x 5
• Process: 65nm, LP/GP eSDHC x 4
Power Mgmt
• Core Voltage: 0.85V-1.3V PLL x 3 CPU Platform I2C x 3
• Temp Range: 0 to 70C CCM/Reset ARMCortex A8 (800MHz) SSI x 2
• Package: 32KB 32KB 256KB eCPSI x 2
Timers x 2
I$ D$ L2-cache
• 13x13 MAPBGA 0.5mm pitch CPSI
WDOG
• 17x17 MAPBGA 0.8mm pitch ETM NEON
SDMA Raw NAND
BCH32 ECC
► Features and Advantages APBH DMA
Multimedia
GPMI ONFl2.1
• High Performance CPU : Cortex A8 PERFMON USB2.0 OTG PHY
ePXP
• Advanced power management features Bus QoSC CSC,Combine, Rotate, USB2.0 Host PHY
Gamma Mapping
• Integrated E-INK EPD Controller MSHC
On-Chip Memories
• LP-DDR2 support for low-power applications eLCDIF (1400x1050)
FEC 10/100
8-, 16-, 24-. 32-bit I/F
• Managed NAND Flash Support with eMMC 4.4/SDIO 128 KB OCRAM 6800/8080, VSYNC, HSYNC
KPP (8 x 8)
DOTCK, RGB @ 60Hz
• Raw NAND with up to 32-bit ECC and ONFI2.1/Toggle 96KB OCROM
Ext Memory (32-bit)
• Dual USB PHY support (HS OTG, HS Host) Resizing & Blending
Security Inversion / Rotation EMI
• Flexible LCD display support up to 1400x1050 @ 60Hz Image Enhancement LP-DDR2-533 1.2V
RNG DDR2-533 1.8V
► Availability AES/SHA-1/SHA-2 Graphics
LP-DDR1-400 1.8V
• Now SRTC WEIM
GPU2D
SPRAM, PSRAM
OpenVG1.1 (1pix/clk)
E-Fuse Parallel NOR
Unmodified from
Change from i.MX51x
i.MX51x
TM
17
18. ► Specifications
• CPU: Cortex-A8
1-1.2GHz – Consumer System Control i.MX53 Connectivity
Secure JTAG Fast IrDA
800MHz – Automotive/Industrial CPU Platform
Power Mgmt eMMC 4.3/SD 2.1 x4
• Process: 65nm, LP/GP
Cortex-A8
Core Voltage 0.85V-1.35V PLL x4 eMMC 4.4
32KB 32KB 256KB
• Package: 19x19 0.8mm 529 ball BGA Clock Reset CSPI x3
i-cache d-cache L2-cache
12x12 0.4mm PoP (Consumer) Smart DMA UART x5
• Case Temp: -20 to 70C (Consumer) Neon ETM Keypad
32kHz Osc
-40 to 85C (Automotive/Industrial) I2C x3
Temp Monitor Vector Floating
► Key Features and Advantages Point Unit ESAI
LDO Supply x2
• High performance CPU: Cortex A8 SSI/I2S x3
• 2GB DDR2/3, LPDDR2 memory at 400MHz Multimedia
Timers PATA
• HDD: PATA, S-ATA interface OpenGL ES 2.0 + VG1.1
Timer x3 SATA
• One eSDHC ports supports MMC4.4 including DDR mode
PWM x2 1080p30 Video Decoder HS USB OTG +PHY
• Ethernet 10/100 with IEEE1588 720p30 Video Encoder HS Host+PHY
Watch Dog x2 HS ULPI Host x2
• Delivers rich graphics and UI in HW 1080p30 @ 60Hz TV Out
OpenGL ES 2.0 3D accelerator (AMD Z430) SPDIF Tx/Rx
Memory
OpenVG 1.1 graphics accelerator (AMD Z160) CAN x2
ROM MLB50
Neon Vector floating point co-processor Display
RAM ASRC
Display up to UXGA (1600x1200) Analog VGA Out
• Drives high resolution video in HW 10/100 Ethernet
Security Parallel (RGB) UXGA
Multi-format HD1080 video decode GPIO
Sahara v4 LVDS UXGA
Multi-format HD720 video encode
Resizing & Blending Ext. Memory I/F
High quality video processing (resizing, de-interlacing, etc) Trust Zone
Inversion / Rotation 2GB DDR2/DDR3/
Displays: Parallel, LVDS or VGA RTIC
Image Enhancement LPDDR2 @ 400MHz
• Audio: I2S, SPDIF Rx/Tx, ESAI
SCC v2
De-interlacing SLC/MLC NAND
• Secure boot (HAB), cryptographic accelerators, TZ
SRTC Up to 16-bit ECC
• More analog integration: simplified system, reduced system BOM Camera Interface
eFUSES NOR
Temperature Monitor for smart performance control
Linear supply regulators
Reused IP from Updated IP from
32KHz Oscillator NEW IP in i.MX53x
i.MX51x or i.MX35x i.MX51x
► Availability
• Samples: PoP – now
• Production: BGA – now, PoP – Q4 2011 TM