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Enterprise X-Architecture 5 th  Generation Systems for a Smarter Planet Technical Presentation March 30, 2010
Table of Contents ,[object Object],[object Object],[object Object],[object Object],[object Object],MAX5 HX5 Processor Information Technical Highlights:  Reliability Technical Highlights:  Performance
Client Challenges and eX5 Opportunity
Memory Capacity ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],Do More With Less ,[object Object],[object Object],[object Object],[object Object],Simplify Difficult challenges create an opportunity for innovation Client challenges with enterprise workloads Database, Virtualization, Transaction processing ,[object Object],[object Object],[object Object],[object Object],[object Object]
Turning “opportunity” into results Building on industry standards with unique innovation ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],Innovation that uniquely meets client requirements
Opportunity for Innovation  Leadership through Innovation ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],Introducing IBM System x eX5 Family of Servers
Maximize Memory Minimize Cost Simplify Deployment The broadest portfolio of systems optimized for your most demanding workloads
[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],The next generation of x86 is here!!
eX5 Systems Overview
eX5 leadership for an evolving marketplace with increasing demands 1 st  Gen:  First x86 server with scalable 16 processor design 2 nd  Gen:  First x86 server with 100 #1 Benchmarks 3 rd  Gen:  First x86 server with Hot-swap memory 4 th  Gen:  First x86 server to break 1 Million tpmC 5 th  Gen:  Breakthrough performance,  ultimate flexibility, simpler management 2010  5th Generation 2003 2nd Generation 2005 3rd Generation 2007 4th Generation 2001 1st Generation
eX5 Portfolio — Systems for a Smarter Planet  Broad coverage for most enterprise applications, server consolidation, virtualized workload enablement. 4U / 4-Way Scalable Powerful and scalable system allows some workloads to migrate onto 2-socket design that delivers enterprise computing in a dense package Demand for minimum footprint as well as integrated networking infrastructure has increased the growth of the blade form factor.  BladeCenter HX5 System x3690 X5 Consolidation, virtualization, and database workloads being migrated off of proprietary hardware are demanding more addressability System x3850 X5
IBM System x3850 X5 Flagship System x platform for leadership scalable performance  and capacity Versatile 4-socket, 4U rack-optimized scalable enterprise server provides a flexible platform for maximum utilization, reliability and performance of compute- and memory-intensive workloads. ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],System Specifications ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]
(2x) 1975W Rear Access  Hot Swap, Redundant P/S (4x) Intel Xeon CPU’s (8x) Memory Cards for 64 DIMMs –  8 1066MHz DDR3 DIMMs per card 6x - PCIe Gen2 Slots  (+2 additional) 2x 60mm Hot Swap Fans (8x) Gen2 2.5” Drives or 2 eXFlash packs (2x) 120mm  Hot Swap Fans Dual USB Light Path Diagnostics  RAID (0/1) standard,  RAID 5/6 Optional DVD Drive 2x 10Gb Ethernet Adapter x3850 X5:  4-socket 4U x86 (Nehalem EX) platform
IBM BladeCenter HX5 Scalable high end blade for high density compute and  memory capacity Scalable blade server enables standardization on same platform for two- and four-socket server needs for faster time to value, while delivering peak performance and productivity in high-density environments. ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],System Specifications ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]
HX5 4-Socket Blade Top view of 4-socket system shown 2x Intel Xeon 7500 Series CPUs 4x IO Expansion Slots (2x CIOv + 2x CFFh) 32x VLP DDR3 Memory (16 per node) 4x SSD drives (1.8”) (2 per node) 2x 30mm nodes ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],Scale  Connector 16x memory buffers (8 per node)
IBM System x3690 X5 Industry’s first entry enterprise 2-socket for maximum memory and performance High-end 2-socket, 2U server offers up to four times the memory capacity of today’s 2-socket servers with double the processing cores for unmatched performance and memory capacity . ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],System Specifications ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]
(1x) x16 (full height, full length  or (2x) x8 (1 full size, 1 full height / half length)  (2x) PCIe x8 Low Profile (1x) PCIe x4 Low Profile for RAID   (4x) N+N 675W Rear Access Hot Swap Redundant P/S (16x) Gen2 2.5” Drives or 3 eXFlash packs Scaling ports 32 x DDR3 Memory DIMMs 16 in upper mezzanine (pictured) 16 below 8x Memory Buffers (4x) 60mm  Hot Swap Fans Dual USB Light Path Diagnostics  DVD Drive x3690 X5:  2-socket 2U (Nehalem EX) platform
MAX5: Memory Access for eX5 ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],Greater productivity and utilization through memory expansion and flexibility
MAX5 for x3690 X5 and x3850 X5 Memory Buffers QPI Ports EXA Ports Firehawk Chipset 32 Memory DIMMs ,[object Object],[object Object],Lightpath Diagnostics Hot swap fans System removes from chassis for easy access
MAX5 for HX5 24x VLP DDR3 memory 6x memory buffers ,[object Object],[object Object],MAX5 HX5 ,[object Object],[object Object],[object Object],[object Object]
[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],HX5 Blade HX5 Blade with MAX5 Common  Building Block Maximum performance and flexibility for database and virtualization in a a blade IBM BladeCenter Scalable Blades 2P, 30mm 2-socket, 16DIMM 8 I/O ports 30mm 4-socket, 32DIMM 16 I/O 60mm 2-socket, 40DIMM 8 I/O  60mm
eX5 System Details
Intel Generic Boxboro-EX 4 Socket ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],MB MB MB MB MB MB MB MB MB MB MB MB MB MB MB MB Intel® QuickPath interconnects Boxboro X4 ESI Boxboro ICH 10* Nehalem-EX Nehalem-EX x8 x8 2x4 x8 x4 x8 x8 x8 x16 x8 x4 x8 x16 2x4 2x4 2x4 X4 PCIe Gen1 Nehalem-EX Nehalem-EX
Intel Generic Boxboro-EX 2 Socket Platform ,[object Object],[object Object],[object Object],[object Object],[object Object],Validated Configuration Boxboro-EX 2S (2 IOH) Tylersburg-EP (2 IOH) # of cores per CPU Up to 8 Up to 4 QuickPath Interconnect 4^ 2 # of DIMMs 32 18 PCIe lanes 72+10 72+6 Boxboro X4 ESI Boxboro ICH 10* Nehalem-EX Nehalem-EX x8 x8 2x4 x8 2x2 x4 x8 x8 x8 x16 x8 2x2 x4 x8 x16 2x4 2x4 2x4 X4 PCIe Gen1 Intel® QuickPath interconnects
Intel ®  Xeon ®  7500/6500 Platform Memory ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],RDIMM RDIMM RDIMM RDIMM SMB Nehalem-EX 7500/6500 4 SMI 2 DDR3 Up to 16 DIIMS ^SMI^SMI/SMB = Intel Scalable Memory Interconnect / Scalable Memory Buffer ^ SMI^SMI/SMB = Intel Scalable Memory Interconnect / Scalable Memory Buffer ** Memory speed sett by UEFI ; All channels in a system will run at the fastest  common  frequency
x3850 X5
x3850 X5:  4-socket 4U x86 (Nehalem EX) platform 6 Fans 2x – 1975 W P/S (2x) 1975W Rear Access  Hot Swap, Redundant P/S (4x) Intel Xeon EX CPU’s (8x) Memory Cards – 8 DDR3 DIMMs per card 7x - PCIe Gen2 Slots 2x 60mm Hot Swap Fans (8x) Gen2 2.5” Drives or (16x) 1.8” SSD Drives  (2x) 120mm Hot Swap Fans Dual USB DVD Drive Light Path Diagnostics  RAID (0/1) Card,  RAID 5/6 Optional 4U Rack Mechanical Chassis Front view
x3850 X5:  4-socket 4U x86 (Nehalem EX) platform QPI cables (2x) 1975W Rear Access  Hot Swap, Redundant P/S w/120mm fan (4x) PCIe full length  (3x) PCIe half length x8 Dual Backplane – SAS & SSD Redundant w/220VAC only 4U Rack Mechanical Chassis Rear view
System Images – Interior PS1 PS2 Boxborro 2 Boxborro1 M5015 RAID HS Fan Pack PCIe x16 PCIe x4 PCIe x8 PCIe x8 PCIe x8 PCIe x8 PCIe x8 USB System Recovery Jumpers CPU1 CPU2 CPU3 CPU4 Slot  7 Slot  6 Slot  5 Slot  4 Slot  3 Slot  2 Slot  1 Mem Card 1 Mem Card 2 Mem Card 3 Mem Card 4 Mem Card 5 Mem Card 6 Mem Card 7 Mem Card 8 SAS Backplanes + HDD Cage
x3850 X5 Memory Card Current : x3850/x3950 M2 Memory Card New : x3850/x3950 X5 Memory Card Specifications : 64 DDR3 DIMMs 32 buses @ 1066M 2 DIMMs per bus SMI (FBD2) 16 buses Each @ 6.4GT/s  (2B Rd/1B Wr) PC3-10600R LP DIMMs 1GB,  x8, 1R, 1Gb 2GB,  x8, 2R, 1Gb PC3-8500R LP DIMMs  4GB,  x8, 4R, 1Gb 8GB,  x8, 4R, 2Gb 16GB, x4, 4R, 2Gb
System Images – Chassis View Front Access 120mm fans Rear I/O Shutttle Rear Access HS PSUs - lift up  on handle then pull out QPI Scalability Ports / Cables
System Images – CPU and Memory Memory Cards CPU and Heatsink installation
System Images – Options M1015 RAID card and Installation bracket 8 HDD SAS Backplane
x3850 X5 – Hardware; Speeds and Feeds ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]
x3850 X5 – Hardware; Speeds and Feeds Cont. ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]
