15. The Power Management Crisis
Balancing Usage and Battery Management—An Ongoing Crisis
Improvement
Application and
Services Requirements
Power
Battery
Battery Capacity Crisis
Hardware and Power
Management Improvement
2G < 1W 2.5G~2-3W 3G up to 5W 4G up to 10W
2000 2008 2010
Source: Informa Telecom and Media
15
16. Modems need to be Complete
Built Smarter to Work Smarter
Multimode
3G/4G
Voice
Power OS Support
Optimization
GPS
Broadcast
Soft AP
RF Multiband Qualcomm
Designs, Integrates and
Delivers
all the Pieces Advanced
DSP Receivers
Connectivity
Simplified APIs
16
17. Modems need to be Complete Solutions That
Adapt to Network Conditions
Delivering Faster, Smoother Real-time Connections
Smoothest Always Fastest
Voice and Data Connected Connections
Real-time optimized 3G/4G, WLAN, BT, FM Industry leading
capacity loads technologies
Multimode/Multiband
Seamless handoffs Real-time connection
Strong reliable connection choices
HD Voice in more places
Smart signal clean-up
Noise cancellation Smart power management
and savings
Pre-designed to work
best with apps Support for connected
processors applications
17
18. Processors need to be Complete
Built Smarter to Work Smarter
Multimedia Power Mgmt
GPS RF
GPU Software/
HLOS
CPU
Qualcomm Memory
Designs, Integrates and
Delivers
all the Pieces
DSP Connectivity
Modem
18
19. Industry needs to Deliver Full Benefits of
Integration
SMALLER FOOTPRINT
10–20% smaller
LOWER SYSTEM COSTS LOWER CHIP COSTS
~$3–$6 BOM savings ~10–20% savings
LESS ENGINEERING,
FASTER TIME TO MARKET POWER EFFICIENT
>745 devices launched Up to 35% better
in Fiscal 2010
Source: Qualcomm estimates.
19
20. World’s First Multi-Mode 3G / 4G
Integrated Chipset
MSM8960
CPU UPGRADE MULTI-MODE MODEM
New micro-architecture Integrated LTE Multi-Mode
~5x performance All 3G modes supported
MDM 8960 ~75% lower power
LTE/TD LTE
MULTI-MODE
3G DUAL CORE
GRAPHICS UPGRADE INTEGRATED
~4x performance CONNECTIVITY
WLAN, GPS, Bluetooth, FM
FIRST CHIP OF THE NEW SNAPDRAGON FAMILY
20
CDMA ~20% of total Wireless Subs -> long runway for 3GSome industry analysts believe 3G handset shipments into emerging regions could exceed 50% of total in 2011 (Internal believe a bit less than 50%)New Device categories– USBs still strong, tablets and in future M2M (smartgrid, wireless health)
Spectrum Initiatives (Approved messaging from Govt. Affairs)Qualcomm strives to encourage the most efficient possible use of scarce spectrum by inventing techniques to enable operators to gain the greatest capacity for voice and data. These techniques include the use of femtocells and the deployment of a new, more dense network topology to encourage spectrum reuse. Nevertheless, Qualcomm strongly supports the allocation of additional spectrum by regulators around the world, including Australia, which is absolutely necessary to keep pace with the ever-increasing demand from consumers for mobile broadband services. In the case of Australia, we urge the Government to ensure spectrum is made available as soon as possible in the 700 MHz and 2.5 GHz bands, which are spectrum bands that are already in use by mobile broadband in other countries around the world.
Part of our platform approach is to support broad choice of OS and device types. Only company supporting this many HLOSAnd, as a result, only company supporting so many diverse device types
To do this, need have built and industry leading portfolio of technologiesThis opens up new device types, new network opportunitiesOur platform is also able to smartly choose among available connections to choose the best one available
Focus on the connected networks, devices, appliances,….. portraying a web of connectedness that can capture anything that involves your daily life.
Platform approach is enabling consumers to get content of choice on any device. Content choice because of Snapdragon processors strength and broad availability Advance GPU – you see leading gamer choosing Snapdragon when they move into mobileYou see:Leaders in gaming from other platforms, Sony and MSFT Xbox, choosing us to go mobileCompanies like netflix who distribute premium content relying on us for securityMobile banking tying into our security features to enable a broad range of transaction sizesContent EverywhereMulti screen experience
2012 = 3.3 DMIPS/MHz x 1.7GHz x 2 cores2014 = 3.3 DMIPS/MHz x 2.5GHz x 4 cores
Battery Technology and the Energy GapThe energy gap is the difference between the linear improvement in Li-ion technology vs. the exponential energy utilized by smart phonesLi-Ion battery technology will saturate in about 5 yearsAnticipate 40% improvement due to process optimizationThe next level of energy density will require new technology, new materials and new chemistryWe will need about a 10x increase in battery capacity by 20201J. Ofversten, “Mobile Internet Impact on Battery Life,” IWPC, 2008
This, at a greater level of detail, demonstrates everything that goes into the snapdragon systemAnd it is building these best in class technologies and integrating them to work together into a single, complete chipset which is helping Snapdragon drive innovation for our partners
Integration is also key to taking advantage of the trend of adding more and more capabilities to the phone. As we add more and more capabilities, we need to doe this extremely efficiently. Computing must be done at low power because power is limited by battery size and consumer desire to not have to plug in their phones mid-day. PCB size is limited by how large a phone consumers will want to carry, and purses and pockets are not changing size.It is only through integration that phones will continue to expand what they can do.And Qualcomm is the only silicon company with all this expertise in house, which means only we can integrate it effectively.There are many advantages to integration, and you have probably heard me talk about several of them before. For example:Size: today we are delivering much of the capabilities of recent PCs in a package the size of a postage stamp, including a 3G modem.Power: today we are up to 35% more efficient than general ARM chips, delivering more performance at less power which can turns into more talking, texting and browsing between charges.Cost: Integration is generally less expensive than assembling discrete solutions from multiple vendors and then having to package them together yourself. We’ve estimated that an integrated solution can be up to 15% lower on silicon and 20% lower on packaging. These are important amounts, especially when you consider that the most market growth will be at lower price points.Engineering Savings: it is probably self evident, but it is more efficient for an OEM to integrate fewer vs more chips. With Qualcomm, there is also the added benefit that we are offering a solution where everything is designed and tested to work together. For test alone, this could reduce an OEMs test time (or costs) by up to 30%. Again, this size of # matters when time to market and cost are becoming so important.Today I want to look more deeply at the superior performance of Qualcomm’s solution
Focus on the connected networks, devices, appliances, using different wireless technologies (3G, WiFi, Bluetooth….)….. portraying a web of connectedness that can capture anything that involves your daily life.
