1. AT&S Roadshow | April 2013

2. 1
AT&S – the quality leader of PCB production
Best positioned in highly attractive market
IC-Substrates – the foundation for future success
Mid-term strategy and measures
Investment highlights
Appendix
Agenda
1
2
3
6
4
5

3. 2
AT&S – the quality leader of PCB production
Best positioned in highly attractive market
IC-Substrates – the foundation for future success
Mid-term strategy and measures
Investment highlights
Appendix
Agenda
1
2
3
6
4
5

4. Management team – introduction
3
Andreas Gerstenmayer, CEO
Joined AT&S as CEO in 2010
Previous positions include:
18 years of work experience at Siemens, including Managing Director with Siemens
Transportation Systems GmbH Austria and CEO of the Drive Technology business
unit in Graz from 2003 to 2008
Partner at FOCUSON Business Consulting GmbH after leaving Siemens
Education and other positions:
Member of the Research Council of Styria
Degree in Production Engineering from Rosenheim University of Applied Sciences
Heinz Moitzi, CTO
CTO since 2005; with AT&S since 1981
Previous positions include:
Various management positions within AT&S
Measurement engineer with Leoben University of Mining and Metallurgy
Education:
Degree from Higher Technical College of Electrical Engineering
Studied electrical installation with Stadtwerke Judenburg (Judenburg municipal utility
company)

5. Sustainable growth play
4
Technology leader for high-end PCBsI
Profitable and sustainably growing marketII
Best positioning vs. Asian competitorsIII
Leveraging on technological leadershipIV

6. Focus on high-end production capabilities
Production of tailor made PCBs
Design service for customer solutions
ECP® technology
5

7. ► Seasonality and new product
launches twice a year
6
Attractive business mix
Characteristic Applications
56%
Segment
Revenue
share*
*) Based on AT&S financials 1.April – 31.December 2012
44%
Mobile Device
Industry & Automotive
Advanced
Packaging
Target market diversification provides for superior earnings stability
and a close relationship with the technology leaders in each market segment
Market leaders
Siemens
General Electric
EADS
Hella
Continental
Texas
Instruments
TDK-EPCOS
Sony
RIM
LG
Huawei
Nokia
ZTE
► Higher predictability and fewer
product launches
FY 2011/12 FY 2012/13
FY 2011/12 FY 2012/13
Growing business with
complementary know-how
55.5 56.2
47.7
56.3 55.9
59.6 59.1
Q1 Q2 Q3 Q4 Q1 Q2 Q3
54.7
75.1
81.4
85.8
69.8 68.7
90.7
Q1 Q2 Q3 Q4 Q1 Q2 Q3

8. 7
Successful shift to Asia – fit for future growth
31%
35%
41%
53%
61%
67% 69%
73%
19.9%
17.9%
15.3%
16.4%
11.6%
9.3%
19.7%
20.1%
5.0%
10.0%
15.0%
20.0%
25.0%
0%
20%
40%
60%
80%
2004/05 2005/06 2006/07 2007/08 2008/09 2009/10 2010/11 2011/12
Percentage of Asian production volume EBITDA margin
332 375 467 450 372 488 514486
Group revenues [€m]
Production split by region and year, revenue and margin development
Continuous shift of production volumes to Asia
Local presence in key markets & access to emerging Asian smartphone players
Strong presence in both Asia and Europe
Close to the main mobile device assembly sites
Advanced know-how to capture local market growth

9. Global set-up with access to key markets
8
Production plants
Headquarters
Sales offices
Production plant under construction
International presence and key technology production overview
Headquarters: Leoben-Hinterberg
Target region: global
Key technologies: HDI, special products, protoypes,
quick turnaround business, rigid-flex PCBs
Plant: Chongqing
(under construction)
Key production capability after
completion: IC substrates
Plant: Ansan
Target region: Korea,
Europe
Key technologies:
flexible and rigid-flex
PCBs
Plant: Shanghai
Target region: global
Key technologies: HDI volume
business
Plant: Fehring
Target region: Europe
Key technologies: double-sided,
flexible, semi-flexible, rigid-flex PCBs
Plant: Nanjangud
Target region: Europe, India
Key technologies: double-sided and
multilayer PCBs