x3850M2 to x3850X5 Transition Subsystem x3850M2 x3850 X5 PSU 1440W  hot swap, full redundancy  HIGH line,  720W low line.  Rear Access.  No PS option, 2 std.  1975W  hot swap, full redundancy  HIGH line,  875W low line. Rear Access.  No PS option, 2 std. Config restrictions at 110V. CPU Card No VRDs, 4 VRMs, Top access to CPU/VRM and CPU card  No VRMs, 4 VRDs, Top access to CPUs and CPU card Memory 4 Memory cards, DDR2 PC2-5300 running at 533Mbs. 8 DIMMs per memory card (32 DIMMs per chassis max) 8 Memory cards, DDR3 PC3-10600 running at 1066Mbs. 8 DIMMs per memory card (64 DIMMs per chassis max)  PCIe Board CalIOC2 2.0,  Slots = 7@2.5Gb  PCIE x8, slots 6-7 hot plug  Boxboro EX,  Slots = 7@5GHz  Slot1 x16, Slot2 x4, Slots 3-7 x8 No hotswap.  SAS Controller LSI Logic 1078 w/RAID1 (no key),  Elliott Key for RAID5, SAS 4x  external port  Ruskin IR or Fareham MR adapter  Battery option for Fareham  Ethernet Controller BCM 5709 Dual Gigabit Ethernet  PCIE x4 attach to Southbridge  BCM 5709 Dual Gigabit Ethernet  PCIE x4 Gen2 attach to Boxboro Dual 10Gb Emulex adapter in PCIe  Slot 7 on some models  Video Controller ATI RN50 on RSA2, 16MB  Matrox G200 in IMM, 16MB Service Processor RSA2 standard Maxim VSC452 Integrated BMC  (IMM) SAS Design Four 2.5 Inch internal  + 4x external  Eight 2.5 Inch internal  Support for SATA, SSD  USB, SuperIO Design  ICH7, 5 external ports, 1 internal, No  SuperIO, embedded 512M key, No PS2 Kb/Ms, No FDD controller  ICH10, 6 external ports, 2 internal, No SuperIO, embedded 512M key, No PS2 Kb/Ms, No FDD controller Fans 4 x 120mm, 2 x 92mm, 8 total  (2 x 80mm in Power supplies)  2 x 120mm, 2 x 60mm, 6 total  2 x 120mm in Power Supplies
x3850 X5 configuration flexibility Base System Shipping today Memory Expansion with MAX5 via QPI Shipping today Native Scaling via QPI Shipping today Memory Expansion  and Scaling with MAX5 via QPI and EXA Available 2011
Xeon 8-socket interconnect block diagram  QPI Cable Links for QPI bus Four QPI cables 1 2 4 3 3 4 2 1 QPI 3 0 3 0 2 2 0 0 2 2 2 2 2 0 0 2 3 3 3 3 1 3 3 1 Cable cross connects CPUs 2 and 3
x3850 X5 with native QPI scaling Connects directly via QPI bus QPI Cables Intel Xeon Intel Xeon MB1 MB1 MB1 MB1 MB1 MB1 MB1 MB1 Intel Xeon MB1 MB1 MB1 MB1 MB1 MB1 MB1 MB1 Intel Xeon Intel Boxboro PCI-E Intel Boxboro PCI-E Intel Xeon Intel Xeon MB1 MB1 MB1 MB1 MB1 MB1 MB1 MB1 Intel Xeon MB1 MB1 MB1 MB1 MB1 MB1 MB1 MB1 Intel Xeon Intel Boxboro PCI-E Intel Boxboro PCI-E
x3850 8-socket QPI scaling A D B C REAR VIEW OF CHASSIS QPI 1-2 QPI 3-4 x3850 #1 QPI 1-2 QPI 3-4 x3850 #2
x3850 X5 with MAX5 using QPI Intel Xeon Intel Xeon MB1 MB1 MB1 MB1 MB1 MB1 MB1 MB1 Intel Xeon MB1 MB1 MB1 MB1 MB1 MB1 MB1 MB1 Intel Xeon Intel Boxboro PCI-E Intel Boxboro PCI-E MAX5 MB1 MB1 MB1 MB1 MB1 MB1 MB1 MB1 Connects directly to each CPU via QPI bus 6.4 GT/s MB1 MB2 1 3 8 6 2 4 7 5 DDR3 Memory DIMMs Memory Buffer SMI Link to Firehawk EXA port
x3850 X5 to MAX5 QPI cabling eX5 Memory Drawer End x3850 X5 End
8-socket x3850 X5 with MAX5 using QPI and EXA Connects directly to each CPU via QPI bus 6.4 GT/s Connects via EXA
eX5 Rack Memory Expansion Module Configurations 1G x3850 X5 4U (2) x16, (10) x8, (2) x4 (1) x16, (5) x8, (1) x4 (2) x16, (10) x8, (2) x4 (1) x16, (5) x8, (1) x4 PCI-E Slots 8 No QPI 96 4 5u 1G  + 1D  2G + 2D  2G  1G  Configuration  4S No No Partition EXA QPI None Scaling 8 192 8 10u 5 128 8 8u 8 64 4 4u Processor SKUs Supported DIMMS CPU’s Size 1G+1D x3950 X5 4U Memory Drawer 1U QPI  2G+2D Memory Drawer 1U Memory Drawer 1U x3950 X5 4U x3950 X5 4U QPI  QPI  EXA  2G x3850 X5 4U x3850 X5 4U QPI
x3850 X5 System Population Guidelines ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]
x3850 X5 DIMM Population Rules ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],CPU MC2 MC1 Memory Buffer 2 Memory Buffer 2 Memory Buffer 1 Memory Buffer 1 DIMM 2 DIMM 1 DIMM 4 DIMM 3 DIMM 7 DIMM 5 DIMM 8 DIMM 6 DIMM 6 DIMM 8 DIMM 7 DIMM 1 DIMM 3 DIMM 2 DIMM 4 DIMM 5 Memory  Card 1 Memory  Card 2 SMI Lane 1 SMI Lane 4 SMI Lane 2 SMI Lane 3 Channel 0 Channel 0 Channel 0 Channel 0 Channel 1 Channel 1 Channel 1 Channel 1 Optimally expandable memory config is 2 memory cards / CPU, 4 DIMMs / memory card, equal amounts of memory / card
x3850 X5 PCIe Slot Population Plug one PCIe card / Boxboro before moving to next set of slots Card # PCIe Slot # 1 1 2 5 3 3 4 6 5 4 6 7 7 2
ServeRAID M5015, M1015, BR10i and upgrades IBM’s new portfolio beats HP in performance and data protection, and is now upgradeable! Option SBB/MFI  Description 46M0829 46M0850 ServeRAID M5015 SAS/SATA Controller  46M0831 46M0862 ServeRAID M1015 SAS/SATA Controller  44E8689 44E8692 ServeRAID-BR10i  SAS/SATA Controller   46M0930 46M0932 ServeRAID M5000 Series Advance Feature Key ,[object Object],[object Object],Intelligent Battery Backup Unit (iBBU) for ultimate data protection ,[object Object],[object Object],Flexible offerings with numerous optional upgrades  can span low cost to enterprise customer needs  ,[object Object],Higher performance than HP ,[object Object],[object Object],[object Object],Improved usability in MegaRAID Storage Manager Customer Benefits Key Features M5000 Key M5015 BR10i x3850 X5 M5000 Key M5015 M1015 x3690 X5 RAID 6/60 & Encryption (Optional) RAID 5/50 (Optional) RAID 0/1/10 (Standard)
Emulex 10GbE Virtual Fabric Adapter for IBM System x * FCoE and vNIC support will be available post-announce Simplified networking, trusted SAN Interoperability, and increased business agility Option SBB/MFI  Description 49Y4250 49Y4253 Emulex 10GbE Virtual Fabric Adapter for IBM System x ,[object Object],[object Object],[object Object],I/O Convergence ,[object Object],[object Object],Common Solution ,[object Object],[object Object],Scalability & Performance for Virtualization ,[object Object],[object Object],[object Object],Flexibility Customer Benefits Key Features
8Gb Fibre Channel HBAs for IBM System x Option SBB/MFI  Description 42D0485 42D0486  Emulex 8Gb FC Single-port HBA for IBM System x 42D0494 42D0495  Emulex 8Gb FC Dual-port HBA for IBM System x 42D0501 42D0502  QLogic 8Gb FC Single-port HBA for IBM System x 42D0510 42D0511  QLogic 8Gb FC Dual-port HBA for IBM System x 46M6049 46M6051  Brocade 8Gb FC Single-port HBA for IBM System x 46M6050 46M6052  Brocade 8Gb FC Dual-port HBA for IBM System x Did you know? In-flight data encryption provides end-to-end security while solving the business challenges posed by security and regulatory compliance Unified SAN Management tools can easily manage and optimize resources by extending fabric intelligence and services to servers saving you valuable management dollars True low-profile MD2 form factor is ideal for space limited server environments 8Gb Fibre Channel HBAs can auto-negotiate with 4Gb and 2Gb environments providing investment protection Enhancing SAN connectivity with 8Gb Fibre Channel from industry leading partners ,[object Object],Lower CAPEX with hardware consolidation and simplified cabling infrastructure ,[object Object],Lower OPEX due to reduced power and cooling cost ,[object Object],Investment protection ,[object Object],End-to-end management Customer Benefits Key Features
Converged Networking Technologies significantly reduce TCO with smaller storage footprint,  lower cooling, lower power, and simplified management 10Gb CNAs for IBM System x Option SBB/MFI  Description 42C1800 42C1803 Qlogic 10Gb CNA for IBM System x  49Y4218 49Y4219 QLogic 10Gb SFP+ SR Optical Transceiver  42C1820 42C1823 Brocade 10Gb CNA for IBM System x  49Y4216 49Y4217 Brocade 10Gb SFP+ SR Optical Transceiver ,[object Object],[object Object],[object Object],Lower CAPEX with hardware consolidation and simplified cabling infrastructure ,[object Object],Lower OPEX due to reduced power and cooling cost ,[object Object],Investment protection ,[object Object],End-to-end management Customer Benefits Key Features
[object Object],[object Object],[object Object],[object Object],[object Object],Superior solution to enterprise disk drives for applications sustaining high operations per second – e.g. database, data warehouse, stream analytics Option SBB/MFI  Description 46M0877 46M0888 IBM 160GB High IOPS SS Class SSD PCIe Adapter 46M0898 46M0900 IBM 320GB High IOPS MS Class SSD PCIe Adapter The performance of a SAN in the palm of your hand IBM’s High IOPS SSD PCIe Adapters
x3690 X5
(1x) x16 (full height, full length  or (2x) x8 (1 full size, 1 full height / half length)  (2x) PCIe x8 Low Profile (4x) N+N 675W Rear Access Hot Swap Redundant P/S (16x) Gen2 2.5” Drives or (24x) 1.8” SSD Drives  2 Scalability cables for eX5 Memory Expansion (16x) DDR3 Memory DIMMs Upper mezzanine 8x Intel Memory Buffers (BoB’s) Intel Nehelam EX processor details, staired heat sinks x3690 X5:  2-socket 2U platform 2U Rack Mechanical Chassis Top view Maximum performance, maximum memory for virtualization and database applications
