Device packaging is one of the most critical aspects for protecting and ensuring long term stability of MEMS based sensors and actuators. High‐performance classes of devices require robust packaging solutions that enable long term stability under a variety of operating conditions. SAES® Group is now offering a fully integrated MEMS vacuum packaging service that includes the getter deposition on the lid (PageLid), the hermetic sealing process, as well as the RGA and leak rate tests to verify vacuum levels. The use of state-of-the-art sealing equipment, operating in a class 100 clean room, enables the exclusive capability to deliver high quality standard services at competitive costs. Read more about our packaging service visiting our website at: http://www.saesgetters.com/products/packaging-service.

1. SAES Packaging service
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2. Agenda
MEMS Packaging service description
Facility and operations
Capabilities and future prospective
Choose your type of service :
Fast prototyping
Process developments
Packaging foundry service
Add‐on services
RGA (Residual Gas Analysis)
Outgassing
Leak rate measurements
Conclusions
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3. SAES Packaging Service description
MEMS discrete (die‐level) vacuum packaging
Ceramic packaging
Metal packaging
Getter integration
Getter film deposition and pattering
Sealing methods
Au/Sn eutectic
Glass frit soldering
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4. Facilities and operations
Equipment
Independent outgassing/forming gas
system
High vacuum sealing furnace
Independent heating systems
Rapid thermal annealing
Temperature: up to 1100°C
Heated plates, up to 450 x 450 mm
Fast ramping of plate
• Ramp up at > 3.5°C/second
• Ramp down at > 2°C/second
100 steps per program
Ultimate Vacuum: ~ 7 x 10‐7mbar
High pressure atmosphere: up to 3 bar (abs)
Operations
Class 100 clean room
High Throughput
Flexible sealing recipes
Testing
Ultrasonic microscope bonding line
integrity test
Leak rate measurements
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5. Capabilities and future prospective
Current achievements :
Final packaging pressure down to 10‐3 – 10‐4 mbar range with getter
integration
Hermeticity level < 10‐16 mbar l /s
Fast sealing process
Die attach materials selections
Future available services :
Die attach
Wire bonding
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6. Choose your type of service
SAES is offering :
Fast prototyping
Process developments
Packaging foundry service
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7. Fast prototyping
Need prototypes quickly?
Here are the steps SAES follows:
Review packaging drawings and requirements
Develop tools
Perform bonding trials on empty packages
Perform bonding on first prototypes
Complete tests and characterizations
In a reasonably short time we can make your first prototypes a
thing of reality
Need more fast? We can do that!
We can provide effective and robust solutions
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8. Process developments
Step by step process development
Discussion and definition of the project goals
Material selections and analysis
Getter integration
Preliminary packaging experiments
Recipe definition and testing
Recipe improvements
Tests on repeatability
CpK definition and key control parameters
Process installation
Tests and fine tuning
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9. Packaging foundry service
High throughput capability
Competitive costs
Fast delivery
Packaging components provided by customer :
Ceramic container with die attached and wire bonded MEMS
Au plated Kovar lid
Au‐Sn Bonding preform
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10. Add‐on services
SAES also offers:
RGA (Residual Gas Analysis)
Outgassing tests
Leak rate measurements
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11. RGA
MEMS samples with internal volume
down to nano liter range
Analysis sensitivity 10‐6 cc mbar
Total pressure and gas composition
Service capability :
Two samples per day
Standard lead time 4 weeks
Fast lead time : 1 week
Without getter
With getter
Sample 1
Q Factor
(measured)
Q Factor
(calculated)
Gas
H2
Sample 5
Q Factor
(measured)
Q Factor
(calculated)
3000
3220
Pressure
Composition
(mbar)
7.92E-01
81.7%
Gas
500000
1.40E+07
Pressure
Composition
(mbar)
H2
CH4
8.92E-02
9.2%
CH4
3.92E-05
9.8%
H2O
CO
N2
9.70E-04
5.53E-02
1.55E-02
0.1%
5.7%
1.6%
H 2O
CO
N2
2.28E-05
5.7%
C2H6
5.82E-03
0.6%
C 2H 6
1.52E-05
3.8%
C3H8
7.76E-03
0.8%
C 3H 8
3.36E-05
8.4%
CO2
Noble gases
(He,Ar,etc...)
Total
1.94E-03
0.2%
CO2
Noble gases
(He,Ar,etc...)
Total
2.89E-04
72.3%
4.00E-04
100.0%
Mean Viscosity
(10-5 Pa s)
1.911
Mean Viscosity
(10-5 Pa s)
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7.76E-04
0.1%
9.70E-01
100.0%
0.984
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12. Outgassing tests
Material studies on outgassing properties
Material vacuum compatibility assessments
Material selections
Material comparisons
Service capability :
Max sample size of 1”
Max temperature treatment is 800°C
Methods :
450
Static outgassing
Dynamic outgassing
330 °C x 12 min
300
250
200 °C x 60 min
200
150
100
is very useful to make measurements on plastics,
foams and other materials which show a high
amount of gas evolved and mainly outgas water
vapor
12
Bonding: 370 °C x 5 min
350
Temperature (°C)
to measure the outgassing rate from metals,
glasses, ceramics, and other materials which
release a relatively low amount of gas
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400 °C x 60 min
400
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50
0
0
20
40
60
80
100
120
140
160
180
Time (min)
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13. Leak rate measurements
The detection and measurement of very small leaks is a
key factor for the assessment of device lifetime
Air leak rate
Ultra fine
Super fine
Extra fine
Fine
Moderate
Gross
The method is able to :
establish whether the device is affected by a leak or not
quantitatively measure the leak rate
Pa·m 3/s
1.0E-14
1.0E-11
1.0E-09
1.0E-07
1.0E-05
1.0E-05
mbar·l/s
< 1.0E-13
< 1.0E-10
< 1.0E-08
< 1.0E-06
< 1.0E-04
> 1.0E-04
Torr·l/s
7.5E-14
7.5E-11
7.5E-09
7.5E-07
7.5E-05
7.5E-05
Service capabilities :
Sensitivity : the minimum detectable air leak
rate is about 1x10‐16 mbar l/s. Whenever the
leak rate is close to the system sensitivity an
upper limit will be provided
Standard lead time: 4 weeks
Fast service lead time : 2 weeks
Example
Tests performed on inertial sensors
The producer observed Q‐factor degradation with time for some devices
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Device
Initial presure
Target pressure
Volume
PaGe® surface
Accelerometer
0.01 mbar
0.1 mbar
0.1 mm3
2 mm2
Internal surface outgassing is neglected
No getter
Measured
air leak rate
(mbar·l/s)
< 3.0E-16
6.6E-16
2.0E-14
7.5E-14
With getter
Time to exceed 10 x target
pressure
10 y
4.8 y
57 days
15 days
>30 y
>30 y
15 y
4.2 y
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14. Conclusions
Competitive advantages of SAES’ MEMS die packaging service
High vacuum encapsulation
Getter integration for long term stability
Flexibility
Fast response
Competitive costs
Engineering capabilities
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15. Thanks for your attention
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