10. 9 8
14 13 13
9
20
2006/07 2007/08 2008/09 2009/10 2010/11 2011/12 2012/13
Continuous expansion of IP portfolio
Patent applications
Over 300 R&D employees
Sustainable R&D spend (c. 6% of sales on average)
15% of revenues generated by products launched within
the last three years
Innovation – the foundation for success
R&D as key growth driver Selected R&D Partners
IP portfolio
Current IP portfolio comprises 82 patents and patent
families, most of which secure proprietary production
processes
5 trademarks (ECP ®, 2.5 D ®, Nucleus ®, ALIVH ®, AT&S ®)
Rigorous protection of intellectual property rights
Continuing expansion of patent portfolio
9

11. 10
AT&S – the quality leader of PCB production
Best positioned in highly attractive market
IC-Substrates – the foundation for future success
Mid-term strategy and measures
Investment highlights
Appendix
Agenda
1
2
3
6
4
5

12. On the edge of a new growth cycle
Global PCB turnover ($m)
The PCB Market is a fast growing market
We are just at the beginning of a new growth cycle
Source: Prismark
11

13. 12
Technological leadership and quality focus
HDI PCB manufacturer ranking
Source: Prismark
ATS – Quality leader in PCB manufacturing
Technology leader in the market for high-end
printed circuit boards
Leadership in miniaturisation and integration
AT&S’ high-end interconnection solutions give
customers a decisive competitive edge
Highly innovative solutions implemented with
high process quality on an industrial scale
Environmentally sustainable processes
Quality and efficient management of natural
resources is at the heart of our plants’ setup

14. Size of components continues to decrease
Increased number of applications per area
Further digitalisation in more and more applications
Source: Daimler, Google
13
Benefiting from global megatrends
Source: ifixit
Transistor density to further increase
Source: Wikipedia (Henry‘s law)
Miniaturisation and increase of battery life
Moore’s
law: Every
two years,
the number
of transistors
per chip area
doubles
iPad 1 vs. iPad 2
More and more communication technology is
being integrated into industrial solutions
Increased health consciousness and demographic
change western Europe lead to increased demand for
medical diagnostics and electronic medical devices

15. 14
AT&S – the quality leader of PCB production
Best positioned in highly attractive market
IC-Substrates – the foundation for future success
Mid-term strategy and measures
Investment highlights
Appendix
Agenda
1
2
3
6
4
5

16. IC-Substrates – a logical next step for AT&S
Year Technical Development min. L/S [µm]
Multi Layer
HDI Any Layer
Advanced Packaging
PCB
HDI Micro Via
IC Substrate
100
40
15
25
60
HDI Anylayer +
1982
1998
2005
2010
2014
2016 8
Core Business
AT&S PCB Technology Road Map
New Business
15

17. IC-Substrates in a nutshell
16
Substrate (15µm – 7µm)
PCB (50µm-25µm)
Chip (40nm – 10nm)
Main influencing factors
Performance increase
(Moores Law)
Size reduction PCB
(Trend: Miniaturisation)
1
2
3 Technical parameter (~ 25µm)
(Physical process border)
3
2
1
Mitochondrion – 1µm
DNA – 1nmHair – 100µm
Scale:

18. 17
Main differences
Market size
No. of competitors
Prod-cap. China [%]
Tech. Spec. (L/S)
Quality standards
Level of automation
Entry barriers
PCB Commodity HDI
30.530 M$2011 7.423 M$2011
> 2000 > 50
48% 45%
-40 µm 40 µm
high high
high high
low high
IC Substrate
8.636 M$2011
< 20
5%
10-12 µm
very high
very high
very high
PCB commodity vs. HDI vs. IC-Substrate
Source: Prismark, company estimates