QPI Cable cage (2x) 1Gb Ethernet (2 std, 2 optional) x3690 X5:  2-socket 2U platform 2U Rack Mechanical Chassis Rear view Maximum performance, maximum memory for virtualization and database applications
x3690 X5 – Hardware; Speeds and Feeds ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]
x3690 X5 – Hardware; Speeds and Feeds Cont. ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]
x3690 X5 – Inside, No Memory Mezzanine (2x) Intel Xeon EX CPU’s Memory Mezzanine Connectors (16x) DDR3 Memory DIMMs Base Planar (4x) Intel Memory Buffers (BoB’s) Base Planar (2x) USB (front) Light Path Diagnostics  UltraSlim SATA DVD Drive Front video
x3690 X5 – Inside, Memory Mezzanine Installed (1) PCIe2 x16 FHFL or (2) PCIe2 x8 FHHL  (2) PCIe2 x8 Low Profile & (1) PCIe2 x4 LP (x8 connector) (4x) N+N Redundant 675W Hot Swap Power Supplies (16x) Gen2 2.5” SAS/SATA Drives  (16x) DDR3 Memory DIMMs Upper Memory Mezzanine (4x) Intel Memory Buffers (BoB’s) Upper Memory Mezzanine (5x) Hot Swap Redundant Cooling Fans Redundant Power Interposer
x3690 X5 – Front / Rear Views
x3690 X5 – System Planar (2) QPI Scalability Connections Shown with Cable Guide Installed Intel Boxboro IOH Intel ICH10 Southbridge Processor Socket 1 Processor Socket 2 Memory Mezzanine Connectors
x3690 X5 – Memory Mezzanine (4) Intel Memory Buffer Memory Buffers (16) DDR3 DIMM Sockets
x3690 X5 – PCIe Slots 3-5 LP PCIe2 x8 Slot 3 LP PCIe2 x4 Slot 4 (x8 Connector) Internal USB Hypervisor Spare Internal USB LP PCIe2 x8 Slot 5 (Emulex10Gb enabled)
x3690 X5 – Redundant Power Interposer Power Supply 3 & 4 Connectors System Planar Connections
eX5 QPI cables for MAX5 memory expansion eX5 Memory Drawer Side x3690 X5 Side
Possible x3690 X5 Configurations 2M+2D 1M+1D 2M 1M Configuration  Size CPU’s DIMMS PCI-E Slots Scaling Partitioning Processor SKUs Supported 1M 2U 2 32 (1) x16 or (2) x8, and (2) x8 LP None Software - OS 11 1M  + 1D  3U 2 64 (1) x16 or (2) x8, and (2) x8 LP QPI Software - OS 10 2M 4U 4 64 (2) x16 or (4) x8, and (4) x8 LP QPI Software - OS 8 2M + 2D 6U 4 128 (2) x16 or (4) x8, and (4) x8 LP QPI/EXA Physical - EXA 10 Ghidorah 4U Memory Drawer 1U QPI  x3690 X5  2U Memory Drawer 1U QPI  EXA  x3690 X5  2U QPI  x3690 X5  2U x3690 X5  2U Memory Drawer 1U QPI  x3690 X5  2U x3690 X5  2U
MAX5
[object Object],[object Object],[object Object],MAX5 for x3690 X5 and x3850 X5 1U Rack Mechanical Chassis Top view Buffer on Board - Memory Buffer N+N 650W Power Supplies QPI Link Ports EXA Scalability Ports Firehawk memory and node controller 32 Memory Dimms Lightpath Diagnostics 1U Rack Mechanical Chassis Top view eX5 memory expansion and scalability for leadership performance and increased utilization
MAX5 for System x front and rear views Redundant 675W Power Supplies Lightpath Diagnostics QPI Ports EXA Ports Hot swap fans Front Rear System removes from chassis for easy access
MAX5 for System x top view Memory Buffers QPI Ports EXA Ports Firehawk Chipset 32 Memory Dimms ,[object Object],[object Object]
MAX5 for rack systems front and rear view
x3850 X5 with MAX5 using QPI Intel Xeon Intel Xeon MB1 MB1 MB1 MB1 MB1 MB1 MB1 MB1 Intel Xeon MB1 MB1 MB1 MB1 MB1 MB1 MB1 MB1 Intel Xeon Intel Boxboro PCI-E Intel Boxboro PCI-E MAX5 MB1 MB1 MB1 MB1 MB1 MB1 MB1 MB1 Connects directly to each CPU via QPI bus 6.4 GT/s MB1 MB2 1 3 8 6 2 4 7 5 DDR3 Memory DIMMs Memory Buffer SMI Link to Firehawk EXA port
x3850 X5 to MAX5 QPI cabling eX5 Memory Drawer End x3850 X5 End
8-socket x3850 X5 with MAX5 using QPI and EXA Connects directly to each CPU via QPI bus 6.4 GT/s Connects via EXA
x3690 X5 and MAX5 ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],PCI-E Intel NHM-EX MAX5 Intel NHM-EX PCI-E Intel NHM-EX Intel NHM-EX Intel Boxboro EXA Scale Up (3) Ports Intel Boxboro
MAX5 connectivity for rack systems ,[object Object],[object Object],[object Object],[object Object],[object Object],MAX5 1U Nehalem Nehalem PCI-E Nehalem PCI-E Nehalem 4U x3850 X5 MAX5 1U Nehalem Nehalem PCI-E 2U x3690 X5 QPI QPI QPI QPI QPI QPI EXA Scaling Connects directly to each CPU via QPI bus 6.4 GT/s EXA Scaling MB1 MB2 1 3 8 6 2 4 7 5 DDR3 Memory DIMMs Memory Expander/Buffer SMI Link to EXA5 Boxboro Boxboro Boxboro
MAX5 Technical Specs ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]
HX5
HX5 – 2 to 4 Socket Blade ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],2S, 40DIMM 60mm 2S, 16DIMM 30mm 4S, 32DIMM 60mm Intel Boxboro PCI-E MB1 MB1 MB1 MB1 Intel NHM-EX MB1 MB1 MB1 MB1 Intel NHM-EX Intel Boxboro PCI-E MB1 MB1 MB1 MB1 Intel NHM-EX MAX5 MB1 MB1 MB1 MB1 MB1 MB1 MB1 MB1 MB1 MB1 Intel NHM-EX
HX5 – 2- & 4-Socket Blade Top view of 4-socket system shown 2x Intel Xeon EX CPUs 2x IO Expansion Slots (1x CIOv + 1x CFFh) 16x VLP DDR3 Memory 2x SSD drives (1.8”) 2x 30mm nodes ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],Scale  Connector 8x memory buffers
MAX5 for HX5 24x VLP DDR3 memory 6x memory buffers ,[object Object],[object Object],MAX5 HX5 ,[object Object],[object Object],[object Object],[object Object]
HX5 Configurations 1 2 3 2S, 40D, 60mm 2S, 16D, 30mm 4S, 32D, 60mm *Not required for operation, but strongly recommended for optimal performance 40 32 16 DIMMS 2 4 2 SSDs (max) 3 2 1 (59Y5877) IBM HX5 MAX5 1-node scalability kit (46M6975) IBM HX5 2-node scalability kit (59Y5889) IBM HX5 1-node Speed Burst card * Additional Required Options 8 ports; 2x 1GE LOM, 1x CIOv, 1x CFFh 16 ports; 4x 1GE LOM, 2x CIOv, 2x CFFh 8 ports: 2x 1GE LOM, 1x CIOv, 1x CFFh I/O Slots QPI 4 (95W, 105W) 60mm HX5 + HX5  QPI 2  (95W, 105W) 30mm HX5  HX5 + MAX5  Configuration  QPI Scaling 2 (95W, 105W, 130W) 60mm CPU’s Size
HX5 Operating System Support All NOS apply to both HX5 and HX5+MAX5 models Note:  Solaris 10 support WIP U5, which includes KVM support. N-1 1 & 2 P2-Hammerhead P1-Thresher Red Hat Enterprise Linux 5 Server, 64-bit U5, which includes KVM support. N-1 1 & 2 P2 Red Hat Enterprise Linux 5 Server with Xen, 64-bit 1 & 2 1 & 2 1 & 2 1 & 2 1 & 2 1 & 2 1 & 2 1 & 2 1 & 2 1 & 2 Nodes U1. Emulex Tiger Shark - no drivers.  Driver for Intel 10G NIC will be async - not in kernel.  No CIM provider for SAS-2. Waiting on code from LSI. No way to manage SAS-2. N P1 VMWare ESXi 4.0 N P2 SUSE Linux Enterprise Server 11 with Xen, 64-bit SP3 N-1 P2 SUSE Linux Enterprise Server 10, 64-bit SP3 N-1 P2 SUSE Linux Enterprise Server 10 with Xen, 64-bit N N N-1 N N N N / N-1 P3 for Hammerhead, to be moved to P2 immediately following initial SIT Exit.  Test completion outlook is 4-6 weeks after initial SIT Exit. P2 for Thresher. P3-Hammerhead P2-Thresher Red Hat Enterprise Linux 6, 64-bit SP2 P1 Windows Server 2008, 64-bit (Std, Ent, Web, DC) U1 P1 VMware ESX 4.0 P1 SUSE Linux Enterprise Server 11, 64-bit Comments Pri NOS SP2 P3 Windows HPC Server 2008 P1 Windows Server 2008 R2 (64-bit)
HX5 & Westmere support in BladeCenter H chassis ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],Shipping today 7/13 ANN – 8/23 GA New blowers & PSUs New MTM Source: BCH Power Matrix 25JAN10_elb.xls Paper analysis, tests pending BC-H 4TX BCH 4SX* 2980W High Efficiency No support 14 7* 14/7* Legacy blowers 2900W 14* 14 7* 14/7* Enhanced blowers No support 14 7* 14 / 7* Legacy blowers 2980W 14* 14 7* 14 / 7* Enhanced blowers Enhanced blowers 14 14 7 14 /7 HS22 WSM 130W  Westmere up to 95W (HS22 & HS22V) HX5 w/ MAX5 130W HX5 / HX5+MAX5 95W & 105W
HX5 & Westmere support in BCE, BCS, BCHT & BCT Source: BCH Power Matrix 25JAN10_elb.xls ^^ Throttling / over-subscription enabled No support Up to 95W TBD 12 Enterprise 6 6 3 6 BCS No support Up to 80W CPU No support No support NEBS BCHT No support Same as NEH-EP HS22 No support No support 2000W No support 14^^ No support No support 2320W BC-E HS22 WSM 130W  Westmere (HS22 & HS22V) HX5 w/ MAX5 130W HX5  95W / 105W
Nehalem EX Memory Frequencies ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]
DIMM Population Rules Memory  Controller-1 QPI Memory  Controller-2 Mill Brook 1 Mill Brook 2 Mill Brook 3 Mill Brook 4 DIMM  Pair SMI 4 SMI 1 SMI 2 SMI 3 QPI (x4) Memory  Controller-3 QPI Memory  Controller-4 Mill Brook 5 Mill Brook 6 Mill Brook 7 Mill Brook 8 SMI 8 SMI 5 SMI 6 SMI 7 Core 5 Core 6 Core 7 Core 8 Core 1 Core 2 Core 3 Core 4 24MB L3 Cache ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],Core 5 Core 6 Core 7 Core 8 Core 1 Core 2 Core 3 Core 4 24MB L3 Cache
IBM MAX5 for BladeCenter Technical Specs ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],EXA Scaling ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],MAX5 2S HX5+MAX5 (2-sockets, 40 DIMMs) QPI MB1 MB2 1 3 8 6 2 4 7 5 DDR3 Memory DIMMs Millbrook Memory Expander/Buffer SMI Link FireHawk Intel Boxboro PCI-E MB1 MB1 MB1 MB1 Intel NHM-EX MAX5 MB1 MB1 MB1 MB1 MB1 MB1 MB1 MB1 MB1 MB1 Intel NHM-EX
Why use MAX5 ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]
Technical items you need to know about MAX5 ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]
HX5 I/O Daughter Card Support Upper Card Lower CFFh Card CFFh outline ,[object Object],[object Object],[object Object],[object Object],CIOv Card CFFh CIOv (1Xe)
HX5 Blade, CFFh Support Blade Server 1 CFFh PCIe 8x + 8x On-Board 1GbE 4 Lane 1 Lane Mid-Plane 1 Lane 4 Lane Switch 7 Switch 8 Switch 9 Switch 10 SM1 (Ethernet) (Ethernet) SM3 SM4 SM2 8 10 1 2 7 9 CIOv PCIe 8x 3 4 Upper 4Xe ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],Blade Server #n SSD  Expansion Card
SSD card w/ CFFh  SSD card CFFh Housing  for 2x 1.8” SSDs Gigarray  Connector ,[object Object],[object Object],[object Object],[object Object],[object Object],SSD Expansion Card for IBM BladeCenter HX5 SSD support in HX5 -  Solid State Drive Expansion Card
Processor Information
Intel® Xeon® Roadmap 2010 2008 Nehalem - EX Boxboro Chipset / OEM Boxboro – EX  Intel ®  5100 Chipset Intel ®  5000V Intel® 3200 Chipset Garlow  Platform IBM x3350 Ibex Peak PCH Nehalem – EP 5500 Series Tylersburg – 36D Chipset Tylersburg - EP Platform Westmere-EP Cranberry Lake Platform (HS 12) Bensley-VS Intel® 5000P/5400 Chipset Bensley Platform, HS 21, HS 21 XM x3650… Quad-Core Xeon® proc. 7300 series Caneland Platform IBM x3850/x3950 M2 Intel® 7300 Chipset/OEM Chipsets Dunnington 7400 Series Tylersburg – 24D Chipset Tylersburg - EN Platform Westmere-EP Nehalem – EP 5500 Series Expandable 7000 Efficient Performance 5000  Entry 5000 Workstation/HPC Foxhollow Platform QPI PCIe 2.0 QPI QPI Nehalem – EP 5500 Series Dual Tylersburg – 36D Chipset Tylersburg - WS Platform 5400  Chipset Stoakley Platform IBM x3450 Westmere - EP PCIe 2.0 QPI PCIe 2.0 PCIe 2.0 PCIe 2.0 PCIe 2.0 2009 *Other names and brands may be claimed as the property of others Copyright © 2008  Intel Corporation. All products, dates and figures are preliminary, for planning purposes only and are subject to change without notice.  Sandy Bridge Transition future Xeon® proc. 3300 series Xeon® proc. 3100 series Lynnfield (Nehalem based) Havendale (Nehalem based) Xeon® proc 5400 series Xeon® proc 5200 series Xeon® proc 5400 series Xeon® proc 5200 series Xeon® proc 5400 series Xeon® proc 5200 series
Intel Nehalem-EX: Designed For Modularity QPI:   Intel ®  QuickPath Interconnect #QPI Links # mem channels Size of cache # cores Power Manage- ment Type of Memory Integrated graphics Differentiation in the “Uncore”: DRAM QPI Core Uncore C O R E C O R E C O R E IMC QPI Power  & Clock … QPI … … … L3 Cache
Intel Nehalem-EX Overview ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],24M Shared Last Level Cache Integrated Memory Controller Interconnect controller 4 Full-width  Intel ®  QuickPath Interconnects  4 Intel® Scalable Memory Interconnects Driving performance through Multi-threaded, Multi-Core Technology in addition to platform enhancements C O R E 1 C O R E 2 C O R E 3 C O R E 4 C O R E 5 C O R E 6 C O R E 7 C O R E 8
[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],Latest and Next Generation Intel Xeon Processor ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]
Quick QPI Overview 25-Feb-09 ,[object Object],[object Object],[object Object],IBM Confidential
Nehalem-EX SKU Line-up X6550 2Ghz  / 18M / 6.4GT/s E6540 2Ghz / 18M / 6.4GT/s X7560 2.26Ghz / 24M / 6.4GT/s  X7550 2Ghz  / 18M / 6.4GT/s 8S/Scalable* 4S/Scalable* L7555 1.86Ghz /  24M  / 5.86GT/s E7530 1.86Ghz / 12M / 5.8GT/s 1.0 0.91 0.89 0.44 0.72 0.65 E7520 1.86Ghz / 18M /  x4.8GT/s 0.49 0.89 X7542 2.66Ghz / 12M / 5.86GT/s 0.60 EX High Perf. LV L7545 1.86Ghz  / 18M / 5.86GT/s 0.69 E7540 2Ghz / 18M / 6.4GT/s 0.72 Turbo: 0/1/3/5 Turbo: 1/2/4/5 Advanced Standard Basic 6-8 Cores  95W  HT / Turbo / S8S* 6 Cores   130W Turbo / S8S* No Hyper-Threading 8 Cores Hyper-Threading Turbo: 1/2/3/3 130W 6 Cores Hyper-Threading Turbo: 0/1/1/2 105W 4 Cores Hyper-Threading 95W-105W 95W 8C 6C HPC Turbo: 0/1/1/1 E6510 1.73Ghz / 12M / 4.8GT/s 2S Only. Not Scalable 105W 2S/Scalable* ,[object Object],[object Object],Processor Number Core Freq / LL Cache /  QPI/SMI Max Link Speed .XX = approx rel. TPC-C perf.  (single skt in 1S, 2S or 4S config) Turbo bin upside (133Mhz increments) 7-8C/5-6C/3-4C/1-2C
X7560 2.26Ghz / 24M / 6.4GT/s  X7550 2Ghz  / 18M / 6.4GT/s 8S/Scalable 4S/Scalable L7555 1.86Ghz /  24M  / 5.86GT/s E7530 1.86Ghz / 12M / 5.8GT/s E7520 1.86Ghz / 18M /  x4.8GT/s X7542 2.66Ghz / 18M / 5.86GT/s EX High Perf. LV L7545 1.86Ghz  / 18M / 5.86GT/s E7540 2Ghz / 18M / 6.4GT/s Turbo: 0/1/3/5 Turbo: 1/2/4/5 Standard Basic 6-8 Cores  95W  HT / Turbo / S8S 6 Cores   130W Turbo / S8S No Hyper-Threading 8 Cores Hyper-Threading Turbo: 1/2/3/3 130W 6 Cores Hyper-Threading Turbo: 0/1/1/2 105W 4 Cores Hyper-Threading 95W-105W 95W 8C 6C HPC Turbo: 0/1/1/1 2S/Scalable x3850 X5 – Supported Processor SKUs Advanced
X6550 2Ghz  / 18M / 6.4GT/s E6540 2Ghz / 18M / 6.4GT/s X7560 2.26Ghz / 24M / 6.4GT/s  X7550 2Ghz  / 18M / 6.4GT/s 8S/Scalable 4S/Scalable L7555 1.86Ghz /  24M  / 5.86GT/s E7530 1.86Ghz / 12M / 5.8GT/s E7520 1.86Ghz / 18M /  x4.8GT/s X7542 2.66Ghz / 12M / 5.86GT/s EX High Perf. LV L7545 1.86Ghz  / 18M / 5.86GT/s E7540 2Ghz / 18M / 6.4GT/s Turbo: 0/1/3/5 Turbo: 1/2/4/5 Standard Basic 6-8 Cores  95W  HT / Turbo / S8S 6 Cores   130W Turbo / S8S No Hyper-Threading 8 Cores Hyper-Threading Turbo: 1/2/3/3 130W 6 Cores Hyper-Threading Turbo: 0/1/1/2 105W 4 Cores Hyper-Threading 95W-105W 95W 8C 6C HPC Turbo: 0/1/1/1 E6510 1.73Ghz / 12M / 4.8GT/s 2S Only. Not Scalable 105W 2S/Scalable x3690 X5 – Supported Processor SKUs Advanced
Intel Nehalem EX Processor Stack…HX5 Delivering a full range of CPUs to compete at every cost point E7530 1.86Ghz/12M/5.8GT/s 2S/4S Scalable ,[object Object],[object Object],Basic ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],Standard Advanced X7560 2.26Ghz/24M/6.4GT/s 2S/4S/8S Scalable 130W  HX5 Standard Models / CTO / Special Bids  without  memory sidecar X7550 2.00Ghz/18M/6.4GT/s 2S/4S/8S Scalable 130W X6550 2.00Ghz/18M/6.4GT/s 2S capable only 130W L7555 1.86GHz/24M/5.86GT/s 2S/4S/8S Scalable; T 1/2/4/5 95W E7540 2.00GHz/18M/6.4GT/s 2S/4S/8S Scalable 105W E6540 2.00Ghz/18M/6.4GT/s 2S capable only 105W L7545 1.86GHz/18M/5.86GT/s 2S/4S/8S Scalable; T 0/1/1/2 95W 105W E6510 1.73Ghz/12M/4.8GT/s 2S capable only 105W E7520 1.86GHz/18M/4.8GT/s 2S/4S Scalable 95W  X7542 2.66Ghz/18M/5.86GT/s; !HT 2S/4S/8S Scalable; T 0/1/1/1 130W    HX5 CTO / Special Bids (no standard models)  without  memory sidecar  HX5 Standard Models / CTO / Special Bids  with  memory sidecar  HX5 CTO / Special Bids (no standard models)  with  memory sidecar    Not scalable            HX5 HX5+MAX5 Delayed availability (w/ 2S HX5+MAX5) Delayed availability (w/ 2S HX5+MAX5) Delayed availability (w/  4S HX5+MAX5 )
Processor SKUs HX5 w/ MAX5 E7530 1.86Ghz/12M/5.8GT/s 2S/4S Scalable ,[object Object],[object Object],Basic ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],Standard Advanced X7560 2.26Ghz/24M/6.4GT/s 2S/4S/8S Scalable 130W X7550 2.00Ghz/18M/6.4GT/s 2S/4S/8S Scalable 130W X6550 2.00Ghz/18M/6.4GT/s 2S capable only 130W L7555 1.86GHz/24M/5.86GT/s 2S/4S/8S Scalable; T 1/2/4/5 95W E7540 2.00GHz/18M/6.4GT/s 2S/4S/8S Scalable 105W E6540 2.00Ghz/18M/6.4GT/s 2S capable only 105W L7545 1.86GHz/18M/5.86GT/s 2S/4S/8S Scalable; T 0/1/1/2 95W 105W E7520 1.86GHz/18M/4.8GT/s 2S/4S Scalable 95W X7542 2.66Ghz/18M/5.86GT/s; !HT 2S/4S/8S Scalable; T 0/1/1/1 130W  HX5 Standard Models / CTO / Special Bids  with  memory sidecar  HX5 CTO / Special Bids (no standard models)  with  memory sidecar           HX5 w/ MAX5 MAX5 optimized Delayed availability (w/  4S HX5+MAX5 ) ,[object Object],[object Object]
Technical Highlights:  Reliability
Trust Your IT ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]
IBM BladeCenter has no single point of failure  ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]
Redundant I/O Links ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],Intel Xeon Intel Xeon MB1 MB1 MB1 MB1 MB1 MB1 MB1 MB1 Intel Xeon MB1 MB1 MB1 MB1 MB1 MB1 MB1 MB1 Intel Xeon I/O Hub PCI-E I/O Hub PCI-E X
QPI & SMI Link Fail Strategy ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]
QPI & SMI Link Fault Handling ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]
QPI Link Failure Service Actions ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]
Differentiation with Memory RAS Maximum reliability for maximum benefits IBM mainframe inspired technology that provides superior reliability that keeps your business going.  ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]
Xeon & eX5 Memory Fault Handling ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]
Memory Fault Handling ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]
Changes to reliability features ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]
Technical Highlights:  Performance
[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],[object Object],What technical items do I need to know about eX5?