19. IC Substrate market development
IC-Substrates – an attractive niche market
18
2,638
3,025
3,565
4,977
6,467
7,058
6,959
5,911
8,102
8,636
8,230
9,793
10,429
11,106
11,829
0
2,000
4,000
6,000
8,000
10,000
12,000
14,000
02 03 04 05 06 07 08 09 10 11 12e 13e 14e 15e 16e
IC Substrate market [$m] Market characteristics & impact for AT&S
Source: Prismark
17% 16%
16%
16%
15%
16%
38%
36%
34%
32%
29%28%
55% 55% 52% 50% 49% 47%
Closed club of 4-5 players for FC-BGA
substrates
High barriers to entry
Key technology for future density
requirements
For every Dollar invested we expect approx.
1.2 Dollars of revenues p.a.
Higher operational margin expected
compared to HDI technology

20. Requirements AT&S’ USP
Best-positioned to enter IC-Substrates
Highest quality
standards
Quality leadership
First-choice partner for industry leaders
Time-to-market Construction of Chongqing site already started mid 2011
Process
know-how
Technological leadership in high-end PCB production
Know-how synergies from core business and patented chip
embedding technology
Strong industry
partner
Strategic partnership agreement with a major semiconductor
producer
Technological cooperation and supply agreement in place
Ramp-up
experience
Successful track-record of ramp-up in China
Extensive experience in setting up new complex production
processes
19

21. Track-record in setting up high-tech plants
20
The construction status in
Chongqing is a significant
business advantage for
AT&S (time)
High partner involvement
ensures a fast and secure
ramp-up phase
AT&S has a proven track
record in setting up a LCC
plant in China
AT&S has already received
the facility, equipment and
material specifications
AT&S will receive know how
transfer for the material
handling, operational
systems and technology
recipes
Chongqing – Status quo & Roadmap
Control
Equipment Specification
transfer to AT&S

22. 21
AT&S – the quality leader of PCB production
Best positioned in highly attractive market
IC-Substrates – the foundation for future success
Mid-term strategy and measures
Investment highlights
Appendix
Agenda
1
2
3
6
4
5

23. 22
Path for sustainable growth
Strategic focus Upside potential
Continue growth strategy (High-end
Smartphones, Tablets, Ultrabooks, etc.)
Improve GP-Margin (Portfolio management,
Improve plant utilization)
Strategic partnership with MFLEX to produce HDI
rigid-flex PCBs for new applications and designs
Increase revenue in selected market niches
(medical, automotive, etc.)
AT&S to leverage its patented chip embedding
technology with a major industry player
Enter the high margin league for technology
leaders
Estimated Capex for new plant in Chongqing of c.
€ 350m over the next three years
Investment in a new high-end production line in
Shanghai for a substrate technology (“interposer”)
Earlier involvement in
technology development
New high margin business
Org. synergies Chongqing
Earlier involvement in
technology development
Synergies within the high-
margin business
Broader IP portfolio
New business opportunities
NewBusiness
Core
Business

24. 23
AT&S – the quality leader of PCB production
Best positioned in highly attractive market
IC-Substrates – the foundation for future success
Mid-term strategy and measures
Investment highlights
Appendix
Agenda
1
2
3
6
4
5

25. Sustainable growth play
24
Technology leader for high-end PCBs
I
Profitable and sustainably growing market
II
Best positioning vs. Asian competitors
III
Leveraging on technological leadership
IV
Leading innovator in the PCB industry, specialised in integration density & miniaturisation
First choice for top players and quality leaders in each market segment
Highly attractive market with exposure to global key megatrends
Focus on high-quality and thus high-margin markets
Strong production footprint in China is key for cost efficiency and crucial to serve emerging Asian players
Partner of choice for quality components
Advanced Packaging: One of the first manufacturers with a patented chip embedding technology (ECP®)
IC-Substrates: The high-margin segment of the industry