IBM  x3690 X5 + MAX5 memory map setup options 0G 3G 4G 17G 33G 49G 65G CPU1 CPU1 CPU2 CPU1 CPU2 CPU1 CPU1 CPU2 UNASSIGNED 0G 3G 4G 17G 33G 65G (Setup Option) Pooled RHEL, SLES (Default) Partitioned to CPUs Windows, VMWare Example: 64GB, 32 x 2GB DIMMs, 1  x3690 X5, 2 CPUs (8 DIMMs each), 1 MAX5 (16 DIMMs)  1G MMIO IBM Confidential X5 Mem X5 Mem
IBM  x3850 X5 + MAX5 memory map setup options 0G 3G 4G 17G 33G 49G 65G 73G 81G 89G 97G CPU1 CPU1 CPU2 CPU3 CPU4 CPU1 CPU2 CPU3 CPU4 CPU1 CPU1 CPU2 CPU3 CPU4 UNASSIGNED 0G 3G 4G 17G 33G 49G 65G 97G (Setup Option) Pooled RHEL, SLES (Default) Partitioned to CPUs Windows, VMWare Example: 96GB, 48 x 2GB DIMMs, 1  x3850 X5, 4 CPUs, 8 Mem Cds (4 DIMMs each), 1 MAX5 (16 DIMMs)  1G MMIO IBM Confidential X5 Mem X5 Mem
IBM  x3850 X5 + MAX5 memory map 2-node example 0G 2G 4G 18G 34G 50G 66G 74G 82G 90G 98G CPU1 CPU1 CPU2 CPU3 CPU4 CPU1 CPU2 CPU3 CPU4 98G Primary Node Partitioned to CPUs Secondary Node Partitioned to CPUs Example: 192GB, 96 x 2GB DIMMs, 2  x3850 X5, 8 CPUs, 16 Mem Cds (4 DIMMs each), 2 MAX5 (16 DIMMs each)  2G MMIO IBM Confidential 256MB  L4 Cache creates small memory gap to next node OS Memory is 191.5GB CPU5 CPU6 CPU7 CPU8 114G 130G 146G 162G X5 Mem CPU5 CPU6 CPU7 CPU8 170G 178G 186G 194G X5 Mem
Trademarks IBM, the IBM logo, the e-business logo, Active Memory, Predictive Failure Analysis, ServeRAID, System i, System Storage, System x, Xcelerated Memory Technology, and XArchitecture are trademarks of IBM Corporation in the United States and/or other countries, or both. If these and other IBM trademarked terms are marked on their first occurrence in this information with a trademark symbol (® or ™), these symbols indicate U.S. registered or common law trademarks owned by IBM at the time this information was published. Such trademarks may also be registered or common law trademarks in other countries. A current list of IBM trademarks is available on the Web at  http://ibm.com/legal/copytrade.shtml .   Intel, the Intel Logo, Itanium, ServerWorks, and Xeon are registered trademarks of Intel Corporation in the United States, other countries, or both. Dell is a trademark of Dell, Inc. in the United States, other countries, or both. HP is a trademark of Hewlett-Packard Development Company, L.P. in the United States, other countries, or both. Linux is a registered trademark of Linus Torvalds in the United States, other countries, or both. Microsoft, Hyper-V, SQL Server, and Windows are trademarks or registered trademarks of Microsoft Corporation in the United States, other countries, or both. Red Hat is a trademark of Red Hat, Inc. SAP and all SAP logos are trademarks or registered trademarks of SAP AG in Germany and in several other countries. TPC, TPC-C, tpmC, TPC-E and tpsE are trademarks of the Transaction Processing Performance Council. UNIX is a registered trademark of The Open Group in the United States, other countries, or both. VMware, VMworld, VMmark, and ESX are registered trademark of VMware, Inc. in the United States and/or other jurisdictions. All other company/product names and service marks may be trademarks or registered trademarks of their respective companies. IBM reserves the right to change specifications or other product information without notice. References in this publication to IBM products or services do not imply that IBM intends to make them available in all countries in which IBM operates. IBM PROVIDES THIS PUBLICATION “AS IS” WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED, INCLUDING THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Some jurisdictions do not allow disclaimer of express or implied warranties in certain transactions; therefore, this statement may not apply to you.   This publication may contain links to third party sites that are not under the control of or maintained by IBM. Access to any such third party site is at the user's own risk and IBM is not responsible for the accuracy or reliability of any information, data, opinions, advice or statements made on these sites. IBM provides these links merely as a convenience and the inclusion of such links does not imply an endorsement. Information in this presentation concerning non-IBM products was obtained from the suppliers of these products, published announcement material or other publicly available sources. IBM has not tested these products and cannot confirm the accuracy of performance, compatibility or any other claims related to non-IBM products. Questions on the capabilities of non-IBM products should be addressed to the suppliers of those products. 
© IBM Corporation 2008. IBM Corporation Route 100 Somers, NY 10589 U.S.A. Produced in the United States of America,  October  2008. All rights reserved.

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IBM ex5 Technical Overview

  • 1. Enterprise X-Architecture 5 th Generation Systems for a Smarter Planet Technical Presentation March 30, 2010
  • 2.
  • 3. Client Challenges and eX5 Opportunity
  • 4.
  • 5.
  • 6.
  • 7. Maximize Memory Minimize Cost Simplify Deployment The broadest portfolio of systems optimized for your most demanding workloads
  • 8.
  • 10. eX5 leadership for an evolving marketplace with increasing demands 1 st Gen: First x86 server with scalable 16 processor design 2 nd Gen: First x86 server with 100 #1 Benchmarks 3 rd Gen: First x86 server with Hot-swap memory 4 th Gen: First x86 server to break 1 Million tpmC 5 th Gen: Breakthrough performance, ultimate flexibility, simpler management 2010 5th Generation 2003 2nd Generation 2005 3rd Generation 2007 4th Generation 2001 1st Generation
  • 11. eX5 Portfolio — Systems for a Smarter Planet Broad coverage for most enterprise applications, server consolidation, virtualized workload enablement. 4U / 4-Way Scalable Powerful and scalable system allows some workloads to migrate onto 2-socket design that delivers enterprise computing in a dense package Demand for minimum footprint as well as integrated networking infrastructure has increased the growth of the blade form factor. BladeCenter HX5 System x3690 X5 Consolidation, virtualization, and database workloads being migrated off of proprietary hardware are demanding more addressability System x3850 X5
  • 12.
  • 13. (2x) 1975W Rear Access Hot Swap, Redundant P/S (4x) Intel Xeon CPU’s (8x) Memory Cards for 64 DIMMs – 8 1066MHz DDR3 DIMMs per card 6x - PCIe Gen2 Slots (+2 additional) 2x 60mm Hot Swap Fans (8x) Gen2 2.5” Drives or 2 eXFlash packs (2x) 120mm Hot Swap Fans Dual USB Light Path Diagnostics RAID (0/1) standard, RAID 5/6 Optional DVD Drive 2x 10Gb Ethernet Adapter x3850 X5: 4-socket 4U x86 (Nehalem EX) platform
  • 14.
  • 15.
  • 16.
  • 17. (1x) x16 (full height, full length or (2x) x8 (1 full size, 1 full height / half length) (2x) PCIe x8 Low Profile (1x) PCIe x4 Low Profile for RAID (4x) N+N 675W Rear Access Hot Swap Redundant P/S (16x) Gen2 2.5” Drives or 3 eXFlash packs Scaling ports 32 x DDR3 Memory DIMMs 16 in upper mezzanine (pictured) 16 below 8x Memory Buffers (4x) 60mm Hot Swap Fans Dual USB Light Path Diagnostics DVD Drive x3690 X5: 2-socket 2U (Nehalem EX) platform
  • 18.
  • 19.
  • 20.
  • 21.
  • 23.
  • 24.
  • 25.
  • 27. x3850 X5: 4-socket 4U x86 (Nehalem EX) platform 6 Fans 2x – 1975 W P/S (2x) 1975W Rear Access Hot Swap, Redundant P/S (4x) Intel Xeon EX CPU’s (8x) Memory Cards – 8 DDR3 DIMMs per card 7x - PCIe Gen2 Slots 2x 60mm Hot Swap Fans (8x) Gen2 2.5” Drives or (16x) 1.8” SSD Drives (2x) 120mm Hot Swap Fans Dual USB DVD Drive Light Path Diagnostics RAID (0/1) Card, RAID 5/6 Optional 4U Rack Mechanical Chassis Front view
  • 28. x3850 X5: 4-socket 4U x86 (Nehalem EX) platform QPI cables (2x) 1975W Rear Access Hot Swap, Redundant P/S w/120mm fan (4x) PCIe full length (3x) PCIe half length x8 Dual Backplane – SAS & SSD Redundant w/220VAC only 4U Rack Mechanical Chassis Rear view
  • 29. System Images – Interior PS1 PS2 Boxborro 2 Boxborro1 M5015 RAID HS Fan Pack PCIe x16 PCIe x4 PCIe x8 PCIe x8 PCIe x8 PCIe x8 PCIe x8 USB System Recovery Jumpers CPU1 CPU2 CPU3 CPU4 Slot 7 Slot 6 Slot 5 Slot 4 Slot 3 Slot 2 Slot 1 Mem Card 1 Mem Card 2 Mem Card 3 Mem Card 4 Mem Card 5 Mem Card 6 Mem Card 7 Mem Card 8 SAS Backplanes + HDD Cage
  • 30. x3850 X5 Memory Card Current : x3850/x3950 M2 Memory Card New : x3850/x3950 X5 Memory Card Specifications : 64 DDR3 DIMMs 32 buses @ 1066M 2 DIMMs per bus SMI (FBD2) 16 buses Each @ 6.4GT/s (2B Rd/1B Wr) PC3-10600R LP DIMMs 1GB, x8, 1R, 1Gb 2GB, x8, 2R, 1Gb PC3-8500R LP DIMMs 4GB, x8, 4R, 1Gb 8GB, x8, 4R, 2Gb 16GB, x4, 4R, 2Gb
  • 31. System Images – Chassis View Front Access 120mm fans Rear I/O Shutttle Rear Access HS PSUs - lift up on handle then pull out QPI Scalability Ports / Cables
  • 32. System Images – CPU and Memory Memory Cards CPU and Heatsink installation
  • 33. System Images – Options M1015 RAID card and Installation bracket 8 HDD SAS Backplane
  • 34.
  • 35.
  • 36. x3850M2 to x3850X5 Transition Subsystem x3850M2 x3850 X5 PSU 1440W hot swap, full redundancy HIGH line, 720W low line. Rear Access. No PS option, 2 std. 1975W hot swap, full redundancy HIGH line, 875W low line. Rear Access. No PS option, 2 std. Config restrictions at 110V. CPU Card No VRDs, 4 VRMs, Top access to CPU/VRM and CPU card No VRMs, 4 VRDs, Top access to CPUs and CPU card Memory 4 Memory cards, DDR2 PC2-5300 running at 533Mbs. 8 DIMMs per memory card (32 DIMMs per chassis max) 8 Memory cards, DDR3 PC3-10600 running at 1066Mbs. 8 DIMMs per memory card (64 DIMMs per chassis max) PCIe Board CalIOC2 2.0, Slots = 7@2.5Gb PCIE x8, slots 6-7 hot plug Boxboro EX, Slots = 7@5GHz Slot1 x16, Slot2 x4, Slots 3-7 x8 No hotswap. SAS Controller LSI Logic 1078 w/RAID1 (no key), Elliott Key for RAID5, SAS 4x external port Ruskin IR or Fareham MR adapter Battery option for Fareham Ethernet Controller BCM 5709 Dual Gigabit Ethernet PCIE x4 attach to Southbridge BCM 5709 Dual Gigabit Ethernet PCIE x4 Gen2 attach to Boxboro Dual 10Gb Emulex adapter in PCIe Slot 7 on some models Video Controller ATI RN50 on RSA2, 16MB Matrox G200 in IMM, 16MB Service Processor RSA2 standard Maxim VSC452 Integrated BMC (IMM) SAS Design Four 2.5 Inch internal + 4x external Eight 2.5 Inch internal Support for SATA, SSD USB, SuperIO Design ICH7, 5 external ports, 1 internal, No SuperIO, embedded 512M key, No PS2 Kb/Ms, No FDD controller ICH10, 6 external ports, 2 internal, No SuperIO, embedded 512M key, No PS2 Kb/Ms, No FDD controller Fans 4 x 120mm, 2 x 92mm, 8 total (2 x 80mm in Power supplies) 2 x 120mm, 2 x 60mm, 6 total 2 x 120mm in Power Supplies
  • 37. x3850 X5 configuration flexibility Base System Shipping today Memory Expansion with MAX5 via QPI Shipping today Native Scaling via QPI Shipping today Memory Expansion and Scaling with MAX5 via QPI and EXA Available 2011
  • 38. Xeon 8-socket interconnect block diagram QPI Cable Links for QPI bus Four QPI cables 1 2 4 3 3 4 2 1 QPI 3 0 3 0 2 2 0 0 2 2 2 2 2 0 0 2 3 3 3 3 1 3 3 1 Cable cross connects CPUs 2 and 3
  • 39. x3850 X5 with native QPI scaling Connects directly via QPI bus QPI Cables Intel Xeon Intel Xeon MB1 MB1 MB1 MB1 MB1 MB1 MB1 MB1 Intel Xeon MB1 MB1 MB1 MB1 MB1 MB1 MB1 MB1 Intel Xeon Intel Boxboro PCI-E Intel Boxboro PCI-E Intel Xeon Intel Xeon MB1 MB1 MB1 MB1 MB1 MB1 MB1 MB1 Intel Xeon MB1 MB1 MB1 MB1 MB1 MB1 MB1 MB1 Intel Xeon Intel Boxboro PCI-E Intel Boxboro PCI-E
  • 40. x3850 8-socket QPI scaling A D B C REAR VIEW OF CHASSIS QPI 1-2 QPI 3-4 x3850 #1 QPI 1-2 QPI 3-4 x3850 #2
  • 41. x3850 X5 with MAX5 using QPI Intel Xeon Intel Xeon MB1 MB1 MB1 MB1 MB1 MB1 MB1 MB1 Intel Xeon MB1 MB1 MB1 MB1 MB1 MB1 MB1 MB1 Intel Xeon Intel Boxboro PCI-E Intel Boxboro PCI-E MAX5 MB1 MB1 MB1 MB1 MB1 MB1 MB1 MB1 Connects directly to each CPU via QPI bus 6.4 GT/s MB1 MB2 1 3 8 6 2 4 7 5 DDR3 Memory DIMMs Memory Buffer SMI Link to Firehawk EXA port
  • 42. x3850 X5 to MAX5 QPI cabling eX5 Memory Drawer End x3850 X5 End
  • 43. 8-socket x3850 X5 with MAX5 using QPI and EXA Connects directly to each CPU via QPI bus 6.4 GT/s Connects via EXA
  • 44. eX5 Rack Memory Expansion Module Configurations 1G x3850 X5 4U (2) x16, (10) x8, (2) x4 (1) x16, (5) x8, (1) x4 (2) x16, (10) x8, (2) x4 (1) x16, (5) x8, (1) x4 PCI-E Slots 8 No QPI 96 4 5u 1G + 1D 2G + 2D 2G 1G Configuration 4S No No Partition EXA QPI None Scaling 8 192 8 10u 5 128 8 8u 8 64 4 4u Processor SKUs Supported DIMMS CPU’s Size 1G+1D x3950 X5 4U Memory Drawer 1U QPI 2G+2D Memory Drawer 1U Memory Drawer 1U x3950 X5 4U x3950 X5 4U QPI QPI EXA 2G x3850 X5 4U x3850 X5 4U QPI
  • 45.
  • 46.
  • 47. x3850 X5 PCIe Slot Population Plug one PCIe card / Boxboro before moving to next set of slots Card # PCIe Slot # 1 1 2 5 3 3 4 6 5 4 6 7 7 2
  • 48.
  • 49.
  • 50.
  • 51.
  • 52.
  • 54. (1x) x16 (full height, full length or (2x) x8 (1 full size, 1 full height / half length) (2x) PCIe x8 Low Profile (4x) N+N 675W Rear Access Hot Swap Redundant P/S (16x) Gen2 2.5” Drives or (24x) 1.8” SSD Drives 2 Scalability cables for eX5 Memory Expansion (16x) DDR3 Memory DIMMs Upper mezzanine 8x Intel Memory Buffers (BoB’s) Intel Nehelam EX processor details, staired heat sinks x3690 X5: 2-socket 2U platform 2U Rack Mechanical Chassis Top view Maximum performance, maximum memory for virtualization and database applications
  • 55. QPI Cable cage (2x) 1Gb Ethernet (2 std, 2 optional) x3690 X5: 2-socket 2U platform 2U Rack Mechanical Chassis Rear view Maximum performance, maximum memory for virtualization and database applications
  • 56.
  • 57.
  • 58. x3690 X5 – Inside, No Memory Mezzanine (2x) Intel Xeon EX CPU’s Memory Mezzanine Connectors (16x) DDR3 Memory DIMMs Base Planar (4x) Intel Memory Buffers (BoB’s) Base Planar (2x) USB (front) Light Path Diagnostics UltraSlim SATA DVD Drive Front video
  • 59. x3690 X5 – Inside, Memory Mezzanine Installed (1) PCIe2 x16 FHFL or (2) PCIe2 x8 FHHL (2) PCIe2 x8 Low Profile & (1) PCIe2 x4 LP (x8 connector) (4x) N+N Redundant 675W Hot Swap Power Supplies (16x) Gen2 2.5” SAS/SATA Drives (16x) DDR3 Memory DIMMs Upper Memory Mezzanine (4x) Intel Memory Buffers (BoB’s) Upper Memory Mezzanine (5x) Hot Swap Redundant Cooling Fans Redundant Power Interposer
  • 60. x3690 X5 – Front / Rear Views
  • 61. x3690 X5 – System Planar (2) QPI Scalability Connections Shown with Cable Guide Installed Intel Boxboro IOH Intel ICH10 Southbridge Processor Socket 1 Processor Socket 2 Memory Mezzanine Connectors
  • 62. x3690 X5 – Memory Mezzanine (4) Intel Memory Buffer Memory Buffers (16) DDR3 DIMM Sockets
  • 63. x3690 X5 – PCIe Slots 3-5 LP PCIe2 x8 Slot 3 LP PCIe2 x4 Slot 4 (x8 Connector) Internal USB Hypervisor Spare Internal USB LP PCIe2 x8 Slot 5 (Emulex10Gb enabled)
  • 64. x3690 X5 – Redundant Power Interposer Power Supply 3 & 4 Connectors System Planar Connections
  • 65. eX5 QPI cables for MAX5 memory expansion eX5 Memory Drawer Side x3690 X5 Side
  • 66. Possible x3690 X5 Configurations 2M+2D 1M+1D 2M 1M Configuration Size CPU’s DIMMS PCI-E Slots Scaling Partitioning Processor SKUs Supported 1M 2U 2 32 (1) x16 or (2) x8, and (2) x8 LP None Software - OS 11 1M + 1D 3U 2 64 (1) x16 or (2) x8, and (2) x8 LP QPI Software - OS 10 2M 4U 4 64 (2) x16 or (4) x8, and (4) x8 LP QPI Software - OS 8 2M + 2D 6U 4 128 (2) x16 or (4) x8, and (4) x8 LP QPI/EXA Physical - EXA 10 Ghidorah 4U Memory Drawer 1U QPI x3690 X5 2U Memory Drawer 1U QPI EXA x3690 X5 2U QPI x3690 X5 2U x3690 X5 2U Memory Drawer 1U QPI x3690 X5 2U x3690 X5 2U
  • 67. MAX5
  • 68.
  • 69. MAX5 for System x front and rear views Redundant 675W Power Supplies Lightpath Diagnostics QPI Ports EXA Ports Hot swap fans Front Rear System removes from chassis for easy access
  • 70.
  • 71. MAX5 for rack systems front and rear view
  • 72. x3850 X5 with MAX5 using QPI Intel Xeon Intel Xeon MB1 MB1 MB1 MB1 MB1 MB1 MB1 MB1 Intel Xeon MB1 MB1 MB1 MB1 MB1 MB1 MB1 MB1 Intel Xeon Intel Boxboro PCI-E Intel Boxboro PCI-E MAX5 MB1 MB1 MB1 MB1 MB1 MB1 MB1 MB1 Connects directly to each CPU via QPI bus 6.4 GT/s MB1 MB2 1 3 8 6 2 4 7 5 DDR3 Memory DIMMs Memory Buffer SMI Link to Firehawk EXA port
  • 73. x3850 X5 to MAX5 QPI cabling eX5 Memory Drawer End x3850 X5 End
  • 74. 8-socket x3850 X5 with MAX5 using QPI and EXA Connects directly to each CPU via QPI bus 6.4 GT/s Connects via EXA
  • 75.
  • 76.
  • 77.
  • 78. HX5
  • 79.
  • 80.
  • 81.