26. 25
AT&S – the quality leader of PCB production
Best positioned in highly attractive market
IC-Substrates – the foundation for future success
Mid-term strategy and measures
Investment highlights
Appendix
Agenda
1
2
3
6
4
5

27. AT&S - Stock Profile
Listing Vienna Stock Exchange, Prime Standard
Indices ATX Prime, WBI
Reuters RIC (A) ATSV.VI
Bloomberg (A) ATS AV
# of shares issued 25.9m
# of shares outstanding 23.3m
Calendar
08.05.13 Release of Annual Results 2012/13
04.07.13 Annual shareholder meeting
25.07.13 Dividend payment date and
ex-dividend date
26

28. AT&S – Diversification
27
Turnover YTD 2012/13 Turnover YTD 2012/13
25%
7%
13%
55%
Austria+Germany
Rest of Europe
Asia
Canada/USA
26%
13%
50%
11%
Austria+Germany
Rest of Europe
Asia
Canada/USA
Distribution of Turnover, Ship to Party Distribution of Turnover by Headquarter

29. Mobile Devices
Seasonality
Very short prodcut life cycles
Higher loading volatility
Short visibility
28
AT&S – Business cyclicality
28
Industrial & Automotive
Longer product life cycles
Medical segment grows by more than 50%
growing prototype business
Automotive segment reports record high turn over
Higher visibility
Distribution of Segment Turnover
in €m
54.7 55.5
75.1
56,2
81.4
47,7
85.8
56.3
69.8
55.9
68.7
59.6
90.7
59.1
0.0
10.0
20.0
30.0
40.0
50.0
60.0
70.0
80.0
90.0
100.0
Mobile Devices Industrial & Automotive
Q1 FY11/12 Q2 FY11/12 Q3 FY11/12 Q4 FY11/12
Q1 FY12/13 Q2 FY12/13 Q3 FY12/13

30. AT&S - Financial performance
In € '000 Q1 - Q3 2012/13 Q1 - Q3 2011/12
CONSOLIDATED INCOME
STATEMENT
Revenues 405,121 371,754
Produced in Asia (in %) 75 72
Produced in Europe (in %) 25 28
EBITDA 74,426 75,913
EBITDA margin (in %) 18.4 20.4
EBIT 20,981 31,644
EBIT margin (in %) 5.2 8.5
Net income 5,439 21,864
Cash Earnings 58,883 66,159
29

31. AT&S – Sound balance sheet
In € '000 31.12.2012 31.12.2011
CONSOLIDATED BALANCE SHEET
Total assets 709,546 722,209
Total equity 289,225 289,293
Net debt 252,143 255,727
Net gearing (in %) 87.2 88.4
Net working capital 120,774 108,184
Net working capital / revenues (in %) 22.4 21.8
Equity ratio (in %) 40.8 40.1
30

32. To find out more – visit www.ats.net
31

33. Disclaimer
32
Despite a diligent preparation of this presentation the information contained herein has not been
independently verified and we assume no liability for the content or any action based on this presentation.
We do not give any warranty, guarantee or commitment, neither explicitly nor implicitly. No reliance should
be placed on the fairness, accuracy, completeness or correctness of this information or opinions contained
herein and neither AT&S nor any of its employees assume responsibility for the completeness or accuracy
of the information contained or not in this presentation. The presentation does not include and does not
constitute or form part of any offer whatsoever, nor does it constitute or form part of any kind of prospectus.
This presentation contains certain forward-looking statements. These are based on management’s views
and assumptions and involve known and unknown risks and uncertainties. Actual results may differ
materially from those projected or implied in such forward-looking statements. Forward-looking information
involves risks and uncertainties that could significantly affect expected results.
This document does not constitute an offer or invitation to purchase or subscribe for any shares and neither
it nor any part of it shall form the basis of or be relied upon in connection with any contract or commitment
whatsoever.