  • 82. HX5 Configurations 1 2 3 2S, 40D, 60mm 2S, 16D, 30mm 4S, 32D, 60mm *Not required for operation, but strongly recommended for optimal performance 40 32 16 DIMMS 2 4 2 SSDs (max) 3 2 1 (59Y5877) IBM HX5 MAX5 1-node scalability kit (46M6975) IBM HX5 2-node scalability kit (59Y5889) IBM HX5 1-node Speed Burst card * Additional Required Options 8 ports; 2x 1GE LOM, 1x CIOv, 1x CFFh 16 ports; 4x 1GE LOM, 2x CIOv, 2x CFFh 8 ports: 2x 1GE LOM, 1x CIOv, 1x CFFh I/O Slots QPI 4 (95W, 105W) 60mm HX5 + HX5 QPI 2 (95W, 105W) 30mm HX5 HX5 + MAX5 Configuration QPI Scaling 2 (95W, 105W, 130W) 60mm CPU’s Size
  • 83. HX5 Operating System Support All NOS apply to both HX5 and HX5+MAX5 models Note: Solaris 10 support WIP U5, which includes KVM support. N-1 1 & 2 P2-Hammerhead P1-Thresher Red Hat Enterprise Linux 5 Server, 64-bit U5, which includes KVM support. N-1 1 & 2 P2 Red Hat Enterprise Linux 5 Server with Xen, 64-bit 1 & 2 1 & 2 1 & 2 1 & 2 1 & 2 1 & 2 1 & 2 1 & 2 1 & 2 1 & 2 Nodes U1. Emulex Tiger Shark - no drivers. Driver for Intel 10G NIC will be async - not in kernel. No CIM provider for SAS-2. Waiting on code from LSI. No way to manage SAS-2. N P1 VMWare ESXi 4.0 N P2 SUSE Linux Enterprise Server 11 with Xen, 64-bit SP3 N-1 P2 SUSE Linux Enterprise Server 10, 64-bit SP3 N-1 P2 SUSE Linux Enterprise Server 10 with Xen, 64-bit N N N-1 N N N N / N-1 P3 for Hammerhead, to be moved to P2 immediately following initial SIT Exit. Test completion outlook is 4-6 weeks after initial SIT Exit. P2 for Thresher. P3-Hammerhead P2-Thresher Red Hat Enterprise Linux 6, 64-bit SP2 P1 Windows Server 2008, 64-bit (Std, Ent, Web, DC) U1 P1 VMware ESX 4.0 P1 SUSE Linux Enterprise Server 11, 64-bit Comments Pri NOS SP2 P3 Windows HPC Server 2008 P1 Windows Server 2008 R2 (64-bit)
  • 84.
  • 85. HX5 & Westmere support in BCE, BCS, BCHT & BCT Source: BCH Power Matrix 25JAN10_elb.xls ^^ Throttling / over-subscription enabled No support Up to 95W TBD 12 Enterprise 6 6 3 6 BCS No support Up to 80W CPU No support No support NEBS BCHT No support Same as NEH-EP HS22 No support No support 2000W No support 14^^ No support No support 2320W BC-E HS22 WSM 130W Westmere (HS22 & HS22V) HX5 w/ MAX5 130W HX5 95W / 105W
  • 86.
  • 87.
  • 88.
  • 89.
  • 90.
  • 91.
  • 92.
  • 93.
  • 95. Intel® Xeon® Roadmap 2010 2008 Nehalem - EX Boxboro Chipset / OEM Boxboro – EX Intel ® 5100 Chipset Intel ® 5000V Intel® 3200 Chipset Garlow Platform IBM x3350 Ibex Peak PCH Nehalem – EP 5500 Series Tylersburg – 36D Chipset Tylersburg - EP Platform Westmere-EP Cranberry Lake Platform (HS 12) Bensley-VS Intel® 5000P/5400 Chipset Bensley Platform, HS 21, HS 21 XM x3650… Quad-Core Xeon® proc. 7300 series Caneland Platform IBM x3850/x3950 M2 Intel® 7300 Chipset/OEM Chipsets Dunnington 7400 Series Tylersburg – 24D Chipset Tylersburg - EN Platform Westmere-EP Nehalem – EP 5500 Series Expandable 7000 Efficient Performance 5000 Entry 5000 Workstation/HPC Foxhollow Platform QPI PCIe 2.0 QPI QPI Nehalem – EP 5500 Series Dual Tylersburg – 36D Chipset Tylersburg - WS Platform 5400 Chipset Stoakley Platform IBM x3450 Westmere - EP PCIe 2.0 QPI PCIe 2.0 PCIe 2.0 PCIe 2.0 PCIe 2.0 2009 *Other names and brands may be claimed as the property of others Copyright © 2008 Intel Corporation. All products, dates and figures are preliminary, for planning purposes only and are subject to change without notice. Sandy Bridge Transition future Xeon® proc. 3300 series Xeon® proc. 3100 series Lynnfield (Nehalem based) Havendale (Nehalem based) Xeon® proc 5400 series Xeon® proc 5200 series Xeon® proc 5400 series Xeon® proc 5200 series Xeon® proc 5400 series Xeon® proc 5200 series
  • 96. Intel Nehalem-EX: Designed For Modularity QPI: Intel ® QuickPath Interconnect #QPI Links # mem channels Size of cache # cores Power Manage- ment Type of Memory Integrated graphics Differentiation in the “Uncore”: DRAM QPI Core Uncore C O R E C O R E C O R E IMC QPI Power & Clock … QPI … … … L3 Cache
  • 97.
  • 98.
  • 99.
  • 100.
  • 101. X7560 2.26Ghz / 24M / 6.4GT/s X7550 2Ghz / 18M / 6.4GT/s 8S/Scalable 4S/Scalable L7555 1.86Ghz / 24M / 5.86GT/s E7530 1.86Ghz / 12M / 5.8GT/s E7520 1.86Ghz / 18M / x4.8GT/s X7542 2.66Ghz / 18M / 5.86GT/s EX High Perf. LV L7545 1.86Ghz / 18M / 5.86GT/s E7540 2Ghz / 18M / 6.4GT/s Turbo: 0/1/3/5 Turbo: 1/2/4/5 Standard Basic 6-8 Cores 95W HT / Turbo / S8S 6 Cores 130W Turbo / S8S No Hyper-Threading 8 Cores Hyper-Threading Turbo: 1/2/3/3 130W 6 Cores Hyper-Threading Turbo: 0/1/1/2 105W 4 Cores Hyper-Threading 95W-105W 95W 8C 6C HPC Turbo: 0/1/1/1 2S/Scalable x3850 X5 – Supported Processor SKUs Advanced
  • 102. X6550 2Ghz / 18M / 6.4GT/s E6540 2Ghz / 18M / 6.4GT/s X7560 2.26Ghz / 24M / 6.4GT/s X7550 2Ghz / 18M / 6.4GT/s 8S/Scalable 4S/Scalable L7555 1.86Ghz / 24M / 5.86GT/s E7530 1.86Ghz / 12M / 5.8GT/s E7520 1.86Ghz / 18M / x4.8GT/s X7542 2.66Ghz / 12M / 5.86GT/s EX High Perf. LV L7545 1.86Ghz / 18M / 5.86GT/s E7540 2Ghz / 18M / 6.4GT/s Turbo: 0/1/3/5 Turbo: 1/2/4/5 Standard Basic 6-8 Cores 95W HT / Turbo / S8S 6 Cores 130W Turbo / S8S No Hyper-Threading 8 Cores Hyper-Threading Turbo: 1/2/3/3 130W 6 Cores Hyper-Threading Turbo: 0/1/1/2 105W 4 Cores Hyper-Threading 95W-105W 95W 8C 6C HPC Turbo: 0/1/1/1 E6510 1.73Ghz / 12M / 4.8GT/s 2S Only. Not Scalable 105W 2S/Scalable x3690 X5 – Supported Processor SKUs Advanced
  • 103.
  • 104.
  • 105. Technical Highlights: Reliability
  • 106.
  • 107.
  • 108.
  • 109.
  • 110.
  • 111.
  • 112.
  • 113.
  • 114.
  • 115.
  • 116. Technical Highlights: Performance
  • 117.
  • 118. IBM x3690 X5 + MAX5 memory map setup options 0G 3G 4G 17G 33G 49G 65G CPU1 CPU1 CPU2 CPU1 CPU2 CPU1 CPU1 CPU2 UNASSIGNED 0G 3G 4G 17G 33G 65G (Setup Option) Pooled RHEL, SLES (Default) Partitioned to CPUs Windows, VMWare Example: 64GB, 32 x 2GB DIMMs, 1 x3690 X5, 2 CPUs (8 DIMMs each), 1 MAX5 (16 DIMMs) 1G MMIO IBM Confidential X5 Mem X5 Mem
  • 119. IBM x3850 X5 + MAX5 memory map setup options 0G 3G 4G 17G 33G 49G 65G 73G 81G 89G 97G CPU1 CPU1 CPU2 CPU3 CPU4 CPU1 CPU2 CPU3 CPU4 CPU1 CPU1 CPU2 CPU3 CPU4 UNASSIGNED 0G 3G 4G 17G 33G 49G 65G 97G (Setup Option) Pooled RHEL, SLES (Default) Partitioned to CPUs Windows, VMWare Example: 96GB, 48 x 2GB DIMMs, 1 x3850 X5, 4 CPUs, 8 Mem Cds (4 DIMMs each), 1 MAX5 (16 DIMMs) 1G MMIO IBM Confidential X5 Mem X5 Mem
  • 120. IBM x3850 X5 + MAX5 memory map 2-node example 0G 2G 4G 18G 34G 50G 66G 74G 82G 90G 98G CPU1 CPU1 CPU2 CPU3 CPU4 CPU1 CPU2 CPU3 CPU4 98G Primary Node Partitioned to CPUs Secondary Node Partitioned to CPUs Example: 192GB, 96 x 2GB DIMMs, 2 x3850 X5, 8 CPUs, 16 Mem Cds (4 DIMMs each), 2 MAX5 (16 DIMMs each) 2G MMIO IBM Confidential 256MB L4 Cache creates small memory gap to next node OS Memory is 191.5GB CPU5 CPU6 CPU7 CPU8 114G 130G 146G 162G X5 Mem CPU5 CPU6 CPU7 CPU8 170G 178G 186G 194G X5 Mem
  • 121. Trademarks IBM, the IBM logo, the e-business logo, Active Memory, Predictive Failure Analysis, ServeRAID, System i, System Storage, System x, Xcelerated Memory Technology, and XArchitecture are trademarks of IBM Corporation in the United States and/or other countries, or both. If these and other IBM trademarked terms are marked on their first occurrence in this information with a trademark symbol (® or ™), these symbols indicate U.S. registered or common law trademarks owned by IBM at the time this information was published. Such trademarks may also be registered or common law trademarks in other countries. A current list of IBM trademarks is available on the Web at http://ibm.com/legal/copytrade.shtml .  Intel, the Intel Logo, Itanium, ServerWorks, and Xeon are registered trademarks of Intel Corporation in the United States, other countries, or both. Dell is a trademark of Dell, Inc. in the United States, other countries, or both. HP is a trademark of Hewlett-Packard Development Company, L.P. in the United States, other countries, or both. Linux is a registered trademark of Linus Torvalds in the United States, other countries, or both. Microsoft, Hyper-V, SQL Server, and Windows are trademarks or registered trademarks of Microsoft Corporation in the United States, other countries, or both. Red Hat is a trademark of Red Hat, Inc. SAP and all SAP logos are trademarks or registered trademarks of SAP AG in Germany and in several other countries. TPC, TPC-C, tpmC, TPC-E and tpsE are trademarks of the Transaction Processing Performance Council. UNIX is a registered trademark of The Open Group in the United States, other countries, or both. VMware, VMworld, VMmark, and ESX are registered trademark of VMware, Inc. in the United States and/or other jurisdictions. All other company/product names and service marks may be trademarks or registered trademarks of their respective companies. IBM reserves the right to change specifications or other product information without notice. References in this publication to IBM products or services do not imply that IBM intends to make them available in all countries in which IBM operates. IBM PROVIDES THIS PUBLICATION “AS IS” WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED, INCLUDING THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Some jurisdictions do not allow disclaimer of express or implied warranties in certain transactions; therefore, this statement may not apply to you.  This publication may contain links to third party sites that are not under the control of or maintained by IBM. Access to any such third party site is at the user's own risk and IBM is not responsible for the accuracy or reliability of any information, data, opinions, advice or statements made on these sites. IBM provides these links merely as a convenience and the inclusion of such links does not imply an endorsement. Information in this presentation concerning non-IBM products was obtained from the suppliers of these products, published announcement material or other publicly available sources. IBM has not tested these products and cannot confirm the accuracy of performance, compatibility or any other claims related to non-IBM products. Questions on the capabilities of non-IBM products should be addressed to the suppliers of those products. 
  • 122. © IBM Corporation 2008. IBM Corporation Route 100 Somers, NY 10589 U.S.A. Produced in the United States of America, October 2008. All rights reserved.

Notas do Editor

  1. Now let’s take a closer look at how HX5 delivers value to our customers: HX5 with MAX5 delivers 25% more memory capacity than any server in it’s class. Resulting in optimal server utilization for memory constrained applications. More memory also allows customers to run more, larger virtual machines per servers and results in greater database throughput. For customers looking for maximum performance, HX5 offers compute capacity of up to 32 CPU cores with the 4S blade. This not only provides blazing fast performance, it also enables customers save on system costs by getting most out of their licensing costs where SW is priced by servers or # of CPUs. For memory limited apps, more apps just doesn’t cost another server….. Smaller DIMMs HX5 delivers faster time to value for our clients. Since it is built from the same 2S base blade, customers have to qualify a single platform for 2-socket to 4-socket server needs, which will allow them to standardize on a single system and deliver faster time to value. The image customers develop for a 2S HX5 system, will essentially work on all other scaled HX5 systems. Memory Price HS22/HS22V HX5 2G $125 $125 4G $235 $275 8G $990 $989 6K memory savings Memory Price: 2G $125 4G $275 8G $989 Blade Price (base model w/ all CPUs populated ) 4S HX5: $17,000 4S HX5+MAX5: $25,600 256GB Memory config price (memory only) 4S HX5: 32*8G = $31,648 4S HX5+MAX5: 32*2G + 48*4G = $17200 Total System Price 4S HX5: 32*8G = $48,648 4S HX5+MAX5: 32*2G + 48*4G = $42,800 Delta: $5,848
  2. 5x Memory (Jan 23, 2010) HP DL380 G6 has 18 DIMMs, but only supports up to 128GB (12 x 16) due to rank limitations in Nehalem EP
  3. QPI transfers memory @ 6GTS
  4. after this “switch gears”
  5. Each CPU needs at least one memory card Each memory card needs at least 2 DIMM’s DIMM’s must be installed in matching pairs Optimal memory performance requires 2 memory cards per CPU, with 4 DIMMs on each memory card, equal amounts of memory per card. If memory mirrored, then DIMM’s must match in sets of 4 eX5 Memory expansion works best with DIMM’s in sets of 4 eX5 Memory expansion works best with a ratio of 2/1 memory in host/expander Memory Size DIMM FRU Option (contains only 1 DIMM) 1GB DIMM (1Gb, x8, SR) 43X5044 44T1490 44T1480 2GB DIMM (1Gb, x8, DR) 43X5045 44T1491 44T1481 4GB DIMM (1Gb, x8, QR) 43X5055 46C7452 46C7448 8GB DIMM (2Gb, x8, QR) 43X5070 46C7488 46C7482 16GB DIMM (2Gb, x4, QR) 43X5071 46C7489 46C7483 Best not to mix ranks in a channel Memory Installation Card number DIMM Numbers 1 1 & 8 7 1 & 8 3 1 & 8 5 1 & 8 2 1 & 8 8 1 & 8 4 1 & 8 6 1 & 8 1 3 & 6 7 3 & 6 3 3 & 6 5 3 & 6 2 3 & 6 8 3 & 6 4 3 & 6 6 3 & 6 1 2 & 7 7 2 & 7 3 2 & 7 5 2 & 7 2 2 & 7 8 2 & 7 4 2 & 7 6 2 & 7 1 4 & 5 7 4 & 5 3 4 & 5 5 4 & 5 2 4 & 5 8 4 & 5 4 4 & 5 6 4 & 5
  6. A PCIe Gen 2 lane is 500MB/s X16 PCIe slot is ~~ 8GB/s X8 PCIe slot is ~~5GB/s X4 PCIe slot is ~~2GB/s
  7. SAP Business All-In-One fast-start Fast-Start is SAP‘s primary ‘out-of-the-box’ Mid-market solution, which includes an optional, pre-installed, fixed price infrastructure offering. Fast-Start solutions are exclusively sold by SAP Value Added Resellers. Fast-Start infrastructure stacks will be co-marketed with a HW reseller, and fulfilled by the HW reseller. The SAP® Business All-in-One fast-start program enables you to configure a SAP Industry specific solution online, obtain an estimate of costs, and implement the solution quickly and cost-effectively while delivering a rapid time to value SAP All-In-One Value Proposition Provide industry-specific functionality at a low cost of ownership. Bounded project scope, predictable costs, and short implementation times. Minimize IT staff dedicated to supporting on premise business solutions. Flexibility to grow and adapt to meet your company’s changing business requirements IBM All-In-One fast-start Value Proposition Preinstalled solution with minimal IT support requirements Flexibility and growth with investment protection using IBM Blade C enter S or System x 3850 with IBM Systems Storage Local support from IBM and SAP Business partners Predictable IT costs through IBM leasing offerings Reduced risk with preinstalled Linux All-In-One Fast-Start solution Which customers are good candidates for SAP Business All-In-One fast-start Small and Midmarket customers who need industry specific business functionality Customers looking to replace legacy ERP solutions Customers who have complex business requirements Customers who have plans for growth and expansion
  8. SAP Business All-In-One fast-start Fast-Start is SAP‘s primary ‘out-of-the-box’ Mid-market solution, which includes an optional, pre-installed, fixed price infrastructure offering. Fast-Start solutions are exclusively sold by SAP Value Added Resellers. Fast-Start infrastructure stacks will be co-marketed with a HW reseller, and fulfilled by the HW reseller. The SAP® Business All-in-One fast-start program enables you to configure a SAP Industry specific solution online, obtain an estimate of costs, and implement the solution quickly and cost-effectively while delivering a rapid time to value SAP All-In-One Value Proposition Provide industry-specific functionality at a low cost of ownership. Bounded project scope, predictable costs, and short implementation times. Minimize IT staff dedicated to supporting on premise business solutions. Flexibility to grow and adapt to meet your company’s changing business requirements IBM All-In-One fast-start Value Proposition Preinstalled solution with minimal IT support requirements Flexibility and growth with investment protection using IBM Blade C enter S or System x 3850 with IBM Systems Storage Local support from IBM and SAP Business partners Predictable IT costs through IBM leasing offerings Reduced risk with preinstalled Linux All-In-One Fast-Start solution Which customers are good candidates for SAP Business All-In-One fast-start Small and Midmarket customers who need industry specific business functionality Customers looking to replace legacy ERP solutions Customers who have complex business requirements Customers who have plans for growth and expansion
  9. Have to borrow a QPI link to connect to MK.
  10. Ent / nebs
  11. It is technically possible for a platform to have different QPI links running at different frequencies (e.g. slower between node controllers and faster from CPU to IOH’s). But this is an OEM design decision and does add complexity to the design…so different QPI link speeds in the same system are not probable.
  12. Best DIMM choices More ranks are better (QR better than DR better than SR) Remember: More ranks does NOT reduce frequency
  13. Have to borrow a QPI link to connect to MK.
  14. Important Points “ Uncore” provides segment differentiation. Separate V/F domains decouples core and uncore designs. Core -consistent logic across processor family -Same uArch across all segments.. Good for software optimization… Uncore – things that glue all the cores together… # cores Size of LLC Type of memory… native vs. buffer Number of sockets… Integrated graphics available on some but not all… Different knobs that we can play to Important point to note: Uncore is what differentiates Nehalem EP from EX Q: is the common core, the same core as Nehalem EP A: Yes
  15. Nehalem-EP (NHM-EP) 4 cores/8 threads per socket, Nehalem core, 45nm process, 8MB shared LLC SMT (~hyper threading) QPI links (only 1 is coherent link) per socket One integrated memory controller (IMC) Three DDR channels per socket Scales to 2 sockets MAX Nehalem-EX (NHM-EX) Up to 8 cores/ 16 threads per socket, Nehalem core, 45nm process, 24MB shared L3 SMT (~Hyper-Threading) Turbo Boost Four QPI Links (3 coherent) Two integrated memory controllers (IMC) Four buffered memory channels per socket Scales to up to 16 sockets
  16. The physical connectivity of each interconnect link is made up of twenty differential signal pairs plus a differential forwarded clock. Each port supports a link pair consisting of two uni-directional links to complete the connection between two components. This supports traffic in both directions simultaneously. The Intel® QuickPath Interconnect is a double-pumped data bus, meaning data is captured at the rate of one data transfer per edge of the forwarded clock. So every clock period captures two chunks of data. The maximum amount of data sent across a full-width Intel® QuickPath Interconnect is 16 bits, or 2 bytes. Note that 16 bits are used for this calculation, not 20 bits. Although the link has up to 20 1-bit lanes, no more than 16 bits of real ‘data’ payload are ever transmitted at a time, so the more accurate calculation would be to use 16 bits of data at a time. The maximum frequency of the initial Intel® QuickPath Interconnect implementation is 3.2 GHz. This yields a double-pumped data rate of 6.4 GT/s with 2 bytes per transition, or 12.8 GB/s. An Intel® QuickPath Interconnect link pair operates two uni-directional links simultaneously, which gives a final theoretical raw bandwidth of 25.6 GB/s.